CN106696395B - 一种柔性双面封装基板及其制备方法 - Google Patents

一种柔性双面封装基板及其制备方法 Download PDF

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CN106696395B
CN106696395B CN201611204532.2A CN201611204532A CN106696395B CN 106696395 B CN106696395 B CN 106696395B CN 201611204532 A CN201611204532 A CN 201611204532A CN 106696395 B CN106696395 B CN 106696395B
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copper foil
package substrate
glue
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汪青
刘东亮
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Shengyi Technology Co Ltd
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Abstract

本发明涉及智能卡制作领域，尤其涉及一种柔性双面封装基板，所述柔性双面封装基板包括相互压合的一固化片、两胶膜以及两铜箔，两所述胶膜分别位于所述固化片的两面，两所述铜箔分别位于两所述胶膜上，所述固化片、两所述胶膜及其中一所述铜箔上冲有通孔。本发明还提供一种制作该柔性双面封装基板的方法，该柔性双面封装基板在后续高温烘烤时不会发粘、不影响操作，还可满足双界面应用。

Description

一种柔性双面封装基板及其制备方法
技术领域
本发明涉及智能卡制作领域，尤其涉及一种柔性双面封装基板及其制备方法。
背景技术
智能卡已经在越来越多的领域中体现出优势，其可靠性高，信息不易丢失的特点使其在许多场合将逐渐取代磁卡，例如在银行卡、社保卡等领域。
智能卡生产过程中需要一个芯片封装的步骤(即IC封装)，用来承载芯片的PCB板即为封装载板。封装载板的生产可以是panel-panel(即一块板一块板地封装)的工艺，也可以是roll-roll(即卷对卷地封装)的工艺，而后者无疑具有更高的生产效率。用于roll-roll工艺生产的基材即为柔性基板。
柔性基板可以带来非常多的应用：
1、内部引线接合：不用手指接触的独立构造的表面；
2、键合连接：用于高端应用的高集成的加工设备；
3、倒装芯片连接：不需要附加的模塑保护。环氧玻璃纤维或者底下填充物将会增强键合的机械强度；
4、制造流程简化：被封装的IC可以测试，高温封装，最后从带子上切割下来，之后再封装到扁平的卡片上；
5、高精度：冲压和粘合技术能适应于非常严格的公差要求以及非常好的结构，非常适合高集成的复杂封装；
6、可键合的(金、铜、硅铝线)，可焊接的接触表面；
7、焊接的防水性；
8、低模块厚度；适用于热管理和温度散发。
现有柔性封装基板均为单面封装基板，制作方法为：先用环氧树脂组合物，在上胶机上将1080玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，在复合机上将半固化粘结片的一面与胶膜进行热压，热压后进行冲孔，然后再将胶膜的离型膜去掉，与电解铜箔进行热压，得到柔性的单面封装基板。由于粘结片处于半固化状态，在后续高温烘烤时会发粘，影响操作。
而且，随着智能卡的功能化，单面封装基板已无法满足现有的需要，因此需要提供一种柔性双面封装基板。
发明内容
本发明的目的之一在于提供一种柔性双面封装基板，其在后续高温烘烤时不会发粘、不影响操作，还可满足双界面应用；本发明的目的之二在于提供一种上述柔性双面封装基板的制备方法。
为实现该目的，本发明提供一种柔性双面封装基板，所述柔性双面封装基板包括相互压合的一固化片、两胶膜以及两铜箔，两所述胶膜分别位于所述固化片的两面，两所述铜箔分别位于两所述胶膜上，所述固化片、两所述胶膜及其中一所述铜箔上冲有通孔。
较佳地，所述固化片由半固化粘结片完全固化制成。
较佳地，所述半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的树脂组合物，所述玻璃纤维布选自以下型号中的至少一种：106、1078、1080、3313、2116，所述树脂组合物为环氧树脂体系。
较佳地，所述胶膜由环氧胶、丙烯酸胶或聚酯胶制成，所述铜箔为压延铜箔或电解铜箔。
本发明还提供一种制备如上所述的柔性双面封装基板的方法，所述制备方法包括：
(1)将一固化片的一面与一胶膜热压；
(2)将所述胶膜与一铜箔热压并后固化；
(3)将所述固化片的另一面与另一胶膜热压；
(4)于厚度方向进行冲孔，形成贯穿所述固化片、两所述胶膜及一所述铜箔的通孔；以及
(5)将另一铜箔与另一所述胶膜热压并后固化，制得所述柔性双面封装基板。
较佳地，所述固化片由半固化粘结片在160℃～200℃烘烤0.5h～2.5h完全固化制成。
较佳地，所述半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的树脂组合物，玻璃纤维布选自以下型号中的至少一种：106、1078、1080、3313、2116，所述树脂组合物为环氧树脂体系。
较佳地，所述胶膜为涂覆于一离型膜上的环氧胶、丙烯酸胶或聚酯胶，所述铜箔为压延铜箔或电解铜箔。
较佳地，所述步骤(1)～(3)及步骤(5)中的所述热压于50℃～150℃的温度及0.1MPa～1MPa的压力条件下进行。
较佳地，所述步骤(2)及步骤(5)中的所述后固化是于150℃～180℃的温度条件下烘烤0.5h～1.5h。
现有技术相比，本发明具有如下有益效果：
本发明的柔性双面封装基板采用完全固化的固化片与胶膜压合，用作智能卡封装用基板时，在后续高温烘烤时不会发粘，从而不影响操作。
本发明的柔性双面封装基板具有5层结构，包括有两铜箔，两铜箔上分别可封装一芯片，其中一铜箔及两铜箔之间的中间层均开设有通孔，封装于有孔的一铜箔上的芯片通过一金线穿过通孔而与另一铜箔相连。因此，本发明如此结构的柔性双面封装基板可满足双界面智能卡封装的需求。
附图说明
图1为本发明柔性双面封装基板的示意图。
具体实施方式
本发明旨在提供一种柔性双面封装基板1的结构及其制备方法，其在后续高温烘烤时不会发粘、不影响操作，还可满足双界面应用。
如图1所示，柔性双面封装基板1包括相互压合的一固化片10、两胶膜20(包括21和23)以及两铜箔30(包括31和33)，两胶膜20分别位于固化片10的两面，两铜箔30分别位于两胶膜20上，固化片10、两胶膜20及其中一铜箔31上冲有若干通孔40。
更具体地，制备如上的柔性双面封装基板1的方法包括：
(1)提供半固化粘结片，在160℃～200℃烘烤0.5h～2.5h完全固化制成固化片10，将该固化片10的一面与一胶膜21热压；其中，胶膜20为涂覆于一离型膜上的环氧胶、丙烯酸胶或聚酯胶，半固化粘结片的固化温度可选择为160℃、170℃、180℃、190℃或200℃等，其烘烤时间可选择为0.5h、0.6h、0.7h、0.8h、0.9h、1.0h、1.1h、1.2h、1.3h、1.4h、1.5h、1.6h、1.7h、1.8h、1.9h、2.0h、2.1h、2.2h、2.3h、2.4h或2.5h等；
(2)撕去胶膜21上的离型膜，将胶膜21与一铜箔31热压并后固化；其中，铜箔30为压延铜箔或电解铜箔；
(3)将固化片10的另一面与另一胶膜23热压；
(4)于厚度方向进行冲孔，形成贯穿固化片10、两胶膜20及一铜箔31的通孔40；以及
(5)撕去胶膜23上的离型膜，将另一铜箔33与胶膜23热压并后固化，制得柔性双面封装基板1。
较佳地，半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的树脂组合物，玻璃纤维布选自以下型号中的至少一种：106、1078、1080、3313、2116，树脂组合物为环氧树脂体系。
较佳地，步骤(1)～(3)及步骤(5)中的热压于50℃～150℃的温度及0.1MPa～1MPa的压力条件下进行，其中，热压温度可选择为50℃、60℃、70℃、80℃、90℃、100℃、110℃、120℃、130℃、140℃或150℃等；热压压力可选择为0.1MPa、0.2MPa、0.3MPa、0.4MPa、0.5MPa、0.6MPa、0.7MPa、0.8MPa、0.9MPa或1.0MPa等。
较佳地，步骤(2)及步骤(5)中的后固化是于150℃～180℃的温度条件下烘烤0.5h～1.5h，其中，后固化温度可选择为150℃、160℃、170℃或180℃等，烘烤时间可选择为0.5h、0.6h、0.7h、0.8h、0.9h、1.0h、1.1h、1.2h、1.3h、1.4h或1.5h等。
实施例1：
制作：先用环氧树脂组合物，在上胶机上将1080玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在190℃烘烤1.5小时得到完全固化的固化片10，然后将固化片10的一面先与一胶膜21热压后再与一铜箔31热压并后固化，再将固化片10的另一面与另一胶膜23热压结合在一起，后对该材料整体进行冲孔处理，最后将冲孔后的材料的胶膜23表面与另一铜箔33热压结合在一起并后固化，制成了可满足双界面应用的柔性双面封装基板1。
实施例2：
制作：先用环氧树脂组合物，在上胶机上将2116玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在190℃烘烤1.5小时得到完全固化的固化片10，然后将固化片10的一面先与一胶膜21热压后再与铜箔31热压并后固化，再将固化片10的另一面与另一胶膜23热压结合在一起，后对该材料整体进行冲孔处理，最后将冲孔后的材料的胶膜23表面与另一铜箔33热压结合在一起并后固化，制成了可满足双界面应用的柔性双面封装基板1。
实施例3：
制作：先用环氧树脂组合物，在上胶机上将3313玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，然后将半固化粘结片在190℃烘烤1.5小时得到完全固化的固化片10，然后将固化片10的一面先与一胶膜21热压后再与铜箔31热压并后固化，再将固化片10的另一面与另一胶膜23热压结合在一起，后对该材料整体进行冲孔处理，最后将冲孔后的材料的胶膜23表面与另一铜箔33热压结合在一起并后固化，制成了可满足双界面应用的柔性双面封装基板1。
对比例1：
制作：先用环氧树脂组合物，在上胶机上将1080玻璃纤维布浸渍，然后经过上胶机的烘箱得到半固化粘结片，在复合机上将半固化粘结片的一面与胶膜进行热压，热压后进行冲孔，然后再与电解铜箔进行热压，制得柔性单面封装基板。
实施例1、2、3均可制作智能卡封装用基板，后续加工操作不发粘，且可满足双界面智能卡封装要求；对比例1由于粘结片处于半固化状态，在后续高温烘烤时会发粘，影响操作，且无法满足后续芯片双面贴装要求。
现有技术相比，本发明具有如下有益效果：
本发明的柔性双面封装基板1采用完全固化的固化片10与胶膜20压合，用作智能卡封装用基板时，在后续高温烘烤时不会发粘，从而不影响操作。
本发明的柔性双面封装基板1具有5层结构，包括有两铜箔30，两铜箔30上分别可封装一芯片，其中一铜箔31及两铜箔30之间的中间层均开设有通孔40，封装于有孔的一铜箔31上的芯片通过一金线穿过通孔40而与另一铜箔33相连。因此，本发明如此结构的柔性双面封装基板1可满足双界面智能卡封装的需求。
以上，仅为本发明的较佳实施例，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思做出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的范围。
本发明通过上述实施例来说明本发明的详细方法，但本发明并不局限于上述详细方法，即不意味着本发明必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (10)

1.一种柔性双面封装基板的制备方法，其特征在于，所述制备方法包括：
(1)将一固化片的一面与一胶膜热压；
(2)将所述胶膜与一铜箔热压并后固化；
(3)将所述固化片的另一面与另一胶膜热压；
(4)于厚度方向进行冲孔，形成贯穿所述固化片、两所述胶膜及一所述铜箔的通孔；以及
(5)将另一铜箔与另一所述胶膜热压并后固化，封装于有所述通孔的一所述铜箔上的芯片通过一金线穿过所述通孔而与另一所述铜箔相连，制得所述柔性双面封装基板。
2.如权利要求1所述的制备方法，其特征在于，所述固化片由半固化粘结片在160℃～200℃烘烤0.5h～2.5h完全固化制成。
3.如权利要求2所述的制备方法，其特征在于，所述半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的树脂组合物，玻璃纤维布选自以下型号中的至少一种：106、1078、1080、3313、2116，所述树脂组合物为环氧树脂体系。
4.如权利要求1所述的制备方法，其特征在于，所述胶膜为涂覆于一离型膜上的环氧胶、丙烯酸胶或聚酯胶，所述铜箔为压延铜箔或电解铜箔。
5.如权利要求1所述的制备方法，其特征在于，所述热压于50℃～150℃的温度及0.1MPa～1MPa的压力条件下进行。
6.如权利要求1所述的制备方法，其特征在于，所述步骤(2)及步骤(5)中的所述后固化是于150℃～180℃的温度条件下烘烤0.5h～1.5h。
7.一种柔性双面封装基板，其特征在于，所述柔性双面封装基板由权利要求1～6任一项的制备方法制备而成，所述柔性双面封装基板包括相互压合的一固化片、两胶膜以及两铜箔，两所述胶膜分别位于所述固化片的两面，两所述铜箔分别位于两所述胶膜上，所述固化片、两所述胶膜及其中一所述铜箔上冲有通孔，封装于有所述通孔的一所述铜箔上的芯片通过一金线穿过所述通孔而与另一所述铜箔相连。
8.如权利要求7所述的柔性双面封装基板，其特征在于，所述固化片由半固化粘结片完全固化制成。
9.如权利要求8所述的柔性双面封装基板，其特征在于，所述半固化粘结片包括玻璃纤维布及浸润于玻璃纤维布上的树脂组合物，所述玻璃纤维布选自以下型号中的至少一种：106、1078、1080、3313、2116，所述树脂组合物为环氧树脂体系。
10.如权利要求7所述的柔性双面封装基板，其特征在于，所述胶膜由环氧胶、丙烯酸胶或聚酯胶制成，所述铜箔为压延铜箔或电解铜箔。
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