JPWO2011148537A1 - 薄膜トランジスタ基板及びその製造方法 - Google Patents
薄膜トランジスタ基板及びその製造方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 117
- 239000010409 thin film Substances 0.000 title claims description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 239000003990 capacitor Substances 0.000 claims abstract description 205
- 239000004065 semiconductor Substances 0.000 claims abstract description 184
- 239000010408 film Substances 0.000 claims description 211
- 239000010410 layer Substances 0.000 claims description 207
- 238000000137 annealing Methods 0.000 claims description 38
- 239000011229 interlayer Substances 0.000 claims description 34
- 230000001681 protective effect Effects 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 16
- 239000011159 matrix material Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 24
- 229910007541 Zn O Inorganic materials 0.000 description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- 229910052719 titanium Inorganic materials 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
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Abstract
Description
図1〜図7は、本発明に係るTFT基板及びその製造方法の実施形態1を示している。具体的に、図1は、本実施形態のTFT基板30aの平面図であり、図2は、図1中のII−II線に沿ったTFT基板30aの断面図である。
図8〜図10は、本発明に係るTFT基板及びその製造方法の実施形態2を示している。具体的に、図8は、本実施形態のTFT基板30bの平面図であり、図9は、図8中のIX−IX線に沿ったTFT基板30bの断面図である。なお、以下の実施形態において、図1〜図7と同じ部分については同じ符号を付して、その詳細な説明を省略する。
R レジストパターン
5a,5b TFT
6a,6b 補助容量
10 絶縁基板
11a,21a ゲート線(ゲート電極)
11b,21b 容量線
12,22 ゲート絶縁膜
13a,23a 半導体層
13b,23b 他の半導体層
13c,23c 容量中間層
14 保護膜
15aa,24aa ソース電極
15b,24b ドレイン電極(容量電極)
17 画素電極
23 酸化物半導体膜
24 ソース金属膜
25 層間絶縁膜
25b コンタクトホール
26 画素電極(容量電極)
30a,30b TFT基板
Claims (7)
- マトリクス状に設けられた複数の画素電極と、
上記各画素電極毎にそれぞれ設けられ、該各画素電極に接続された複数の薄膜トランジスタと、
上記各画素電極毎にそれぞれ設けられた複数の補助容量とを備え、
上記各薄膜トランジスタが、基板に設けられたゲート電極と、該ゲート電極を覆うように設けられたゲート絶縁膜と、該ゲート絶縁膜上に上記ゲート電極に重なるようにチャネル領域が設けられた酸化物半導体からなる半導体層と、該半導体層上に上記チャネル領域を介して互いに離間するように設けられたソース電極及びドレイン電極とを備え、
上記各補助容量が、上記ゲート電極と同一層に同一材料により設けられた容量線と、該容量線を覆うように設けられた上記ゲート絶縁膜と、該ゲート絶縁膜上に上記容量線に重なるように上記酸化物半導体を用いて設けられた容量中間層と、該容量中間層上に設けられた容量電極とを備えた薄膜トランジスタ基板であって、
上記容量中間層は、導電性を有していることを特徴とする薄膜トランジスタ基板。 - 請求項1に記載された薄膜トランジスタ基板において、
上記容量電極は、上記ドレイン電極の一部であることを特徴とする薄膜トランジスタ基板。 - 請求項2に記載された薄膜トランジスタ基板において、
上記半導体層上には、上記チャネル領域を少なくとも覆うように保護膜が設けられ、
上記容量中間層は、上記保護膜から露出していることを特徴とする薄膜トランジスタ基板。 - 請求項1に記載された薄膜トランジスタ基板において、
上記容量電極は、上記各画素電極の一部であることを特徴とする薄膜トランジスタ基板。 - 請求項4に記載された薄膜トランジスタ基板において、
上記各薄膜トランジスタ上には、層間絶縁膜が設けられ、
上記容量中間層は、上記層間絶縁膜から露出していることを特徴とする薄膜トランジスタ基板。 - マトリクス状に設けられた複数の画素電極と、
上記各画素電極毎にそれぞれ設けられ、該各画素電極に接続された複数の薄膜トランジスタと、
上記各画素電極毎にそれぞれ設けられた複数の補助容量とを備え、
上記各薄膜トランジスタが、基板に設けられたゲート電極と、該ゲート電極を覆うように設けられたゲート絶縁膜と、該ゲート絶縁膜上に上記ゲート電極に重なるようにチャネル領域が設けられた酸化物半導体からなる半導体層と、該半導体層上に上記チャネル領域を介して互いに離間するように設けられたソース電極及びドレイン電極とを備え、
上記各補助容量が、上記ゲート電極と同一層に同一材料により設けられた容量線と、該容量線を覆うように設けられた上記ゲート絶縁膜と、該ゲート絶縁膜上に上記容量線に重なるように上記酸化物半導体を用いて設けられた容量中間層と、該容量中間層上に設けられた容量電極とを備えた薄膜トランジスタ基板を製造する方法であって、
基板に上記ゲート電極及び容量線を形成する第1工程と、
上記ゲート電極及び容量線を覆うように上記ゲート絶縁膜を形成した後に、該ゲート絶縁膜上に上記半導体層、及び上記容量中間層となる他の半導体層を形成する第2工程と、
上記チャネル領域に重なると共に、上記他の半導体層が露出するように保護膜を形成した後に、該保護膜から露出する上記他の半導体層を真空アニール処理により導体化して、上記容量中間層を形成する第3工程と、
上記半導体層上に上記ソース電極、及び上記容量電極として機能する上記ドレイン電極を形成する第4工程と、
上記ソース電極及びドレイン電極上に、該ドレイン電極に到達するコンタクトホールを有する層間絶縁膜を形成する第5工程と、
上記層間絶縁膜上に上記各画素電極を形成する第6工程とを備えることを特徴とする薄膜トランジスタ基板の製造方法。 - マトリクス状に設けられた複数の画素電極と、
上記各画素電極毎にそれぞれ設けられ、該各画素電極に接続された複数の薄膜トランジスタと、
上記各画素電極毎にそれぞれ設けられた複数の補助容量とを備え、
上記各薄膜トランジスタが、基板に設けられたゲート電極と、該ゲート電極を覆うように設けられたゲート絶縁膜と、該ゲート絶縁膜上に上記ゲート電極に重なるようにチャネル領域が設けられた酸化物半導体からなる半導体層と、該半導体層上に上記チャネル領域を介して互いに離間するように設けられたソース電極及びドレイン電極とを備え、
上記各補助容量が、上記ゲート電極と同一層に同一材料により設けられた容量線と、該容量線を覆うように設けられた上記ゲート絶縁膜と、該ゲート絶縁膜上に上記容量線に重なるように上記酸化物半導体を用いて設けられた容量中間層と、該容量中間層上に設けられた容量電極とを備えた薄膜トランジスタ基板を製造する方法であって、
基板に上記ゲート電極及び容量線を形成する第1工程と、
上記ゲート電極及び容量線を覆うように上記ゲート絶縁膜、酸化物半導体膜及びソース金属膜を順に形成した後に、該ソース金属膜上に、上記ソース電極及びドレイン電極となる部分が相対的に厚く、且つ、上記チャネル領域及び容量中間層となる部分が相対的に薄いレジストパターンを形成し、続いて、該レジストパターンから露出する上記ソース金属膜及び酸化物半導体膜をエッチングした後に、該レジストパターンを薄肉化することにより上記相対的に薄い部分を除去して露出させた上記ソース金属膜をエッチングして、上記半導体層、ソース電極及びドレイン電極、並びに上記容量中間層となる他の半導体層を形成する第2工程と、
上記半導体層のチャネル領域に重なると共に、上記ドレイン電極の一部及び上記他の半導体層が露出するように層間絶縁膜を形成した後に、該層間絶縁膜から露出する上記他の半導体層を真空アニール処理により導体化して、上記容量中間層を形成する第3工程と、
上記層間絶縁膜上に上記容量電極として機能する上記各画素電極を形成する第4工程とを備えることを特徴とする薄膜トランジスタ基板の製造方法。
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