JPWO2013146974A1 - 圧電/電歪膜型素子及び圧電/電歪膜型素子を製造する方法 - Google Patents
圧電/電歪膜型素子及び圧電/電歪膜型素子を製造する方法 Download PDFInfo
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- JPWO2013146974A1 JPWO2013146974A1 JP2014508000A JP2014508000A JPWO2013146974A1 JP WO2013146974 A1 JPWO2013146974 A1 JP WO2013146974A1 JP 2014508000 A JP2014508000 A JP 2014508000A JP 2014508000 A JP2014508000 A JP 2014508000A JP WO2013146974 A1 JPWO2013146974 A1 JP WO2013146974A1
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- Prior art keywords
- film
- piezoelectric
- electrostrictive
- bismuth
- electrode film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000012528 membrane Substances 0.000 title claims description 8
- 238000000034 method Methods 0.000 title description 22
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000000919 ceramic Substances 0.000 claims abstract description 37
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 36
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims abstract description 20
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 150000001622 bismuth compounds Chemical class 0.000 claims abstract description 11
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims description 37
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 9
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 229910000464 lead oxide Inorganic materials 0.000 claims description 8
- 239000002243 precursor Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 239000006104 solid solution Substances 0.000 claims description 3
- LGRDPUAPARTXMG-UHFFFAOYSA-N bismuth nickel Chemical compound [Ni].[Bi] LGRDPUAPARTXMG-UHFFFAOYSA-N 0.000 claims description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 8
- 239000004020 conductor Substances 0.000 description 35
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 23
- 238000010304 firing Methods 0.000 description 16
- 238000005245 sintering Methods 0.000 description 16
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 238000010344 co-firing Methods 0.000 description 10
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000003917 TEM image Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 239000012071 phase Substances 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000003891 oxalate salts Chemical class 0.000 description 2
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 229910020684 PbZr Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229940036348 bismuth carbonate Drugs 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- GMZOPRQQINFLPQ-UHFFFAOYSA-H dibismuth;tricarbonate Chemical compound [Bi+3].[Bi+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O GMZOPRQQINFLPQ-UHFFFAOYSA-H 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
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- C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
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- H10N30/85—Piezoelectric or electrostrictive active materials
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Abstract
Description
図1の模式図は、圧電/電歪膜型素子の断面図である。
基板1020においては、流路形成板1040、キャビティ形成板1042及び振動板1044が記載された順序で下側から上側へ積層される。流路形成板1040、キャビティ形成板1042及び振動板1044は、焼成により一体化され、明確な界面を有さない場合もある。
振動板1044の板厚は、望ましくは1μm以上である。振動板1044の板厚がこの範囲を下回る場合は、振動板1044が損傷しやすい。振動板1044の板厚は、望ましくは30μm以下であり、さらに望ましくは15μm以下である。振動板1044の板厚がこれらの範囲を上回る場合は、振動板1044の屈曲変位量が小さくなりやすい。
基板1020は、絶縁セラミックスからなる。
振動体1022においては、下部電極膜1080、圧電/電歪体膜1082及び上部電極膜1084が記載された順序で下側から上側へ積層される。
基板1020及び下部電極膜1080は、固着される。下部電極膜1080及び圧電/電歪体膜1082は、固着される。固着とは、一の構成物及び他の構成物が熱処理時の相互拡散反応により強固に接合されることを意味する。一の構成物及び他の構成物が固着される場合は、無機接着剤、有機接着剤等の接合媒体は用いられない。基板1020及び下部電極膜1080の固着並びに下部電極膜1080及び圧電/電歪体膜1082の固着は、基板1020、下部電極膜1080及び圧電/電歪体膜1082が共焼成されることに起因する。
下部電極膜1080は、基板1020の被覆領域1160を被覆する。下部電極膜1080の被覆率は、望ましくは90%以上である。下部電極膜1080の被覆率がこの範囲を下回る場合は、下部電極膜1080の電気抵抗が上昇しやすくなる。
下部電極膜1080及び上部電極膜1084は、導電体からなる。導電体は、望ましくは白金(Pt)、パラジウム(Pd)、ロジウム(Rh)、金(Au)、銀(Ag)等の金属又はこれらを主成分とする合金である。これらは、耐熱性が高く、電気抵抗が小さい。導電体は、さらに望ましくは白金又は白金を主成分とする合金である。これらは、耐熱性が特に高い。下部電極膜1080は、基板1020及び圧電/電歪体膜1082とともに共焼成される。このため、下部電極膜1080の材質は、白金又は白金を主成分とする合金であることが特に期待される。
下部電極膜1080及び上部電極膜1084の膜厚は、望ましくは1μm以下である。下部電極膜1080及び上部電極膜1084の膜厚がこの範囲を上回る場合は、屈曲変位量が小さくなりやすい。下部電極膜1080及び上部電極膜1084の膜厚は、望ましくは0.1μm以上である。下部電極膜1080及び上部電極膜1084の膜厚がこの範囲を下回る場合は、下部電極膜1080の電気抵抗が上昇しやすい。
圧電/電歪体膜1082の膜厚は、望ましくは5μm以下である。圧電/電歪体膜1082の膜厚がこの範囲を上回る場合は、焼成収縮により屈曲振動部1060に加わる応力が大きくなりやすい。圧電/電歪体膜1082の膜厚は、望ましくは1μm以上である。圧電/電歪体膜1082の膜厚がこの範囲を下回る場合は、圧電/電歪体膜1082が緻密化しにくい。
圧電/電歪体膜1082は、圧電/電歪セラミックスからなる。
圧電/電歪セラミックスにおいては、粒界に相対的に近い粒内周辺部のビスマス/鉛比が粒界から相対的に遠い粒内中心部のビスマス/鉛比より大きい。圧電/電歪セラミックスがこの微構造を有するように製造される場合は、焼成温度が低下するが、圧電/電歪体膜1082の耐久性及び絶縁性が良好に維持される。焼成温度の低下は、圧電/電歪体膜1082の膜厚を薄くすることを容易にし、下部電極膜1080の膜厚を薄くすることを容易にし、下部電極膜1080の被覆率を90%以上に維持することを容易にする。
図2から図6までの模式図は、圧電/電歪膜型素子を製造する方法を示す断面図である。
図2に示すように、基板1020が作製される。基板1020が作製される場合は、最終的に流路形成板1040、キャビティ形成板1042及び振動板1044となる成形体が積層され焼成される。他の方法により基板1020が作製されてもよい。例えば、素材基板にエッチング、切削加工等がなされ、基板1020が作製されてもよい。
基板1020が準備された後に、図3に示すように、下部電極膜1080が形成される。
下部電極膜1080が形成された後に、図4に示すように、圧電/電歪セラミックスの原料粉末の膜状成形体1200が基板1020の上面1142に形成される。膜状成形体1200は、下部電極膜1080に重ねて形成される。原料粉末は、仮焼粉末及び焼結助剤の混合物である。仮焼粉末は、チタン酸ジルコン酸鉛及びビスマス化合物を含む。仮焼粉末においては、チタン酸ジルコン酸鉛及びビスマス化合物の固溶体のペロブスカイト型酸化物が主成分になるまで素原料が反応させられている。焼結助剤は、PbOの粉末及びBi2O3の粉末である。膜状成形体1200の膜厚は、後記の膜状焼結体1220の膜厚が5μm以下になるように選択される。PbOがPbO以外の鉛の酸化物に置き換えられてもよい。例えば、PbOがPbO2、Pb3O4等に置き換えられてもよい。PbOが焼成後に鉛の酸化物になる鉛の酸化物の前駆体に置きかえられてもよい。鉛の酸化物の前駆体には、水酸化物、塩化物、炭酸塩、シュウ酸塩等がある。Bi2O3がBi2O3以外のビスマスの酸化物に置き換えられてもよい。例えば、Bi2O3がBi2O5等に置き換えられてもよい。Bi2O3が焼成後にビスマスの酸化物になるビスマスの酸化物の前駆体に置きかえられてもよい。ビスマスの酸化物の前駆体には、水酸化物、塩化物、炭酸塩、シュウ酸塩等がある。
膜状成形体1200が形成された後に、基板1020、下部電極膜1080及び膜状成形体1200が共焼成される。共焼成により、図5に示すように、膜状成形体1200は、膜状焼結体1220に変化する。共焼成により、基板1020及び下部電極膜1080が固着し、下部電極膜1080及び膜状焼結体1220が固着する。膜状成形体1200は基板1020に拘束される。このため、膜状成形体1200の面内の収縮は阻害される。しかし、原料粉末は焼結助剤を含むので、面内の収縮が阻害される場合でも、膜状焼結体1220は十分に緻密化する。
共焼成の後に、図6に示すように、膜状焼結体1220がパターニングされ、圧電/電歪体膜1082が形成される。膜状成形体1200が被覆領域1160から大きくはみ出さない場合は、膜状焼結体1220のパターニングが省略されてもよい。この場合は、形成された膜状焼結体1220がそのまま圧電/電歪体膜1082になる。スクリーン版を用いてスクリーン印刷が行われる場合等においては膜状成形体1200が被覆領域1160から大きくはみ出さない場合がある。
圧電/電歪体膜1082が形成された後に、上部電極膜1084が圧電/電歪体膜1082の上面1182に形成され、図1に示す圧電/電歪膜型素子1000が完成する。上部電極膜1084が形成される場合は、蒸着、スパッタ、めっき、スクリーン印刷等により上部導電体膜が基板1020の上面1142に形成される。上部導電体膜は、下部電極膜1080及び圧電/電歪体膜1082に重ねて形成される。上部導電体膜がパターニングされ、上部電極膜1084が形成される。上部導電体膜が圧電/電歪体膜1082の上面1182からはみ出さないで形成される場合は、上部導電体膜のパターニングが省略されてもよい。この場合は、形成された上部導電体膜がそのまま上部電極膜1084になる。マスクを用いて蒸着、スパッタ等が行われる場合、スクリーン版を用いてスクリーン印刷が行われる場合等においては上部導電体膜が圧電/電歪体膜1082の上面1182からはみ出さない場合がある。
圧電/電歪膜型素子を試作した。
100重量部の仮焼粉末に対して3重量部のPbO及び0.5重量部のBi2O3が含まれるように仮焼粉末、PbOの粉末及びBi2O3の粉末を秤量したこと以外は実施例1と同じように圧電/電歪膜型素子を試作した。
100重量部の仮焼粉末に対して2重量部のPbO及び0.3重量部のBi2O3が含まれるように仮焼粉末、PbOの粉末及びBi2O3の粉末を秤量し焼成プロファイルの最高温度を1050℃へ変更したこと以外は実施例1と同じように圧電/電歪膜型素子を試作した。
焼結助剤をLiFとした以外は実施例1と同じように圧電/電歪膜型素子を試作した。
焼結助剤をPbOとした以外は実施例1と同じように圧電/電歪膜型素子を試作した。
実施例1、2及び3並びに比較例1及び2の圧電/電歪膜型素子を40℃、85%RHの環境下におき、上部電極膜及び下部電極膜の間に直流50Vを80時間印加する耐久試験を行った。絶縁破壊しなかった圧電/電歪膜型素子を合格とした。
上部電極及び下部電極膜の間に直流100Vを印加した場合に流れるリーク電流を測定した。
図7は、実施例1の圧電/電歪セラミックスの透過型電子顕微鏡写真(TEM)像である。図8は、実施例1の圧電/電歪セラミックスの三重点のエネルギー分散型X線分析(EDX)スペクトルを示す図である。図9は、実施例1の圧電/電歪セラミックスの二粒子粒界のEDXスペクトルを示す図である。図10は、実施例1の圧電/電歪セラミックスの粒内のEDXスペクトルを示す図である。図11は、比較例1の圧電/電歪セラミックスのTEM像である。図12は、比較例1の圧電/電歪セラミックスの二粒子粒界のEDXスペクトルを示す図である。図13は、比較例1の圧電/電歪セラミックスの粒内のEDXスペクトルを示す図である。
1020 基板
1080 下部電極膜
1082 圧電/電歪体膜
1084 上部電極膜
Claims (3)
- 被覆領域を有する基体と、
前記基体に固着され、前記被覆領域を被覆する第1の電極膜と、
第1の主面及び第2の主面を有し、前記第1の主面に前記第1の電極膜が形成され、前記第1の電極膜に固着され、膜厚が5μm以下であり、圧電/電歪セラミックスからなり、前記圧電/電歪セラミックスがチタン酸ジルコン酸鉛及びビスマス化合物を含み、粒界に相対的に近い粒内周辺部のビスマス/鉛比が粒界から相対的に遠い粒内中心部のビスマス/鉛比より大きい圧電/電歪体膜と、
前記第2の主面に形成される第2の電極膜と、
を備える圧電/電歪膜型素子。 - 前記圧電/電歪セラミックスの母相がチタン酸ジルコン酸鉛及びニッケルニオブ酸ビスマスの固溶体である請求項1の圧電/電歪膜型素子。
- (a) 被覆領域を有する基体を準備する工程と、
(b) 第1の電極膜で前記被覆領域を被覆する工程と、
(c) チタン酸ジルコン酸鉛及びビスマス化合物を含む仮焼粉末、鉛の酸化物又は鉛の酸化物の前駆体の粉末並びにビスマスの酸化物又はビスマスの酸化物の前駆体の粉末の混合物である圧電/電歪セラミックスの原料粉末の膜状成形体を前記第1の電極膜に重ねて形成する工程と、
(d) 前記基体、前記第1の電極膜及び前記膜状成形体を共焼成し、前記膜状成形体を膜厚が5μm以下の膜状焼結体に変化させ、前記膜状焼結体により圧電/電歪体膜を形成する工程と、
(e) 前記圧電/電歪体膜に重ねて第2の電極膜を形成する工程と、
を備える圧電/電歪膜型素子を製造する方法。
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WO2013146974A1 (ja) | 2013-10-03 |
US20150015122A1 (en) | 2015-01-15 |
US9553252B2 (en) | 2017-01-24 |
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