JP5481492B2 - 水反応性Al複合材料、水反応性Al膜、このAl膜の製造方法、及び成膜室用構成部材 - Google Patents
水反応性Al複合材料、水反応性Al膜、このAl膜の製造方法、及び成膜室用構成部材 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000015572 biosynthetic process Effects 0.000 title description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 71
- 229910052738 indium Inorganic materials 0.000 claims description 69
- 238000000034 method Methods 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 36
- 230000008021 deposition Effects 0.000 claims description 33
- 229910052720 vanadium Inorganic materials 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 26
- 229910052726 zirconium Inorganic materials 0.000 claims description 17
- 238000005507 spraying Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000012768 molten material Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 236
- 239000010949 copper Substances 0.000 description 94
- 239000012535 impurity Substances 0.000 description 83
- 238000010438 heat treatment Methods 0.000 description 36
- 238000000151 deposition Methods 0.000 description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 33
- 238000001514 detection method Methods 0.000 description 26
- 229910018117 Al-In Inorganic materials 0.000 description 22
- 229910018456 Al—In Inorganic materials 0.000 description 22
- 238000004090 dissolution Methods 0.000 description 21
- 230000000694 effects Effects 0.000 description 17
- 239000000470 constituent Substances 0.000 description 14
- 239000007788 liquid Substances 0.000 description 13
- 238000001953 recrystallisation Methods 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 12
- 238000007654 immersion Methods 0.000 description 12
- 239000007921 spray Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 9
- 238000007751 thermal spraying Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000010285 flame spraying Methods 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910002706 AlOOH Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
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- 239000007791 liquid phase Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Coating By Spraying Or Casting (AREA)
- Physical Vapour Deposition (AREA)
Description
2NAl、3NAl及び4NAlを用い、Inを添加したAl−In組成におけるAl純度と、Al中の不純物Cu量と、得られた溶射膜の溶解性との関係を検討した。Inの添加量は、Al重量基準である。
(b)3NAl(不純物Cu:70ppm)−3.0wt%In
(c)3NAl(不純物Cu:検出限界以下)−3.0wt%In
(d)4NAl(不純物Cu:検出限界以下)−3.0wt%In
(b)5NAl(不純物Cu:検出限界以下)−3.0wt%In
(c)4NAl(不純物Cu:検出限界以下)−3.0wt%In
(b)ULMAT産4NAl(不純物Cu:40ppm、Fe:40ppm、Si:80ppm、Ni:<10ppm)−3.5wt%In
(c)4NAl(不純物Cu:10ppm、Fe:60ppm、Si:100ppm、Ni:検出限界以下)−3.0wt%In
(d)ULMAT産4NAl(不純物Cu:40ppm、Fe:110ppm、Si:100ppm、Ni:<10ppm、C:30ppm)−3.0wt%In
(e)中国産3NAl(不純物Cu:70ppm、Fe:120ppm、Si:100ppm、Ni:30ppm)−3.0wt%In
(b)4NAl(不純物Cu:30ppm)−3.0wt%In−0.40wt%Ti
(c)4NAl(不純物Cu:40ppm)−3.0wt%In−0.56wt%Ti
(d)4NAl(不純物Cu:検出限界以下)−3.0wt%In
(e)4NAl(不純物Cu:30ppm)−3.5wt%In
(f)4NAl(不純物Cu:40ppm)−3.0wt%In
(b)2NAl(不純物Cu:検出限界以下)−3.0wt%In−0.15wt%Ti
(c)3NAl(不純物Cu:検出限界以下)−3.0wt%In
(d)3NAl(不純物Cu:検出限界以下)−3.0wt%In−0.11wt%Ti
(e)4NAl(不純物Cu:検出限界以下)−3.0wt%In
(f)4NAl(不純物Cu:検出限界以下)−3.0wt%In−0.13wt%Ti
(b)4NAl(不純物Cu:40ppm)−3.0wt%In−0.05wt%V
(c)4NAl(不純物Cu:40ppm)−3.0wt%In−0.17wt%Ti
(a)4NAl(不純物Cu:検出限界以下)−3.0wt%In
(b)4NAl(不純物Cu:40ppm)−3.0wt%In
(c)4NAl(不純物Cu:検出限界以下)−3.0wt%In(+0.001MのCuSO4)
(b)4NAl(不純物Cu:検出限界以下)−3.0wt%In(250℃)
(c)4NAl(不純物Cu:検出限界以下)−3.0wt%In(275℃)
(d)4NAl(不純物Cu:検出限界以下)−2.7wt%In−0.20wt%Ti(250℃)
(e)4NAl(不純物Cu:30ppm)−3.0wt%In−0.40wt%Ti(250℃)
(f)4NAl(不純物Cu:40ppm)−3.0wt%In−0.56wt%Ti(250℃)
(g)4NAl(不純物Cu:検出限界以下)−2.7wt%In−0.20wt%Ti(275℃)
(h)4NAl(不純物Cu:30ppm)−3.0wt%In−0.40wt%Ti(275℃)
(i)4NAl(不純物Cu:40ppm)−3.0wt%In−0.56wt%Ti(275℃)
(b)4NAl(不純物Cu:40ppm)−2.9wt%In−0.13wt%Ti
(c)4NAl(不純物Cu:40ppm)−3.3wt%In−0.28wt%Ti
(d)5NAl(不純物Cu:40ppm)−3.0wt%In
Claims (5)
- 2NAl〜5NAlから選ばれたAlに、Al基準で、2.0〜5.0wt%のIn、並びに0.05〜1.0wt%のTi、V、及びZrから選ばれた金属を添加してなることを特徴とする水反応性Al複合材料。
- 2NAl〜5NAlから選ばれたAlに、Al基準で、2.0〜5.0wt%のIn、並びに0.05〜1.0wt%のTi、V、及びZrから選ばれた金属を添加した材料を組成が均一になるように溶融し、この溶融材料を基材表面に対して大気雰囲気中で溶射し、その後大気雰囲気中にさらして凝固させることにより成膜することを特徴とする水反応性Al膜の製造方法。
- 請求項1記載の水反応性Al複合材料からなることを特徴とする水反応性Al膜。
- 請求項1記載の水反応性Al複合材料からなる水反応性Al膜又は請求項2記載の方法により製造された水反応性Al膜を表面に備えたことを特徴とする成膜装置の成膜室用構成部材。
- 前記構成部材が、防着板、シャッター又はマスクであることを特徴とする請求項4記載の成膜室用構成部材。
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JP2011538455A JP5481492B2 (ja) | 2009-10-29 | 2010-10-27 | 水反応性Al複合材料、水反応性Al膜、このAl膜の製造方法、及び成膜室用構成部材 |
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JP2009249510 | 2009-10-29 | ||
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JP2011538455A JP5481492B2 (ja) | 2009-10-29 | 2010-10-27 | 水反応性Al複合材料、水反応性Al膜、このAl膜の製造方法、及び成膜室用構成部材 |
PCT/JP2010/069074 WO2011052640A1 (ja) | 2009-10-29 | 2010-10-27 | 水反応性Al複合材料、水反応性Al膜、このAl膜の製造方法、及び成膜室用構成部材 |
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WO (1) | WO2011052640A1 (ja) |
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WO2012026349A1 (ja) * | 2010-08-27 | 2012-03-01 | 株式会社アルバック | 水反応性Al複合材料、水反応性Al溶射膜、このAl溶射膜の製造方法、及び成膜室用構成部材 |
JP7417367B2 (ja) * | 2019-05-27 | 2024-01-18 | アルバックテクノ株式会社 | 成膜装置用部品及びこれを備えた成膜装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1112727A (ja) * | 1997-06-26 | 1999-01-19 | Sumitomo Chem Co Ltd | アルミニウム合金単結晶ターゲット |
JP2002327222A (ja) * | 2001-04-27 | 2002-11-15 | Ndc Co Ltd | 軸受用アルミニウム基粉末焼結複合材料とその製造方法 |
JP2005256063A (ja) * | 2004-03-10 | 2005-09-22 | Ulvac Japan Ltd | 水崩壊性Al複合材料、この材料からなるAl膜、Al粉及びこれらの製造方法、並びに成膜室用構成部材及び成膜材料の回収方法 |
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- 2010-10-27 JP JP2011538455A patent/JP5481492B2/ja active Active
- 2010-10-27 WO PCT/JP2010/069074 patent/WO2011052640A1/ja active Application Filing
- 2010-10-29 TW TW99137241A patent/TW201134950A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1112727A (ja) * | 1997-06-26 | 1999-01-19 | Sumitomo Chem Co Ltd | アルミニウム合金単結晶ターゲット |
JP2002327222A (ja) * | 2001-04-27 | 2002-11-15 | Ndc Co Ltd | 軸受用アルミニウム基粉末焼結複合材料とその製造方法 |
JP2005256063A (ja) * | 2004-03-10 | 2005-09-22 | Ulvac Japan Ltd | 水崩壊性Al複合材料、この材料からなるAl膜、Al粉及びこれらの製造方法、並びに成膜室用構成部材及び成膜材料の回収方法 |
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JPWO2011052640A1 (ja) | 2013-03-21 |
TW201134950A (en) | 2011-10-16 |
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