CN109401654B - 一种封装载带基材、双界面载带及其制作方法 - Google Patents

一种封装载带基材、双界面载带及其制作方法 Download PDF

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CN109401654B
CN109401654B CN201710816928.0A CN201710816928A CN109401654B CN 109401654 B CN109401654 B CN 109401654B CN 201710816928 A CN201710816928 A CN 201710816928A CN 109401654 B CN109401654 B CN 109401654B
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copper foil
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resin
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汪青
伍宏奎
吴杰
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Shengyi Technology Co Ltd
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Abstract

公开了一种封装载带基材、双界面载带及其制作方法。本发明的封装载带基材包括一固化片、压合于所述固化片两面上的两胶膜以及压合于一胶膜远离所述固化片侧上的涂树脂铜箔，涂树脂铜箔以涂树脂面与所述一胶膜相对。本发明的双界面载带包括上述的封装载带基材，还包括压合于所述封装载带基材的另一胶膜的铜箔，其中在压合铜箔前，所述涂树脂铜箔、两胶膜以及固化片上冲有通孔。本发明的封装载带基材在后续高温烘烤时不会发粘、不影响操作，可满足双界面应用，并可解决与封装胶黏剂的结合力问题。

Description

一种封装载带基材、双界面载带及其制作方法
技术领域
本发明涉及智能卡制作领域，尤其涉及一种用于芯片封装步骤中用来承载芯片的封装载带基材、双界面载带及其制作方法。
背景技术
智能卡已经在越来越多的领域中体现出优势，其可靠性高，信息不易丢失的特点使其在许多场合逐渐取代磁卡，例如在银行卡、社保卡等领域。
智能卡生产过程中需要一个芯片封装的步骤(即IC封装)，用来承载芯片的材料称为封装载板(对应片式封装工艺)或封装载带(对应卷对卷封装工艺)，卷对卷封装工艺(roll to roll)无疑具有更高的生产效率，(柔性)封装载带也得以迅速发展。
现有柔性封装载带一般为单面封装载带，制作方法为：先用环氧树脂组合物，在上胶机上将1080玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，在复合机上将半固化粘结片的一面与胶膜进行热压，热压后进行冲孔，然后再将胶膜的离型膜去掉，与电解铜箔进行热压，得到柔性的单面封装载带。但是这样的单面封装载带在后续高温烘烤时会发粘，影响操作。
而且，智能卡主要有单界面智能卡和双界面智能卡，其中双界面智能卡由于具有更多的应用场景和模式使得其发展非常迅速。现有的单面封装载带基材已无法满足智能卡的需要，因此需要提供一种柔性封装载带基材，其能克服后续高温烘烤发粘的问题，并可满足智能卡的功能化的要求。
发明内容
本发明的发明人发现，现有封装载带基材采用的处于半固化状态的粘结片是造成后续高温烘烤时发粘、影响操作的原因之一。另外，目前封装载带基材与终端应用的封装胶黏剂的结合力存在问题。因此，本发明的目的之一在于提供一种柔性封装载带基材，其在后续高温烘烤时不会发粘、不影响操作，可满足双界面应用，并可解决与封装胶黏剂的结合力问题。本发明的目的之二在于提供一种双界面载带，其在后续高温烘烤时不会发粘、不影响操作，并可解决与封装胶黏剂的结合力问题。本发明的目的之三在于提供一种上述柔性封装载带基材的制备方法。本发明的目的之四在于提供一种上述双界面载带的制备方法
本发明的上述目的可以通过以下实施方案实现。
一方面，本发明提供一种封装载带基材，其特征在于，所述封装载带基材包括一固化片、压合于所述固化片两面上的两胶膜以及压合于一胶膜远离所述固化片侧上的涂树脂铜箔，涂树脂铜箔以涂树脂面与所述一胶膜相对。
优选地，所述固化片由半固化粘结片完全固化制成，所述半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的热固性树脂组合物，所述热固性树脂组合物包括环氧树脂、不饱和聚酯树脂、有机硅树脂、聚酰亚胺、酚醛树脂体系。
优选地，所述胶膜由橡胶改性环氧胶、丙烯酸胶、聚氨酯胶、热塑性聚酯胶中的一种或多种构成。
优选地，所述涂树脂铜箔由铜箔和涂在其上的热固性树脂组合物组成，所述热固性树脂组合物包括环氧树脂、不饱和聚酯树脂、有机硅树脂、聚酰亚胺、酚醛树脂体系。
另一方面，本发明还提供一种双界面载带，所述双界面载带包括上述的封装载带基材，还包括压合于所述封装载带基材的另一胶膜的铜箔，其中在压合铜箔前，所述涂树脂铜箔、两胶膜以及固化片上冲有通孔。
另一方面，本发明还提供一种制备如上所述的封装载带基材的方法，所述制备方法包括：
步骤1：将热固性树脂组合物浸渍在玻璃纤维布上并烘干溶剂得到半固化粘结片，再将半固化粘结片完全固化得到固化片，另将热固性树脂组合物涂在铜箔毛面上，得到涂树脂铜箔；
步骤2：将固化片的一面与胶膜及涂树脂铜箔以胶膜居中的方式热压并后固化；
步骤3：将固化片的另一面与另一胶膜热压，
另一方面，本发明还提供一种制备如上所述的双界面载带的方法，所述制备方法包括：
步骤1：将热固性树脂组合物浸渍在玻璃纤维布上并烘干溶剂得到半固化粘结片，再将半固化粘结片完全固化得到固化片，另将热固性树脂组合物涂在铜箔毛面上，得到涂树脂铜箔；
步骤2：将固化片的一面与胶膜及涂树脂铜箔以胶膜居中的方式热压并后固化；
步骤3：将固化片的另一面与另一胶膜热压；
步骤4：于厚度方向进行冲孔，形成贯穿所述固化片、两胶膜及所述涂树脂铜箔的通孔；以及
步骤5：在所述固化片的另一面，将铜箔与另一胶膜热压并后固化。
优选地，所述固化片由半固化粘结片在160℃～200℃烘烤0.5h～2.5h完全固化制成。
优选地，所述热压于50℃～150℃的温度及0.1MPa～1MPa的压力条件下进行。
优选地，所述胶膜的后固化在130-180℃烘烤0.5-2小时完成。
本发明可以实现以下技术效果中的至少一种：
(1)本发明的封装载带基材采用完全固化的固化片与胶膜压合，用作智能卡封装用基板时，在后续高温烘烤时不会发粘，从而不影响操作；
(2)本发明的封装载带基材采用涂树脂铜箔(RCC)，使得在终端应用时，封装载带基材与封装胶黏剂具有良好结合力；
(3)本发明的封装载带基材(在完成冲孔及贴铜并完成线路制作后)可满足双界面智能卡应用要求。
附图说明
图1为本发明的封装载带基材的一个结构示意图。
具体实施方式
以下对本发明进行更详细的说明。
1、封装载带基材
本发明的封装载带基材包括一固化片、压合于所述固化片两面上的两胶膜以及压合于一胶膜远离所述固化片侧上的涂树脂铜箔，涂树脂铜箔以涂树脂面与所述一胶膜相对。
图1显示了本发明的封装载带基材的一个结构示意图。如图1所示，封装载带基材100包括一固化片1，固化片1的两面上压合有两胶膜2,2’，其中胶膜2上压合有涂树脂铜箔3，涂树脂铜箔3以涂树脂面与胶膜2相对。固化片1和两胶膜2,2’上可以冲有若干通孔，用于定位或导通。
图1所示仅为本发明封装载带基材的一个最基本结构(单面贴铜的单面封装载带基材)，该封装载带基材还可以在未压合涂树脂铜箔的胶膜(例如图1中的胶膜2’)上压合铜箔或另一涂树脂铜箔，构成可应用于双界面智能卡的双面贴铜的双面封装载带基材(两铜箔上分别可封装一芯片)。此时，其中一铜箔及两铜箔之间的中间层均开设有通孔，封装于有孔的一铜箔上的芯片可以通过一金线穿过通孔而与另一铜箔相连。
下面描述本发明封装载带基材的各个组成部分。
(1)固化片
可用于本发明的固化片由半固化粘结片完全固化制成，所述半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的热固性树脂组合物。
玻璃纤维布可以包括但不限于以下型号的玻璃布：106、1078、1080、3313、2116等。
用于浸渍玻璃纤维布的热固性树脂组合物可以包括环氧树脂、不饱和聚酯树脂、有机硅树脂、聚酰亚胺、酚醛树脂体系，其中优选环氧树脂组合物。
(2)胶膜
可用于本发明的胶膜可以是本领域已知的胶膜。胶膜一般由离型膜及涂覆在其上的胶构成，但在制备封装载带基材的过程中除去离型膜。胶可以为橡胶改性环氧胶、丙烯酸胶、聚氨酯胶、热塑性聚酯胶中的一种或多种构成。
(3)涂树脂铜箔(RCC)
可用于本发明的涂树脂铜箔(RCC)由铜箔和涂在其上的热固性树脂组合物组成，所涂的热固性树脂组合物已经固化处理。
铜箔可以为压延铜箔或电解铜箔。
RCC所用热固性树脂组合物可以为环氧树脂、不饱和聚酯树脂、有机硅树脂、聚酰亚胺、酚醛树脂等，其中优选环氧树脂组合物。RCC所用热固性树脂组合物与上述粘结片所用热固性树脂组合物的种类可以相同或不相同。
2、双界面载带
本发明还提供一种双界面载带，所述双界面载带包括上述的封装载带基材，还包括压合于所述封装载带基材的另一胶膜的铜箔，其中在压合铜箔前，所述涂树脂铜箔、两胶膜以及固化片上冲有通孔。
3、封装载带基材和双界面载带的制备方法
本发明的封装载带基材可以通过以下方法制备：
步骤1：将热固性树脂组合物浸渍在玻璃纤维布上并烘干溶剂得到半固化粘结片，再将半固化粘结片完全固化得到固化片，另将热固性树脂组合物涂在铜箔毛面上，得到涂树脂铜箔；
步骤2：将固化片的一面与胶膜及涂树脂铜箔以胶膜居中的方式热压并后固化(涂树脂铜箔以涂树脂面与胶膜相对)；
步骤3：将固化片的另一面与另一胶膜热压。
本发明的双界面载带可以通过以下方法制备：
步骤1：将热固性树脂组合物浸渍在玻璃纤维布上并烘干溶剂得到半固化粘结片，再将半固化粘结片完全固化得到固化片，另将热固性树脂组合物涂在铜箔毛面上，得到涂树脂铜箔；
步骤2：将固化片的一面与胶膜及涂树脂铜箔以胶膜居中的方式热压并后固化(涂树脂铜箔以涂树脂面与胶膜相对)；
步骤3：将固化片的另一面与另一胶膜热压；
步骤4：于厚度方向进行冲孔，形成贯穿所述固化片、两胶膜及所述涂树脂铜箔的通孔；以及
步骤5：在所述固化片的另一面，将铜箔与另一胶膜热压并后固化。
在上述方法步骤中，半固化粘结片的完全固化可以通过在160℃～200℃烘烤0.5h～2.5h而完成。
热压(包括固化片与胶膜及铜箔或涂树脂铜箔的热压、固化片与胶膜的热压等)可以在50℃～150℃的温度及0.1MPa～1MPa的压力条件下进行。
热压之后的后固化(胶膜的后固化)可以在130-180℃烘烤0.5-2小时完成。
实施例1：
制作：先用酚醛树脂组合物(山东圣泉，PF7000)，在上胶机上将1080玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在190℃烘烤1.5小时得到完全固化的固化片(称为固化片)，另将有机硅树脂组合物涂在铜箔毛面，制成RCC(即涂树脂铜箔)，将固化片、橡胶改性环氧胶膜(生益科技，型号SF315B)、RCC通过热压结合在一起(胶膜是在结构的中间，且去除掉离型膜)，并完成后固化，再在该结构的固化片的另一面与橡胶改性环氧胶膜通过热压结合在一起，制成了封装载带基材。
实施例2：
制作：先用环氧树脂组合物(主组分是双酚A型环氧树脂(迈图，EPIKOTE1001)，还包括固化剂)，在上胶机上将2116玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在190℃烘烤0.05小时得到完全固化的固化片(称为固化片)，另将酚醛树脂组合物涂在铜箔毛面，制成RCC(即涂树脂铜箔)，将固化片、丙烯酸胶膜(东溢新材料，P-B)、RCC通过热压结合在一起(胶膜是在结构的中间，且去除掉离型膜)，并完成后固化，再在该结构的固化片的另一面与丙烯酸胶膜通过热压结合在一起，制成了封装载带基材。
实施例3：
制作：先用有机硅树脂组合物(信越化学，KR-220L)，在上胶机上将3313玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在200℃烘烤2.5小时得到完全固化的固化片(称为固化片)，另将环氧树脂组合物涂在铜箔毛面，制成RCC(即涂树脂铜箔)，将固化片、热塑性聚酯胶膜(生益科技，BIF201)、RCC通过热压结合在一起(胶膜是在结构的中间，且去除掉离型膜)，并完成后固化，再在该结构的固化片的另一面与热塑性聚酯胶膜通过热压结合在一起，制成了封装载带基材。
对比例1：
制作：先用环氧树脂组合物(主组分是双酚A型环氧树脂(迈图，EPIKOTE1001)，还包括固化剂)，在上胶机上将1080玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片的一面或两面与橡胶改性环氧胶膜(生益科技，型号SF315B)(去除掉离型膜)进行热压，制成了封装载带基材。
对比例2：
制作：先用环氧树脂组合物(主组分是双酚A型环氧树脂(迈图，EPIKOTE1001)，还包括固化剂)，在上胶机上将2116玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在190℃烘烤1.5小时得到完全固化的固化片(称为固化片)，再将固化片、丙烯酸胶膜(东溢新材料，P-B)(去除掉离型膜)及铜箔通过热压结合并完成后固化，再在该结构的固化片的另一面与丙烯酸胶膜通过热压结合在一起，制成了封装载带基材。
对比例3：
制作：先用环氧树脂组合物(主组分是双酚A型环氧树脂(迈图，EPIKOTE1001)，还包括固化剂)，在上胶机上将1080玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在190℃烘烤1.5小时得到完全固化的固化片(称为固化片)，另将胶膜用树脂组合物(胶膜配方为橡胶改性环氧胶(生益科技，型号SF315B)，涂在铜箔毛面，制成RCC(即涂树脂铜箔)，将固化片、胶膜、RCC通过热压结合在一起(胶膜是在结构的中间，且去除掉离型膜)，并完成后固化，再在该结构的固化片的另一面与胶膜通过热压结合在一起，制成了封装载带基材。
对上述制作的封装载带基材按照芯片封装(即IC封装)的一般步骤进行后续加工，观察封装载带基材的状态。另外，按照以下方法测试封装载带基材与封装胶黏剂的结合力：将封装载带基材的铜箔蚀刻，然后在蚀刻后的表面滴封装胶黏剂，再经过UV光照设备固化，将材料弯折，如封装胶与材料表面贴合紧密则为合格，如轻松剥离则为不合格。
实施例1、2、3制作的封装载带基材在后续加工操作不发粘，且可满足双界面智能卡封装要求及解决与封装胶黏剂的结合力问题；对比例1在后续高温烘烤时会发粘，影响操作，对比例2和3无法解决与封装胶黏剂的结合力问题。
以上仅为本发明的较佳实施例，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思做出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的范围。
本发明通过上述实施例来说明本发明的详细方法，但本发明并不局限于上述详细方法，即不意味着本发明必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (8)

1.一种封装载带基材，其特征在于，所述封装载带基材包括一固化片、压合于所述固化片两面上的两胶膜以及压合于一胶膜远离所述固化片侧上的涂树脂铜箔，涂树脂铜箔以涂树脂面与所述一胶膜相对，
其中所述胶膜由橡胶改性环氧胶、丙烯酸胶、聚氨酯胶、热塑性聚酯胶中的一种或多种构成，所述涂树脂铜箔由铜箔和涂在其上的热固性树脂组合物组成，所述热固性树脂组合物包括环氧树脂、不饱和聚酯树脂、有机硅树脂、聚酰亚胺、酚醛树脂体系。
2.如权利要求1所述的封装载带基材，其特征在于，所述固化片由半固化粘结片完全固化制成，所述半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的热固性树脂组合物，所述热固性树脂组合物包括环氧树脂、不饱和聚酯树脂、有机硅树脂、聚酰亚胺、酚醛树脂体系。
3.一种双界面载带，其特征在于，所述封装载带包括权利要求1或2所述的封装载带基材，还包括压合于所述封装载带基材的另一胶膜的铜箔，其中在压合铜箔前，所述涂树脂铜箔、两胶膜以及固化片上冲有通孔。
4.一种制备如权利要求1或2所述的封装载带基材的方法，其特征在于，所述制备方法包括：
步骤1：将热固性树脂组合物浸渍在玻璃纤维布上并烘干溶剂得到半固化粘结片，再将半固化粘结片完全固化得到固化片，另将热固性树脂组合物涂在铜箔毛面上，得到涂树脂铜箔；
步骤2：将固化片的一面与胶膜及涂树脂铜箔以胶膜居中的方式热压并后固化；
步骤3：将固化片的另一面与另一胶膜热压。
5.一种制备如权利要求3所述的双界面载带的方法，其特征在于，所述制备方法包括：
步骤1：将热固性树脂组合物浸渍在玻璃纤维布上并烘干溶剂得到半固化粘结片，再将半固化粘结片完全固化得到固化片，另将热固性树脂组合物涂在铜箔毛面上，得到涂树脂铜箔；
步骤2：将固化片的一面与胶膜及涂树脂铜箔以胶膜居中的方式热压并后固化；
步骤3：将固化片的另一面与另一胶膜热压；
步骤4：于厚度方向进行冲孔，形成贯穿所述固化片、两胶膜及所述涂树脂铜箔的通孔；以及
步骤5：在所述固化片的另一面，将铜箔与另一胶膜热压并后固化。
6.如权利要求4或权利要求5所述的方法，其特征在于，所述固化片由半固化粘结片在160℃～200℃烘烤0.5h～2.5h完全固化制成。
7.如权利要求4或权利要求5所述的方法，其特征在于，所述热压于50℃～150℃的温度及0.1MPa～1MPa的压力条件下进行。
8.如权利要求4或权利要求5所述的方法，其特征在于，所述胶膜的后固化在130-180℃烘烤0.5-2小时完成。
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CN110562603A (zh) * 2019-09-16 2019-12-13 昆山新贝斯特电子包装材料有限公司 一种高强度载带及其制造方法
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102543899A (zh) * 2011-12-28 2012-07-04 广东生益科技股份有限公司 柔性封装基板及其制作方法
CN102775735A (zh) * 2012-08-15 2012-11-14 广东生益科技股份有限公司 无卤树脂组合物及使用其制备的涂树脂铜箔与覆铜箔层压板
CN202965394U (zh) * 2012-12-05 2013-06-05 昆山雅森电子材料科技有限公司 用于印刷电路板的涂树脂铜箔
CN204894661U (zh) * 2015-06-08 2015-12-23 广东生益科技股份有限公司 一种电路基板用预浸夹心结构体及由其制备的电路基板、印刷电路板
CN105348732A (zh) * 2015-09-15 2016-02-24 广东生益科技股份有限公司 电路基板及其制备方法
CN106696395A (zh) * 2016-12-23 2017-05-24 广东生益科技股份有限公司 一种柔性双面封装基板及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102543899A (zh) * 2011-12-28 2012-07-04 广东生益科技股份有限公司 柔性封装基板及其制作方法
CN102775735A (zh) * 2012-08-15 2012-11-14 广东生益科技股份有限公司 无卤树脂组合物及使用其制备的涂树脂铜箔与覆铜箔层压板
CN202965394U (zh) * 2012-12-05 2013-06-05 昆山雅森电子材料科技有限公司 用于印刷电路板的涂树脂铜箔
CN204894661U (zh) * 2015-06-08 2015-12-23 广东生益科技股份有限公司 一种电路基板用预浸夹心结构体及由其制备的电路基板、印刷电路板
CN105348732A (zh) * 2015-09-15 2016-02-24 广东生益科技股份有限公司 电路基板及其制备方法
CN106696395A (zh) * 2016-12-23 2017-05-24 广东生益科技股份有限公司 一种柔性双面封装基板及其制备方法

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