JPWO2017094189A1 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- JPWO2017094189A1 JPWO2017094189A1 JP2017553591A JP2017553591A JPWO2017094189A1 JP WO2017094189 A1 JPWO2017094189 A1 JP WO2017094189A1 JP 2017553591 A JP2017553591 A JP 2017553591A JP 2017553591 A JP2017553591 A JP 2017553591A JP WO2017094189 A1 JPWO2017094189 A1 JP WO2017094189A1
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Abstract
Description
図1は、本発明の実施の形態1に係る半導体モジュール(パワー半導体モジュール)の構成を示す断面図である。図1の半導体モジュールは、ベース板1と、半導体チップ2と、ケース3と、絶縁基板である絶縁セラミック基板4と、封止剤5とを備える。
図3は、本発明の実施の形態2に係る半導体モジュールの構成を示す断面図である。以下、本実施の形態2に係る半導体モジュールのうち、実施の形態1と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
溝8と同様の溝は、ベース板1の上記部分以外の部分にも設けられてもよい。図5は、本変形例に係る半導体モジュールの構成の一部を示す平面図であり、図6は、図5のA−A線に沿った断面図である。
図7は、本発明の実施の形態3に係る半導体モジュールの構成を示す断面図である。以下、本実施の形態3に係る半導体モジュールのうち、実施の形態1と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
Claims (7)
- ベース板と、
前記ベース板の外周部よりも内側で前記ベース板上方に配設された半導体チップと、
前記ベース板の前記外周部と接着剤によって接合され、前記半導体チップを収容するケースと
を備え、
前記ベース板の上面のうち平面視で前記ケースの内壁と前記半導体チップとの間の部分に、凹部または凸部が配設された、半導体モジュール。 - 請求項1に記載の半導体モジュールであって、
前記凹部として、平面視で前記ケースの前記内壁に沿って延在する溝が前記ベース板の上面に配設された、半導体モジュール。 - 請求項2に記載の半導体モジュールであって、
前記半導体チップと前記ベース板との間に配設された絶縁基板をさらに備え、
平面視で前記溝の幅方向の一端は前記ケースの前記内壁の近傍に位置し、平面視で前記溝の幅方向の他端は前記絶縁基板及び前記ベース板の接合部分外であって当該接合部分の近傍に位置する、半導体モジュール。 - 請求項2に記載の半導体モジュールであって、
互いに隣り合う第1及び第2の前記半導体チップと、一の前記ベース板との間にそれぞれ配設された第1及び第2の絶縁基板をさらに備え、
前記ベース板の上面のうち、前記第1の絶縁基板及び前記ベース板の接合部分と、前記第2の絶縁基板及び前記ベース板の接合部分と、の間の部分にも前記溝が配設された、半導体モジュール。 - 請求項1に記載の半導体モジュールであって、
前記凸部として、レジストが前記ベース板の上面に配設された、半導体モジュール。 - 請求項1から請求項5のうちのいずれか1項に記載の半導体モジュールであって、
前記ケースの下部には、前記ベース板の前記外周部の上部と係合可能な切欠きが設けられ、
前記接着剤は、前記ケースの切欠きと、前記ベース板の前記上部との間に設けられた、半導体モジュール。 - 請求項1から請求項5のうちのいずれか1項に記載の半導体モジュールであって、
前記半導体チップはワイドバンドギャップ半導体からなる、半導体モジュール。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/084164 WO2017094189A1 (ja) | 2015-12-04 | 2015-12-04 | 半導体モジュール |
Publications (2)
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JPWO2017094189A1 true JPWO2017094189A1 (ja) | 2018-02-08 |
JP6407451B2 JP6407451B2 (ja) | 2018-10-17 |
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JP2017553591A Active JP6407451B2 (ja) | 2015-12-04 | 2015-12-04 | 半導体モジュール |
Country Status (5)
Country | Link |
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US (1) | US10483176B2 (ja) |
JP (1) | JP6407451B2 (ja) |
CN (1) | CN108292631B (ja) |
DE (1) | DE112015007169B4 (ja) |
WO (1) | WO2017094189A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018110132B3 (de) * | 2018-04-26 | 2018-11-29 | Semikron Elektronik Gmbh & Co. Kg | Drucksinterverfahren bei dem Leistungshalbleiterbauelemente mit einem Substrat über eine Sinterverbindung miteinander verbunden werden |
JP7187814B2 (ja) * | 2018-04-27 | 2022-12-13 | 株式会社デンソー | 半導体装置 |
US11410895B2 (en) * | 2018-10-05 | 2022-08-09 | Ngk Spark Plug Co., Ltd. | Wiring board |
JP7247053B2 (ja) * | 2019-08-02 | 2023-03-28 | 株式会社東芝 | 半導体装置 |
JP7258806B2 (ja) * | 2020-03-23 | 2023-04-17 | 株式会社東芝 | 半導体装置 |
JP7332528B2 (ja) * | 2020-04-17 | 2023-08-23 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
DE102020119209A1 (de) | 2020-07-21 | 2022-01-27 | Rogers Germany Gmbh | Leistungsmodul und Verfahren zur Herstellung eines Leistungsmoduls |
JP2022039118A (ja) * | 2020-08-27 | 2022-03-10 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
WO2023112274A1 (ja) * | 2021-12-16 | 2023-06-22 | 三菱電機株式会社 | 半導体装置 |
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JPH07106458A (ja) * | 1993-10-01 | 1995-04-21 | Fuji Electric Co Ltd | 気密封止形半導体装置 |
JPH11238821A (ja) * | 1998-02-19 | 1999-08-31 | Sansha Electric Mfg Co Ltd | 電力用半導体モジュール |
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JP2008016551A (ja) * | 2006-07-04 | 2008-01-24 | Mitsubishi Electric Corp | 半導体装置 |
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JP2012204366A (ja) * | 2011-03-23 | 2012-10-22 | Mitsubishi Electric Corp | 半導体装置 |
JP2015023128A (ja) * | 2013-07-18 | 2015-02-02 | 三菱電機株式会社 | 半導体モジュール及びその製造方法 |
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JP5859906B2 (ja) | 2012-04-20 | 2016-02-16 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2014203978A (ja) | 2013-04-05 | 2014-10-27 | 三菱電機株式会社 | パワーモジュール |
JP2014230978A (ja) | 2014-08-21 | 2014-12-11 | 株式会社三共 | 遊技機 |
-
2015
- 2015-12-04 US US15/766,112 patent/US10483176B2/en active Active
- 2015-12-04 WO PCT/JP2015/084164 patent/WO2017094189A1/ja active Application Filing
- 2015-12-04 JP JP2017553591A patent/JP6407451B2/ja active Active
- 2015-12-04 CN CN201580084967.5A patent/CN108292631B/zh active Active
- 2015-12-04 DE DE112015007169.5T patent/DE112015007169B4/de active Active
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JPH07106458A (ja) * | 1993-10-01 | 1995-04-21 | Fuji Electric Co Ltd | 気密封止形半導体装置 |
JPH11238821A (ja) * | 1998-02-19 | 1999-08-31 | Sansha Electric Mfg Co Ltd | 電力用半導体モジュール |
JPH11265976A (ja) * | 1998-03-18 | 1999-09-28 | Mitsubishi Electric Corp | パワー半導体モジュールおよびその製造方法 |
JP2004228286A (ja) * | 2003-01-22 | 2004-08-12 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2006100320A (ja) * | 2004-09-28 | 2006-04-13 | Mitsubishi Electric Corp | 半導体装置 |
JP2008016551A (ja) * | 2006-07-04 | 2008-01-24 | Mitsubishi Electric Corp | 半導体装置 |
JP2009070863A (ja) * | 2007-09-11 | 2009-04-02 | Hitachi Ltd | 半導体パワーモジュール |
JP2012204366A (ja) * | 2011-03-23 | 2012-10-22 | Mitsubishi Electric Corp | 半導体装置 |
JP2015023128A (ja) * | 2013-07-18 | 2015-02-02 | 三菱電機株式会社 | 半導体モジュール及びその製造方法 |
Also Published As
Publication number | Publication date |
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US10483176B2 (en) | 2019-11-19 |
CN108292631B (zh) | 2021-08-06 |
DE112015007169T5 (de) | 2018-08-09 |
CN108292631A (zh) | 2018-07-17 |
WO2017094189A1 (ja) | 2017-06-08 |
DE112015007169B4 (de) | 2024-03-07 |
US20180286771A1 (en) | 2018-10-04 |
JP6407451B2 (ja) | 2018-10-17 |
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