JPWO2015133576A1 - 接合体の製造方法及び接合体 - Google Patents
接合体の製造方法及び接合体 Download PDFInfo
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Abstract
Description
セラミックスからなる第1部材の接合面と金属からなる第2部材の接合面とを接合層を介して接合した接合体の製造方法であって、
(a)前記第1部材よりも熱膨張係数の大きい金属からなるロウ材と、該ロウ材よりも熱膨張係数の小さい多孔質体と、前記第2部材とを、該第1部材の接合面上に配置する工程と、
(b)前記ロウ材を溶融させ、該ロウ材を前記多孔質体の気孔内に浸透させて該ロウ材と該多孔質体とを含む接合層を形成して、該接合層を介して前記第1部材の接合面と前記第2部材の接合面とを接合する工程と、
を含むものである。
セラミックスからなる第1部材と、
金属からなる第2部材と、
気孔内に前記第1部材よりも熱膨張係数の大きい金属が充填され該金属よりも熱膨張係数の小さい材料からなり該金属がないと仮定した場合の気孔率が30%〜50%である多孔質体を有し、前記第1部材と前記第2部材とを接合する接合層と、
を備えたものである。
実施例1として、上述した図4〜図7で説明した製造方法と同様にして、セラミックス基体12と給電端子40との接合体を作製した。具体的には、まず、純度99.5%のアルミナ粉末を焼成後密度99.5%以上とし、研削して、外径300mm、厚さ5mmの円盤状のアルミナ焼結体を作製し、セラミックス基体12とした。なお、実施例1では、アルミナ粉末にMo製のタブレット22を埋設しておき、焼成後のセラミックス基体12を研削してタブレット22の表面を露出させた。そして、このセラミックス基体12のうち直径4mmの領域(タブレット22の表面である直径2.0mmの領域を含む)を接合面13として、この接合面13以外をマスキングして純度99%,厚さ約1μmの無電解Niメッキを形成し、接合面13上を被覆する直径4mmの基体被覆層52とした。
多孔質体54を用いず、ロウ材56でセラミックス基体12と給電端子40とを接合した点以外は、実施例1と同様にして接合体を作製し、比較例1とした。
多孔質体54の代わりに多孔質体54と同じ材質のセラミックス粒子からなる粉末を用いた点以外は、実施例1と同様にして接合体を作製しようとした。しかし、粉末がセラミックス基体12の表面に広がってしまい、焼成炉で過熱してもセラミックス基体12と給電端子40とが接合されなかった。
多孔質体54の気孔率が表1に示す値のものを使用した点以外は実施例1と同様にして接合体を作製し、実施例2〜11とした。実施例2〜11について、初期特性として、作製した当初の接合体の破断強度(接合強度)とクラックの有無を測定した。また、熱サイクル試験後の接合体の破断強度とクラックの有無も測定した。熱サイクル試験は、外部加熱ヒーターを用いて、実施例2〜11の接合体を室温から100℃になるまで5℃/秒の速度で昇温し、その後自然放冷により、室温まで戻した。この工程を1000回繰り返した。なお、各実施例においてそれぞれ複数の接合体を作製し、初期特性の測定と熱サイクル試験後の測定とは別々の接合体について行った。
Claims (7)
- セラミックスからなる第1部材の接合面と金属からなる第2部材の接合面とを接合層を介して接合した接合体の製造方法であって、
(a)前記第1部材よりも熱膨張係数の大きい金属からなるロウ材と、該ロウ材よりも熱膨張係数の小さい多孔質体と、前記第2部材とを、該第1部材の接合面上に配置する工程と、
(b)前記ロウ材を溶融させ、該ロウ材を前記多孔質体の気孔内に浸透させて該ロウ材と該多孔質体とを含む接合層を形成して、該接合層を介して前記第1部材の接合面と前記第2部材の接合面とを接合する工程と、
を含む接合体の製造方法。 - 前記多孔質体は、気孔率が30%〜50%である、
請求項1に記載の接合体の製造方法。 - 前記多孔質体は、前記第1部材と同じセラミックス材料からなる多孔質焼結体である、
請求項1又は2に記載の接合体の製造方法。 - 前記工程(a)において、前記多孔質体は、内部の気孔の表面が自身と比べて前記ロウ材に対する濡れ性の高い材料で被覆されている、
請求項1〜3のいずれか1項に記載の接合体の製造方法。 - 前記工程(a)において、前記第1部材の接合面と、前記第2部材の接合面と、の少なくとも一方が、自身と比べて前記ロウ材に対する濡れ性の高い材料で被覆されている、
請求項1〜4のいずれか1項に記載の接合体の製造方法。 - 前記第1部材は、前記接合面からの立ち上がり部を有さない、
請求項1〜5のいずれか1項に記載の接合体の製造方法。 - セラミックスからなる第1部材と、
金属からなる第2部材と、
気孔内に前記第1部材よりも熱膨張係数の大きい金属が充填され該金属よりも熱膨張係数の小さい材料からなり該金属がないと仮定した場合の気孔率が30%〜50%である多孔質体を有し、前記第1部材と前記第2部材とを接合する接合層と、
を備えた接合体。
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CN109721379A (zh) * | 2019-03-14 | 2019-05-07 | 大连海事大学 | 一种用AlON粉体作为原料连接AlON陶瓷的方法 |
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JP6666717B2 (ja) * | 2015-12-28 | 2020-03-18 | 日本特殊陶業株式会社 | セラミックス部材 |
CN109642123B (zh) * | 2016-12-21 | 2021-07-02 | 古河电气工业株式会社 | 接合膜及晶圆加工用带 |
KR102259995B1 (ko) * | 2017-10-30 | 2021-06-02 | 니뽄 도쿠슈 도교 가부시키가이샤 | 전극 매설 부재 |
JP6994644B2 (ja) * | 2017-12-01 | 2022-01-14 | パナソニックIpマネジメント株式会社 | 接合体と接合方法および接合材料 |
JP7280059B2 (ja) * | 2018-05-29 | 2023-05-23 | 日本特殊陶業株式会社 | 電極埋設部材の製造方法 |
JP7278058B2 (ja) * | 2018-11-08 | 2023-05-19 | 日本特殊陶業株式会社 | 接合体 |
JP7438070B2 (ja) * | 2020-09-11 | 2024-02-26 | 新光電気工業株式会社 | 静電チャック、基板固定装置及び基板固定装置の製造方法 |
CN116354739B (zh) * | 2023-03-13 | 2024-02-02 | 中国科学院宁波材料技术与工程研究所 | 一种陶瓷连接件及其制备方法与应用 |
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