JPWO2020023953A5 - - Google Patents
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- Publication number
- JPWO2020023953A5 JPWO2020023953A5 JP2021527030A JP2021527030A JPWO2020023953A5 JP WO2020023953 A5 JPWO2020023953 A5 JP WO2020023953A5 JP 2021527030 A JP2021527030 A JP 2021527030A JP 2021527030 A JP2021527030 A JP 2021527030A JP WO2020023953 A5 JPWO2020023953 A5 JP WO2020023953A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- platinum
- aluminum
- etching
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 104
- 239000010410 layer Substances 0.000 claims 84
- 238000000034 method Methods 0.000 claims 65
- 229910052697 platinum Inorganic materials 0.000 claims 52
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 31
- 229910052782 aluminium Inorganic materials 0.000 claims 24
- 238000005530 etching Methods 0.000 claims 15
- 229920002120 photoresistant polymer Polymers 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 14
- 238000000151 deposition Methods 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 9
- 229910001260 Pt alloy Inorganic materials 0.000 claims 8
- 229910045601 alloy Inorganic materials 0.000 claims 8
- 239000000956 alloy Substances 0.000 claims 8
- 229910000838 Al alloy Inorganic materials 0.000 claims 7
- 238000000059 patterning Methods 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 238000004544 sputter deposition Methods 0.000 claims 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 3
- 238000000137 annealing Methods 0.000 claims 3
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 claims 3
- 229910017604 nitric acid Inorganic materials 0.000 claims 3
- 239000007921 spray Substances 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 229910052681 coesite Inorganic materials 0.000 claims 2
- 229910052906 cristobalite Inorganic materials 0.000 claims 2
- 239000012299 nitrogen atmosphere Substances 0.000 claims 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 229910052682 stishovite Inorganic materials 0.000 claims 2
- 229910052905 tridymite Inorganic materials 0.000 claims 2
- 238000007740 vapor deposition Methods 0.000 claims 2
- 238000001039 wet etching Methods 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 239000012298 atmosphere Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024033639A JP2024072836A (ja) | 2018-07-27 | 2024-03-06 | マイクロ電子デバイス |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862703937P | 2018-07-27 | 2018-07-27 | |
| US62/703,937 | 2018-07-27 | ||
| US16/523,867 | 2019-07-26 | ||
| US16/523,867 US11011381B2 (en) | 2018-07-27 | 2019-07-26 | Patterning platinum by alloying and etching platinum alloy |
| PCT/US2019/043850 WO2020023953A1 (en) | 2018-07-27 | 2019-07-29 | Patterning platinum by alloying and etching platinum alloy |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024033639A Division JP2024072836A (ja) | 2018-07-27 | 2024-03-06 | マイクロ電子デバイス |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021531415A JP2021531415A (ja) | 2021-11-18 |
| JP2021531415A5 JP2021531415A5 (https=) | 2022-08-04 |
| JPWO2020023953A5 true JPWO2020023953A5 (https=) | 2022-08-04 |
| JP7476442B2 JP7476442B2 (ja) | 2024-05-01 |
Family
ID=69178612
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021527030A Active JP7476442B2 (ja) | 2018-07-27 | 2019-07-29 | 合金化すること及びプラチナ合金をエッチングすることによるプラチナのパターン化 |
| JP2024033639A Pending JP2024072836A (ja) | 2018-07-27 | 2024-03-06 | マイクロ電子デバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024033639A Pending JP2024072836A (ja) | 2018-07-27 | 2024-03-06 | マイクロ電子デバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11011381B2 (https=) |
| EP (1) | EP3830862A4 (https=) |
| JP (2) | JP7476442B2 (https=) |
| KR (2) | KR102646859B1 (https=) |
| CN (1) | CN112753093A (https=) |
| WO (1) | WO2020023953A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11011381B2 (en) * | 2018-07-27 | 2021-05-18 | Texas Instruments Incorporated | Patterning platinum by alloying and etching platinum alloy |
| CN111945128A (zh) * | 2020-08-18 | 2020-11-17 | 江苏能华微电子科技发展有限公司 | 一种提高铂与衬底黏附性的方法及其产品 |
| US12607594B2 (en) | 2020-09-03 | 2026-04-21 | Texas Instruments Incorporated | ISFET biosensor |
| DE102024203632A1 (de) * | 2024-04-18 | 2025-10-23 | Infineon Technologies Ag | Halbleiterchip und verfahren zur herstellung davon |
| CN118857496B (zh) * | 2024-09-25 | 2025-01-28 | 南昌三盛半导体有限公司 | 一种铂薄膜温度传感器及其制备方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7117429A (https=) * | 1971-12-18 | 1973-06-20 | ||
| JPS54137273A (en) * | 1978-04-17 | 1979-10-24 | Nec Corp | Semiconductor device |
| JPS5843539A (ja) | 1981-09-08 | 1983-03-14 | Nec Corp | 半導体装置 |
| US4740485A (en) * | 1986-07-22 | 1988-04-26 | Monolithic Memories, Inc. | Method for forming a fuse |
| JP3134093B2 (ja) * | 1992-06-23 | 2001-02-13 | 本田技研工業株式会社 | 白金パターンの形成方法 |
| DE4402117C2 (de) | 1994-01-25 | 1995-11-23 | Siemens Matsushita Components | Hochtemperatur-Gassensor und Verfahren zu seiner Herstellung |
| JPH11145112A (ja) * | 1997-11-07 | 1999-05-28 | Nec Corp | パターニング方法 |
| EP0929096A2 (en) * | 1998-01-08 | 1999-07-14 | International Business Machines Corporation | Metal patterning by formation of etchable plural metal compositions |
| US6475911B1 (en) * | 2000-08-16 | 2002-11-05 | Micron Technology, Inc. | Method of forming noble metal pattern |
| US6790786B2 (en) * | 2002-03-05 | 2004-09-14 | Micron Technology, Inc. | Etching processes for integrated circuit manufacturing including methods of forming capacitors |
| JP2004311624A (ja) * | 2003-04-04 | 2004-11-04 | Tokuyama Corp | 積層体およびその製造方法 |
| WO2005081317A1 (ja) * | 2004-02-19 | 2005-09-01 | Fujitsu Limited | 半導体装置の製造方法 |
| EP1591776A1 (en) | 2004-04-30 | 2005-11-02 | Henkel KGaA | Gas sensor for the determination of isocyanates using metal oxide semiconductors |
| WO2008044803A1 (en) | 2006-10-13 | 2008-04-17 | Korea Institute Of Science And Technology | Method for manufacturing metal structure and carbon nano tube by using immersion plating |
| JP5865634B2 (ja) * | 2011-09-06 | 2016-02-17 | 三菱電機株式会社 | 配線膜の製造方法 |
| ES2573137T3 (es) | 2012-09-14 | 2016-06-06 | Atotech Deutschland Gmbh | Método de metalización de sustratos de célula solar |
| US20140077662A1 (en) * | 2012-09-19 | 2014-03-20 | The Governors Of The University Of Alberta | Piezoelectric apparatus for harvesting energy for portable electronics and method for manufacturing same |
| GB201216861D0 (en) * | 2012-09-20 | 2012-11-07 | Univ Southampton | Apparatus for sensing at least one parameter in water |
| US10276362B2 (en) | 2016-04-29 | 2019-04-30 | Infineon Technologies Ag | Method for processing a semiconductor region and an electronic device |
| US10246760B2 (en) * | 2016-07-12 | 2019-04-02 | General Electric Company | Platinum recovery methods |
| US10297497B2 (en) | 2017-01-19 | 2019-05-21 | Texas Instruments Incorporated | Sacrificial layer for platinum patterning |
| US10504733B2 (en) | 2017-01-19 | 2019-12-10 | Texas Instruments Incorporated | Etching platinum-containing thin film using protective cap layer |
| US10707089B2 (en) | 2018-03-27 | 2020-07-07 | Texas Instruments Incorporated | Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby |
| US11011381B2 (en) * | 2018-07-27 | 2021-05-18 | Texas Instruments Incorporated | Patterning platinum by alloying and etching platinum alloy |
-
2019
- 2019-07-26 US US16/523,867 patent/US11011381B2/en active Active
- 2019-07-29 EP EP19840061.6A patent/EP3830862A4/en active Pending
- 2019-07-29 JP JP2021527030A patent/JP7476442B2/ja active Active
- 2019-07-29 CN CN201980063516.1A patent/CN112753093A/zh active Pending
- 2019-07-29 KR KR1020217002330A patent/KR102646859B1/ko active Active
- 2019-07-29 WO PCT/US2019/043850 patent/WO2020023953A1/en not_active Ceased
- 2019-07-29 KR KR1020247007826A patent/KR20240038117A/ko active Pending
-
2021
- 2021-04-20 US US17/234,833 patent/US11658034B2/en active Active
-
2023
- 2023-04-13 US US18/299,850 patent/US20230253211A1/en active Pending
-
2024
- 2024-03-06 JP JP2024033639A patent/JP2024072836A/ja active Pending
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