JPWO2020100400A1 - 真空処理装置 - Google Patents
真空処理装置 Download PDFInfo
- Publication number
- JPWO2020100400A1 JPWO2020100400A1 JP2020556638A JP2020556638A JPWO2020100400A1 JP WO2020100400 A1 JPWO2020100400 A1 JP WO2020100400A1 JP 2020556638 A JP2020556638 A JP 2020556638A JP 2020556638 A JP2020556638 A JP 2020556638A JP WO2020100400 A1 JPWO2020100400 A1 JP WO2020100400A1
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- protective plate
- vacuum
- block body
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 238000009489 vacuum treatment Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 239000003507 refrigerant Substances 0.000 claims description 20
- 239000007789 gas Substances 0.000 description 27
- 238000004544 sputter deposition Methods 0.000 description 26
- 239000010408 film Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 16
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 230000007123 defense Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000112 cooling gas Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
- H01J37/32504—Means for preventing sputtering of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
Claims (3)
- 真空チャンバを有してこの真空チャンバ内にセットされた被処理基板に対して所定の真空処理を施す真空処理装置であって、真空チャンバ内に防着板が設けられ、防着板が真空チャンバに固定配置される固定防着板と一方向に移動自在な可動防着板とで構成されるものにおいて、
真空チャンバの内壁面に立設された金属製のブロック体と、ブロック体を冷却する冷却手段とを更に備え、被成膜基板に対して所定の真空処理を施す可動防着板の処理位置にて、ブロック体の頂面が可動防着板に近接または当接するようにしたことを特徴とする真空処理装置。 - 前記冷却手段が真空チャンバの壁面に設けたジャケットで構成され、ジャケットに冷媒を循環させたときの真空チャンバの壁面からの伝熱で前記ブロック体が冷却されるように構成したことを特徴とする請求項1または請求項2記載の真空処理装置。
- 真空チャンバの内壁面とブロック体との間に介在された熱伝導シートを更に備えることを特徴とする請求項2記載の真空処理装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018215816 | 2018-11-16 | ||
JP2018215816 | 2018-11-16 | ||
PCT/JP2019/035869 WO2020100400A1 (ja) | 2018-11-16 | 2019-09-12 | 真空処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020100400A1 true JPWO2020100400A1 (ja) | 2021-09-24 |
JP7057442B2 JP7057442B2 (ja) | 2022-04-19 |
Family
ID=70731861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020556638A Active JP7057442B2 (ja) | 2018-11-16 | 2019-09-12 | 真空処理装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11923178B2 (ja) |
JP (1) | JP7057442B2 (ja) |
KR (1) | KR102533330B1 (ja) |
CN (1) | CN113056572B (ja) |
TW (1) | TWI742431B (ja) |
WO (1) | WO2020100400A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI765213B (zh) * | 2019-01-23 | 2022-05-21 | 大陸商北京北方華創微電子裝備有限公司 | 內襯冷卻組件、反應腔室及半導體加工設備 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005060757A (ja) * | 2003-08-11 | 2005-03-10 | Ulvac Japan Ltd | 成膜装置、及び成膜方法 |
JP2005336572A (ja) * | 2004-05-28 | 2005-12-08 | Tsukishima Kikai Co Ltd | 蒸着装置 |
JP2011127136A (ja) * | 2009-12-15 | 2011-06-30 | Canon Anelva Corp | スパッタリング装置および、該スパッタリング装置を用いた半導体デバイスの製造方法 |
WO2014103168A1 (ja) * | 2012-12-26 | 2014-07-03 | キヤノンアネルバ株式会社 | 基板処理装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2967784B2 (ja) * | 1989-12-11 | 1999-10-25 | キヤノン株式会社 | 堆積膜形成方法及びその装置 |
JPH0586475A (ja) * | 1990-10-23 | 1993-04-06 | Nec Home Electron Ltd | 真空成膜装置 |
JPH07150353A (ja) * | 1994-07-18 | 1995-06-13 | Hitachi Ltd | 真空処理装置及びそれを用いた成膜装置と成膜方法 |
JP2000073162A (ja) | 1998-08-26 | 2000-03-07 | Victor Co Of Japan Ltd | 蒸着装置 |
US6477980B1 (en) * | 2000-01-20 | 2002-11-12 | Applied Materials, Inc. | Flexibly suspended gas distribution manifold for plasma chamber |
JP2005330509A (ja) * | 2004-05-18 | 2005-12-02 | Seiko Epson Corp | 薄膜形成装置、薄膜形成方法、電気光学装置の製造方法、電気光学装置、及び電子機器 |
JP5149285B2 (ja) * | 2009-03-02 | 2013-02-20 | キヤノンアネルバ株式会社 | スパッタリングにより成膜する磁気デバイスの製造装置及び磁気デバイスの製造方法 |
JP5563347B2 (ja) * | 2010-03-30 | 2014-07-30 | 東京エレクトロン株式会社 | プラズマ処理装置及び半導体装置の製造方法 |
KR101573665B1 (ko) * | 2010-10-06 | 2015-12-01 | 가부시키가이샤 알박 | 유전체 성막 장치 및 유전체 성막 방법 |
JP5604525B2 (ja) * | 2010-10-06 | 2014-10-08 | 株式会社アルバック | 真空処理装置 |
JP2013105949A (ja) * | 2011-11-15 | 2013-05-30 | Ulvac Japan Ltd | 表面波プラズマ処理装置 |
JP6007070B2 (ja) | 2012-11-06 | 2016-10-12 | 株式会社アルバック | スパッタリング方法及びスパッタリング装置 |
JP5956611B2 (ja) * | 2012-12-20 | 2016-07-27 | キヤノンアネルバ株式会社 | スパッタリング方法および機能素子の製造方法 |
US20140356985A1 (en) * | 2013-06-03 | 2014-12-04 | Lam Research Corporation | Temperature controlled substrate support assembly |
JP6140539B2 (ja) * | 2013-06-13 | 2017-05-31 | 株式会社アルバック | 真空処理装置 |
CN107406973A (zh) * | 2015-01-19 | 2017-11-28 | 欧瑞康表面解决方案股份公司,普费菲孔 | 用于提高热输出的带有特别设计的真空腔 |
JP6171108B2 (ja) * | 2015-02-25 | 2017-07-26 | 株式会社アルバック | 成膜装置及び成膜方法 |
SG11201709089YA (en) * | 2015-05-22 | 2017-12-28 | Ulvac Inc | Magnetron sputtering apparatus |
JP6616192B2 (ja) * | 2016-01-06 | 2019-12-04 | 株式会社アルバック | 成膜方法 |
JP7027057B2 (ja) | 2017-07-18 | 2022-03-01 | 株式会社アルバック | 基板搬送装置 |
JP7223738B2 (ja) * | 2020-11-12 | 2023-02-16 | 株式会社アルバック | スパッタリング装置 |
-
2019
- 2019-09-12 WO PCT/JP2019/035869 patent/WO2020100400A1/ja active Application Filing
- 2019-09-12 CN CN201980075427.9A patent/CN113056572B/zh active Active
- 2019-09-12 US US17/272,861 patent/US11923178B2/en active Active
- 2019-09-12 JP JP2020556638A patent/JP7057442B2/ja active Active
- 2019-09-12 KR KR1020217017048A patent/KR102533330B1/ko active IP Right Grant
- 2019-09-18 TW TW108133509A patent/TWI742431B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005060757A (ja) * | 2003-08-11 | 2005-03-10 | Ulvac Japan Ltd | 成膜装置、及び成膜方法 |
JP2005336572A (ja) * | 2004-05-28 | 2005-12-08 | Tsukishima Kikai Co Ltd | 蒸着装置 |
JP2011127136A (ja) * | 2009-12-15 | 2011-06-30 | Canon Anelva Corp | スパッタリング装置および、該スパッタリング装置を用いた半導体デバイスの製造方法 |
WO2014103168A1 (ja) * | 2012-12-26 | 2014-07-03 | キヤノンアネルバ株式会社 | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20210087076A (ko) | 2021-07-09 |
TWI742431B (zh) | 2021-10-11 |
US11923178B2 (en) | 2024-03-05 |
WO2020100400A1 (ja) | 2020-05-22 |
JP7057442B2 (ja) | 2022-04-19 |
CN113056572A (zh) | 2021-06-29 |
KR102533330B1 (ko) | 2023-05-17 |
US20210319985A1 (en) | 2021-10-14 |
CN113056572B (zh) | 2023-09-05 |
TW202020221A (zh) | 2020-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20120074210A (ko) | 플라즈마 처리 장치 | |
JP7057442B2 (ja) | 真空処理装置 | |
US20210079514A1 (en) | Sputtering Method and Sputtering Apparatus | |
TWI739138B (zh) | 真空處理裝置 | |
JP7078752B2 (ja) | 真空処理装置 | |
JP6871067B2 (ja) | スパッタリング装置 | |
TWI781338B (zh) | 真空處理裝置 | |
JP6088780B2 (ja) | プラズマ処理方法及びプラズマ処理装置 | |
JP3157551B2 (ja) | 被処理体用載置装置及びそれを用いた処理装置 | |
JP7290413B2 (ja) | 真空処理装置 | |
JP2022014978A (ja) | スパッタリング装置及び金属化合物膜の成膜方法 | |
TW201903180A (zh) | 濺鍍裝置 | |
JPH10158832A (ja) | コリメートスパッタ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210301 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210301 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220322 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220407 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7057442 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |