JPWO2012026349A1 - 水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 - Google Patents
水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 Download PDFInfo
- Publication number
- JPWO2012026349A1 JPWO2012026349A1 JP2012530625A JP2012530625A JPWO2012026349A1 JP WO2012026349 A1 JPWO2012026349 A1 JP WO2012026349A1 JP 2012530625 A JP2012530625 A JP 2012530625A JP 2012530625 A JP2012530625 A JP 2012530625A JP WO2012026349 A1 JPWO2012026349 A1 JP WO2012026349A1
- Authority
- JP
- Japan
- Prior art keywords
- film
- sprayed
- sprayed film
- water
- reactive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 title claims description 24
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 65
- 229910052738 indium Inorganic materials 0.000 claims abstract description 43
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 38
- 230000008021 deposition Effects 0.000 claims description 25
- 238000005507 spraying Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000012768 molten material Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 345
- 239000000758 substrate Substances 0.000 description 44
- 239000002585 base Substances 0.000 description 31
- 238000010438 heat treatment Methods 0.000 description 27
- 238000000151 deposition Methods 0.000 description 24
- 238000004544 sputter deposition Methods 0.000 description 20
- 239000000470 constituent Substances 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 14
- 230000009257 reactivity Effects 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000008367 deionised water Substances 0.000 description 12
- 229910021641 deionized water Inorganic materials 0.000 description 12
- 238000004090 dissolution Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 230000007423 decrease Effects 0.000 description 10
- 238000007654 immersion Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 229910008332 Si-Ti Inorganic materials 0.000 description 7
- 229910006749 Si—Ti Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000007751 thermal spraying Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000010285 flame spraying Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000005204 segregation Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 229910002706 AlOOH Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- 229910018117 Al-In Inorganic materials 0.000 description 3
- 229910018456 Al—In Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910017945 Cu—Ti Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Coating By Spraying Or Casting (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
4NAlとInとSiとを所定の割合で配合して、Al中にIn及びSiを均一に溶解させて得られた4NAl−3.0wt%In−0.1wt%Si(In及びSiの添加量は、Al重量基準)をロッド形状に加工した溶射材料を用い、溶棒式フレーム溶射(熱源:C2H2−O2ガス、約3000℃)によって、大気雰囲気中で、アルミニウムからなる基材の表面に吹き付けてAl溶射膜を形成した。かくして得られたAl溶射膜に対して、成膜プロセスから受ける熱履歴の代わりに0〜350℃の熱処理(大気中、1時間、炉冷)を施した。熱処理を受ける前の状態(0℃)のAl溶射膜付基材及び熱処理を経た後のAl溶射膜付基材を80℃の脱イオン水300ml中に浸漬し、Al溶射膜の溶解性を浸漬液の電流密度を測定して検討した。
Alとして4NAlを用い、以下のAl−In−Ti組成(a)〜(d)におけるIn及びTi添加効果を検討した。In及びTiの添加量は、Al重量基準である。
(a)4NAl−2.1wt%In−0.19wt%Ti
(b)4NAl−1.2wt%In−0.18wt%Ti
(c)4NAl−1.8wt%In−0.20wt%Ti
(d)4NAl−3.0wt%In−0.17wt%Ti
(a)3NAl−2.09wt%In−0.1wt%Ti
(b)4NAl−2.89wt%In−0.13wt%Ti
(c)4NAl−3.33wt%In−0.004wt%Cu−0.17wt%Ti
(d)4NAl−3.09wt%In−0.17wt%Ti
(e)3NAl−3.1wt%In−0.11wt%Ti
(f)3NAl−2.78wt%In−0.11wt%Ti
(g)4NAl−2.9wt%In−0.12Si−0.06wt%Ti
(h)4NAl−2.8wt%In−0.22wt%Si−0.21wt%Ti
(i)4NAl−3.0wt%In−0.2wt%Si−0.13wt%Ti
(j)4NAl−2.8wt%In−0.28wt%Si−0.15wt%Ti
(k)4NAl−3.0wt%In−0.30wt%Si−0.23wt%Ti
(l)4NAl−3.0wt%In−0.21wt%Si−0.21wt%Ti
(m)4NAl−2.0wt%In−0.40wt%Si−0.17wt%Ti
(n)4NAl−2.5wt%In−0.50wt%Si−0.25wt%Ti
(o)4NAl−2.0wt%In−0.55wt%Si−0.30wt%Ti
(p)4NAl−2.5wt%In−0.18wt%Si−0.1wt%Ti
Al溶射膜厚:150〜200μm
基材温度:280℃
Cuスパッタ膜厚:2.5mm
スパッタ時間:130時間
スパッタ成膜中の状態及び除膜性の結果:本発明のAl溶射膜の場合、凹凸のある基材及びフラットな基材の両方とも、スパッタ成膜中にスパッタ膜の剥がれは観察されなかったが(凹凸のある基材を使用した場合を図5(a)に示し、フラット基材を使用した場合を図5(b)に示す)、従来のAl溶射膜の場合、凹凸のある基材及びフラットな基材の両方とも、スパッタ成膜中にスパッタ膜の剥がれが観察された(凹凸のある基材を使用した場合を図6(a)に示し、フラット基材を使用した場合を図6(b)に示す)。すなわち、図6(a)に示す基材上に成膜されたCuスパッタ膜付きAl溶射膜の一部が剥がれ、また、図6(b)に示す基材上に成膜されたCuスパッタ膜付きAl溶射膜の右端部が捲れ上がって剥がれている。また、本発明のAl溶射膜の場合、Cuスパッタ膜付きAl溶射膜は80℃、19分で容易に除膜され(図7(a)参照)、96℃では6分で容易に除膜されたが、従来のAl溶射膜の場合、Cuスパッタ膜付きAl溶射膜は80℃、3時間でも除膜されず(図7(b)参照)、96℃、3時間でも除膜されなかった。本発明の場合、温水中にはAlOOHが沈殿しており、Cuを容易に回収できた。
Al溶射膜厚:150〜200μm
基材温度:280℃
ITOスパッタ膜厚:0.7mm
スパッタ時間:72時間
スパッタ成膜中の状態及び除膜性の結果:本発明のAl溶射膜の場合、スパッタ成膜中にスパッタ膜の剥がれは観察されなかった(図8(a)参照)。しかし、従来のAl溶射膜の場合、スパッタ成膜中にスパッタ膜の剥がれが観察された(図8(b)参照)。また、本発明のAl溶射膜の場合、ITOスパッタ膜付きAl溶射膜は80℃で容易に除膜されたが、従来のAl溶射膜の場合、80℃でも96℃でも除膜されなかった。本発明の場合、温水中にはAlOOHが沈殿しており、ITO膜(In、Sn)を容易に回収できた。
Al溶射膜厚:150〜200μm
基材温度:220℃
Moスパッタ膜厚:0.7mm
スパッタ時間:72時間
スパッタ成膜中の状態及び除膜性の結果:本発明のAl溶射膜の場合、表面に凹凸のある基材及び表面がフラットな基材の両方とも、スパッタ成膜中にスパッタ膜の剥がれは観察されなかった(フラット基材を使用した場合を図9(a)に示し、凹凸のある基材を使用した場合を図9(b)に示す)。しかし、従来のAl溶射膜の場合、凹凸のある基材及びフラットな基材の両方とも、スパッタ成膜中にスパッタ膜の剥がれが観察された。また、本発明のAl溶射膜の場合、Moスパッタ膜付きAl溶射膜は80℃、8分程度で容易に除膜されたが(図10(a)、(b)及び(c)参照)、従来のAl溶射膜の場合、Moスパッタ膜付きAl溶射膜は80℃、96℃でも除膜されなかった。
(a)3NAl−2.09wt%In−0.1wt%Ti
(b)4NAl−2.89wt%In−0.13wt%Ti
(c)4NAl−3.33wt%In−0.004wt%Cu−0.17wt%Ti
(d)4NAl−3.09wt%In−0.17wt%Ti
(e)3NAl−3.1wt%In−0.11wt%Ti
(f)3NAl−2.78wt%In−0.11wt%Ti
(g)4NAl−2.9wt%In−0.12wt%Si−0.06wt%Ti
(h)4NAl−2.8wt%In−0.22wt%Si−0.21wt%Ti
(i)4NAl−3.0wt%In−0.2wt%Si−0.13wt%Ti
(j)4NAl−2.8wt%In−0.28wt%Si−0.15wt%Ti
(k)4NAl−3.0wt%In−0.30wt%Si−0.23wt%Ti
(l)4NAl−3.0wt%In−0.21wt%Si−0.21wt%Ti
(m)4NAl−2.0wt%In−0.40wt%Si−0.17wt%Ti
(n)4NAl−2.5wt%In−0.50wt%Si−0.25wt%Ti
(o)4NAl−2.0wt%In−0.55wt%Si−0.30wt%Ti
(p)4NAl−2.5wt%In−0.18wt%Si−0.1wt%Ti
Claims (5)
- Alに、Al基準で、2.0〜3.5wt%のIn、0.2〜0.5wt%のSi、0.13〜0.25wt%のTiを添加してなることを特徴とする水反応性Al複合材料。
- Alに、Al基準で、2.0〜3.5wt%のIn、0.2〜0.5wt%のSi、及び0.13〜0.25wt%のTiを添加した材料を組成が均一になるように溶融し、この溶融材料を、基材表面に対して溶射して急冷凝固させることにより成膜することを特徴とする水反応性Al溶射膜の製造方法。
- 請求項1記載の水反応性Al複合材料からなることを特徴とする水反応性Al溶射膜。
- 請求項1記載の水反応性Al複合材料からなる水反応性Al溶射膜又は請求項2記載の方法により製造された水反応性Al溶射膜を表面に備えたことを特徴とする成膜装置の成膜室用構成部材。
- 前記構成部材が、防着板、シャッター又はマスクであることを特徴とする請求項4記載の成膜室用構成部材。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012530625A JP5517371B2 (ja) | 2010-08-27 | 2011-08-12 | 水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010191408 | 2010-08-27 | ||
JP2010191408 | 2010-08-27 | ||
PCT/JP2011/068443 WO2012026349A1 (ja) | 2010-08-27 | 2011-08-12 | 水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 |
JP2012530625A JP5517371B2 (ja) | 2010-08-27 | 2011-08-12 | 水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012026349A1 true JPWO2012026349A1 (ja) | 2013-10-28 |
JP5517371B2 JP5517371B2 (ja) | 2014-06-11 |
Family
ID=45723352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012530625A Active JP5517371B2 (ja) | 2010-08-27 | 2011-08-12 | 水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 |
Country Status (9)
Country | Link |
---|---|
US (1) | US8945296B2 (ja) |
JP (1) | JP5517371B2 (ja) |
KR (1) | KR101502253B1 (ja) |
CN (1) | CN103228814B (ja) |
DE (1) | DE112011102835B4 (ja) |
MY (1) | MY157422A (ja) |
SG (1) | SG188239A1 (ja) |
TW (1) | TWI473885B (ja) |
WO (1) | WO2012026349A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102016100B (zh) * | 2008-04-30 | 2013-04-10 | 株式会社爱发科 | 水反应性Al膜的制造方法及成膜室用构成部件 |
ITBA20130034A1 (it) * | 2013-04-30 | 2014-10-31 | Mrs S R L | Metodo per la pulizia di superfici in apparati di deposizione di film sottili da fase vapore e per il recupero del materiale rimosso |
SG11201700344QA (en) * | 2014-09-05 | 2017-03-30 | Ulvac Inc | WATER-REACTIVE Al COMPOSITE MATERIAL, WATER-REACTIVE Al ALLOY SPRAY FILM, METHOD FOR MANUFACTURING Al ALLOY SPRAY FILM AND CONSTITUENT MEMBER FOR FILM DEPOSITION CHAMBER |
JP6418854B2 (ja) * | 2014-09-05 | 2018-11-07 | 株式会社アルバック | 水反応性Al合金溶射膜の製造方法 |
JP6726523B2 (ja) * | 2016-05-10 | 2020-07-22 | 株式会社アルバック | 水分検出素子製造方法、水崩壊性配線膜製造方法、水崩壊性薄膜製造方法、水分検出素子 |
CN106702319A (zh) * | 2017-03-30 | 2017-05-24 | 京东方科技集团股份有限公司 | 一种蒸镀方法 |
CN109457206A (zh) * | 2018-11-30 | 2019-03-12 | 沈阳工程学院 | 一种生物质锅炉受热面防护涂层的制备方法 |
CN109576648A (zh) * | 2018-12-29 | 2019-04-05 | 福建华佳彩有限公司 | 一种防着板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1112727A (ja) * | 1997-06-26 | 1999-01-19 | Sumitomo Chem Co Ltd | アルミニウム合金単結晶ターゲット |
JP2002161325A (ja) * | 2000-11-20 | 2002-06-04 | Ulvac Japan Ltd | アルミニウム合金、水素ガス発生方法、水素ガス発生器及び発電機 |
JP4215965B2 (ja) * | 2001-04-27 | 2009-01-28 | エヌデーシー株式会社 | 軸受用アルミニウム基粉末焼結複合材料とその製造方法 |
JP4653406B2 (ja) | 2004-03-10 | 2011-03-16 | 株式会社アルバック | 水崩壊性Al複合材料、水崩壊性Al溶射膜、及び水崩壊性Al粉の製造方法、並びに成膜室用構成部材及び成膜材料の回収方法 |
US7393440B2 (en) * | 2005-05-09 | 2008-07-01 | National Research Council Of Canada | Hydrogen generation system |
EP2281915B1 (en) * | 2008-04-30 | 2014-04-16 | Ulvac, Inc. | Water-reactive al composite material, water-reactive al film, process for production of the al film, and constituent member for film deposition chamber |
CN102016099B (zh) * | 2008-04-30 | 2012-10-10 | 株式会社爱发科 | 水反应性Al膜的制造方法及成膜室用构成部件 |
WO2011052640A1 (ja) | 2009-10-29 | 2011-05-05 | 株式会社アルバック | 水反応性Al複合材料、水反応性Al膜、このAl膜の製造方法、及び成膜室用構成部材 |
-
2011
- 2011-08-12 DE DE112011102835.0T patent/DE112011102835B4/de active Active
- 2011-08-12 CN CN201180041807.4A patent/CN103228814B/zh active Active
- 2011-08-12 KR KR1020137007585A patent/KR101502253B1/ko active IP Right Grant
- 2011-08-12 US US13/818,253 patent/US8945296B2/en active Active
- 2011-08-12 WO PCT/JP2011/068443 patent/WO2012026349A1/ja active Application Filing
- 2011-08-12 MY MYPI2013000622A patent/MY157422A/en unknown
- 2011-08-12 SG SG2013012141A patent/SG188239A1/en unknown
- 2011-08-12 JP JP2012530625A patent/JP5517371B2/ja active Active
- 2011-08-26 TW TW100130684A patent/TWI473885B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR101502253B1 (ko) | 2015-03-12 |
DE112011102835B4 (de) | 2015-02-12 |
TWI473885B (zh) | 2015-02-21 |
US8945296B2 (en) | 2015-02-03 |
JP5517371B2 (ja) | 2014-06-11 |
WO2012026349A1 (ja) | 2012-03-01 |
CN103228814A (zh) | 2013-07-31 |
DE112011102835T5 (de) | 2013-06-13 |
TW201224167A (en) | 2012-06-16 |
CN103228814B (zh) | 2015-04-01 |
SG188239A1 (en) | 2013-04-30 |
US20130145961A1 (en) | 2013-06-13 |
DE112011102835T8 (de) | 2013-07-04 |
MY157422A (en) | 2016-06-15 |
KR20130065698A (ko) | 2013-06-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5517371B2 (ja) | 水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 | |
KR101235999B1 (ko) | 수붕괴성 Al 복합재료, 이 재료로 이루어지는 Al 막, Al 분말 및 이들의 제조방법, 그리고 막형성 챔버용 구성부재 및 막형성 재료의 회수방법 | |
JP5327758B2 (ja) | 溶射用水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 | |
JP5371966B2 (ja) | 水反応性Al膜の製造方法及び成膜室用構成部材 | |
JP5371964B2 (ja) | 水反応性Al膜の製造方法及び成膜室用構成部材 | |
JP5327759B2 (ja) | 溶射用水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 | |
JP5327760B2 (ja) | 溶射用水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 | |
JP5481492B2 (ja) | 水反応性Al複合材料、水反応性Al膜、このAl膜の製造方法、及び成膜室用構成部材 | |
JP6418854B2 (ja) | 水反応性Al合金溶射膜の製造方法 | |
JP5899387B1 (ja) | 水反応性Al複合材料、水反応性Al合金溶射膜、このAl合金溶射膜の製造方法、及び成膜室用構成部材 | |
JP5371965B2 (ja) | 溶射用水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131225 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140220 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140319 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140331 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5517371 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |