JPWO2020059485A5 - - Google Patents
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- Publication number
- JPWO2020059485A5 JPWO2020059485A5 JP2019548752A JP2019548752A JPWO2020059485A5 JP WO2020059485 A5 JPWO2020059485 A5 JP WO2020059485A5 JP 2019548752 A JP2019548752 A JP 2019548752A JP 2019548752 A JP2019548752 A JP 2019548752A JP WO2020059485 A5 JPWO2020059485 A5 JP WO2020059485A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- resin composition
- composition according
- photosensitive
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000011342 resin composition Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 7
- 125000005843 halogen group Chemical group 0.000 claims description 7
- 239000005011 phenolic resin Substances 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- -1 methylol group Chemical group 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 150000002430 hydrocarbons Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 125000004849 alkoxymethyl group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 150000001721 carbon Chemical class 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 10
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000011229 interlayer Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000011241 protective layer Substances 0.000 claims 2
- 239000004962 Polyamide-imide Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 125000006575 electron-withdrawing group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 229920002312 polyamide-imide Polymers 0.000 claims 1
- 229920002577 polybenzoxazole Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018173426 | 2018-09-18 | ||
| JP2018173426 | 2018-09-18 | ||
| PCT/JP2019/034699 WO2020059485A1 (ja) | 2018-09-18 | 2019-09-04 | 感光性樹脂組成物、樹脂シート、硬化膜、有機ｅｌ表示装置、半導体電子部品、半導体装置、および有機ｅｌ表示装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020059485A1 JPWO2020059485A1 (ja) | 2021-08-30 |
| JPWO2020059485A5 true JPWO2020059485A5 (https=) | 2022-08-09 |
| JP7272268B2 JP7272268B2 (ja) | 2023-05-12 |
Family
ID=69888460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019548752A Active JP7272268B2 (ja) | 2018-09-18 | 2019-09-04 | 感光性樹脂組成物、樹脂シート、硬化膜、有機ｅｌ表示装置、半導体電子部品、半導体装置、および有機ｅｌ表示装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11852973B2 (https=) |
| JP (1) | JP7272268B2 (https=) |
| KR (1) | KR102687870B1 (https=) |
| CN (1) | CN112654927B (https=) |
| TW (1) | TWI811446B (https=) |
| WO (1) | WO2020059485A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230096472A1 (en) * | 2020-02-20 | 2023-03-30 | Sumitomo Bakelite Co., Ltd. | Method for manufacturing photosensitive resin composition |
| JPWO2023032803A1 (https=) * | 2021-08-30 | 2023-03-09 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH048817A (ja) * | 1990-04-25 | 1992-01-13 | Kubota Corp | トラクタのエンジン排気装置 |
| JPH1048817A (ja) * | 1996-08-02 | 1998-02-20 | Mitsui Petrochem Ind Ltd | 平板印刷用感光性樹脂組成物およびそれを用いた感光性平板印刷板 |
| JP4257480B2 (ja) * | 1999-09-29 | 2009-04-22 | 信越化学工業株式会社 | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 |
| JP4982927B2 (ja) | 2000-06-28 | 2012-07-25 | 東レ株式会社 | 表示装置 |
| JP2002055446A (ja) * | 2000-08-11 | 2002-02-20 | Fuji Photo Film Co Ltd | 平版印刷版原版 |
| JP2004219813A (ja) * | 2003-01-16 | 2004-08-05 | Mitsubishi Electric Corp | 感光性樹脂組成物 |
| JP2004226472A (ja) * | 2003-01-20 | 2004-08-12 | Fuji Photo Film Co Ltd | 平版印刷版原版 |
| JP5061703B2 (ja) | 2007-04-25 | 2012-10-31 | 東レ株式会社 | 感光性樹脂組成物 |
| JP2009009110A (ja) * | 2007-05-30 | 2009-01-15 | Sumitomo Bakelite Co Ltd | 感光性接着剤樹脂組成物、接着フィルムおよび受光装置 |
| JP2008297540A (ja) * | 2008-04-14 | 2008-12-11 | Sumitomo Bakelite Co Ltd | 感光性接着剤樹脂組成物、接着フィルムおよび受光装置 |
| SG11201504647VA (en) | 2012-12-20 | 2015-07-30 | Toray Industries | Photosensitive resin composition, method for producing heat-resistant resin film and display device |
| KR102159234B1 (ko) * | 2013-02-08 | 2020-09-23 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 레지스트 조성물, 레지스트 패턴 형성방법 및 이것에 이용하는 폴리페놀 유도체 |
| JP6451065B2 (ja) | 2014-03-27 | 2019-01-16 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置 |
| JP6502885B2 (ja) | 2015-05-18 | 2019-04-17 | 信越化学工業株式会社 | レジスト下層膜材料及びパターン形成方法 |
| JP2017138495A (ja) * | 2016-02-04 | 2017-08-10 | 日立化成株式会社 | 感光性樹脂組成物を用いた光導波路の製造方法 |
| KR102341494B1 (ko) * | 2016-11-02 | 2021-12-23 | 도레이 카부시키가이샤 | 수지 조성물, 수지 시트, 경화막, 유기 el 표시 장치, 반도체 전자 부품, 반도체 장치 및 유기 el 표시 장치의 제조 방법 |
-
2019
- 2019-09-04 JP JP2019548752A patent/JP7272268B2/ja active Active
- 2019-09-04 WO PCT/JP2019/034699 patent/WO2020059485A1/ja not_active Ceased
- 2019-09-04 KR KR1020217005335A patent/KR102687870B1/ko active Active
- 2019-09-04 US US17/273,401 patent/US11852973B2/en active Active
- 2019-09-04 CN CN201980057501.4A patent/CN112654927B/zh active Active
- 2019-09-10 TW TW108132604A patent/TWI811446B/zh active
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