JP2021531415A5 - - Google Patents

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Publication number
JP2021531415A5
JP2021531415A5 JP2021527030A JP2021527030A JP2021531415A5 JP 2021531415 A5 JP2021531415 A5 JP 2021531415A5 JP 2021527030 A JP2021527030 A JP 2021527030A JP 2021527030 A JP2021527030 A JP 2021527030A JP 2021531415 A5 JP2021531415 A5 JP 2021531415A5
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JP
Japan
Prior art keywords
layer
platinum
aluminum
alloy
exposed region
Prior art date
Application number
JP2021527030A
Other languages
English (en)
Japanese (ja)
Other versions
JP7476442B2 (ja
JPWO2020023953A5 (https=
JP2021531415A (ja
Filing date
Publication date
Priority claimed from US16/523,867 external-priority patent/US11011381B2/en
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Publication of JP2021531415A publication Critical patent/JP2021531415A/ja
Publication of JP2021531415A5 publication Critical patent/JP2021531415A5/ja
Publication of JPWO2020023953A5 publication Critical patent/JPWO2020023953A5/ja
Priority to JP2024033639A priority Critical patent/JP2024072836A/ja
Application granted granted Critical
Publication of JP7476442B2 publication Critical patent/JP7476442B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021527030A 2018-07-27 2019-07-29 合金化すること及びプラチナ合金をエッチングすることによるプラチナのパターン化 Active JP7476442B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024033639A JP2024072836A (ja) 2018-07-27 2024-03-06 マイクロ電子デバイス

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862703937P 2018-07-27 2018-07-27
US62/703,937 2018-07-27
US16/523,867 2019-07-26
US16/523,867 US11011381B2 (en) 2018-07-27 2019-07-26 Patterning platinum by alloying and etching platinum alloy
PCT/US2019/043850 WO2020023953A1 (en) 2018-07-27 2019-07-29 Patterning platinum by alloying and etching platinum alloy

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024033639A Division JP2024072836A (ja) 2018-07-27 2024-03-06 マイクロ電子デバイス

Publications (4)

Publication Number Publication Date
JP2021531415A JP2021531415A (ja) 2021-11-18
JP2021531415A5 true JP2021531415A5 (https=) 2022-08-04
JPWO2020023953A5 JPWO2020023953A5 (https=) 2022-08-04
JP7476442B2 JP7476442B2 (ja) 2024-05-01

Family

ID=69178612

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021527030A Active JP7476442B2 (ja) 2018-07-27 2019-07-29 合金化すること及びプラチナ合金をエッチングすることによるプラチナのパターン化
JP2024033639A Pending JP2024072836A (ja) 2018-07-27 2024-03-06 マイクロ電子デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024033639A Pending JP2024072836A (ja) 2018-07-27 2024-03-06 マイクロ電子デバイス

Country Status (6)

Country Link
US (3) US11011381B2 (https=)
EP (1) EP3830862A4 (https=)
JP (2) JP7476442B2 (https=)
KR (2) KR102646859B1 (https=)
CN (1) CN112753093A (https=)
WO (1) WO2020023953A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11011381B2 (en) * 2018-07-27 2021-05-18 Texas Instruments Incorporated Patterning platinum by alloying and etching platinum alloy
CN111945128A (zh) * 2020-08-18 2020-11-17 江苏能华微电子科技发展有限公司 一种提高铂与衬底黏附性的方法及其产品
US12607594B2 (en) 2020-09-03 2026-04-21 Texas Instruments Incorporated ISFET biosensor
DE102024203632A1 (de) * 2024-04-18 2025-10-23 Infineon Technologies Ag Halbleiterchip und verfahren zur herstellung davon
CN118857496B (zh) * 2024-09-25 2025-01-28 南昌三盛半导体有限公司 一种铂薄膜温度传感器及其制备方法

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JP5865634B2 (ja) * 2011-09-06 2016-02-17 三菱電機株式会社 配線膜の製造方法
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US20140077662A1 (en) * 2012-09-19 2014-03-20 The Governors Of The University Of Alberta Piezoelectric apparatus for harvesting energy for portable electronics and method for manufacturing same
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US11011381B2 (en) * 2018-07-27 2021-05-18 Texas Instruments Incorporated Patterning platinum by alloying and etching platinum alloy

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