JPWO2011125506A1 - 応力緩衝層及びその作製方法 - Google Patents
応力緩衝層及びその作製方法 Download PDFInfo
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- JPWO2011125506A1 JPWO2011125506A1 JP2012509424A JP2012509424A JPWO2011125506A1 JP WO2011125506 A1 JPWO2011125506 A1 JP WO2011125506A1 JP 2012509424 A JP2012509424 A JP 2012509424A JP 2012509424 A JP2012509424 A JP 2012509424A JP WO2011125506 A1 JPWO2011125506 A1 JP WO2011125506A1
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- stress buffer
- internal electrode
- oxide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
金属であることが好ましく、Au,CuやAgなどが利用される。なお、上述したように、本実施例の応力緩衝シート10を搭載した状態でチップ(電子部品)を提供できると、ユーザ側での実装プロセスの変更を必要としないため、好ましい。あるいは、チップのパッド(端子部)上に、内部電極14を直接形成してもよい。更に、応力緩衝シート10の化学的/機械的強度を確保するため、内部電極14と外部導体層16A,16Bの間に、他の導体を挿入してもよい。
Claims (7)
- 弁金属の陽極酸化物よりもヤング率が小さい絶縁材料からなる絶縁材料層によって上面及び下面が覆われ、前記上面及び下面を貫く多数の貫通孔が設けられた板状の基材と、前記多数の貫通孔に充填され、電子部品と直接又は間接に導電接続される内部電極と、を備える応力緩衝層であって、 前記内部電極の両端が、前記電子部品と接続される前の時点で、前記基材の上面及び下面と実質的に面一に形成されている応力緩衝層。
- 前記板状の基材が、前記絶縁材料層の間に、弁金属の陽極酸化物よりなる酸化物層を備える請求項1記載の応力緩衝層。
- 前記絶縁材料が、樹脂である請求項1又は2に記載の応力緩衝層。
- 前記板状の基材の上面又は下面の少なくとも一方に設けられ、前記多数の内部電極のうちの少なくとも一つと導電接続される外部導体層をさらに備える請求項1又は2に記載の応力緩衝層。
- 弁金属の陽極酸化により得られ、その上面と下面とが多数の貫通孔により貫かれた酸化物基材を準備する工程と、 前記多数の貫通孔に内部電極を充填する工程と、 前記酸化物基材の上面と下面の少なくとも一部を除去する工程と、 少なくとも前記酸化物基材が除去された部分に、前記酸化物基材よりもヤング率の小さな絶縁材料からなる絶縁材料層を、前記内部電極の端部を覆うように設ける工程と、 前記絶縁材料層の一部を除去し、前記内部電極の両端を露出させる工程と、 を備える応力緩衝層の作製方法。
- 前記絶縁材料層表面に、前記内部電極の端部と導電接続されるように外部導体層を設ける工程をさらに含む請求項5に記載の応力緩衝層の作製方法。
- 弁金属の陽極酸化により得られ、その上面と下面とが多数の貫通孔により貫かれた酸化物基材を準備する工程と、 前記多数の貫通孔に内部電極を充填する工程と、 前記酸化物基材の上面及び下面に、前記内部電極の両端と導電接続されるように外部導体層を設ける工程と、 前記酸化物基材の少なくとも一部を除去する工程と、 少なくとも前記酸化物基材が除去された部分に、前記酸化物基材よりもヤング率の小さな絶縁材料からなる絶縁材料層を設ける工程と、 を備える応力緩衝層の作製方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012509424A JP5362104B2 (ja) | 2010-03-31 | 2011-03-24 | 応力緩衝層及びその作製方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010082313 | 2010-03-31 | ||
JP2010082313 | 2010-03-31 | ||
PCT/JP2011/057099 WO2011125506A1 (ja) | 2010-03-31 | 2011-03-24 | 応力緩衝層及びその作製方法 |
JP2012509424A JP5362104B2 (ja) | 2010-03-31 | 2011-03-24 | 応力緩衝層及びその作製方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2011125506A1 true JPWO2011125506A1 (ja) | 2013-07-08 |
JP5362104B2 JP5362104B2 (ja) | 2013-12-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012509424A Active JP5362104B2 (ja) | 2010-03-31 | 2011-03-24 | 応力緩衝層及びその作製方法 |
Country Status (3)
Country | Link |
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US (1) | US9161438B2 (ja) |
JP (1) | JP5362104B2 (ja) |
WO (1) | WO2011125506A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9226396B2 (en) * | 2013-03-12 | 2015-12-29 | Invensas Corporation | Porous alumina templates for electronic packages |
JP6376761B2 (ja) * | 2014-01-31 | 2018-08-22 | 日本航空電子工業株式会社 | 中継部材及び中継部材の製造方法 |
WO2016098865A1 (ja) * | 2014-12-19 | 2016-06-23 | 富士フイルム株式会社 | 多層配線基板 |
US10170455B2 (en) * | 2015-09-04 | 2019-01-01 | PlayNitride Inc. | Light emitting device with buffer pads |
JP6332330B2 (ja) * | 2016-05-20 | 2018-05-30 | 日亜化学工業株式会社 | 配線基体の製造方法及びそれを用いた発光装置の製造方法並びに配線基体及びそれを用いた発光装置。 |
JP7080879B2 (ja) * | 2017-05-18 | 2022-06-06 | 信越ポリマー株式会社 | 電気コネクターおよびその製造方法 |
CN110783728A (zh) * | 2018-11-09 | 2020-02-11 | 广州方邦电子股份有限公司 | 一种柔性连接器及制作方法 |
CN110783727A (zh) * | 2018-11-09 | 2020-02-11 | 广州方邦电子股份有限公司 | 一种连接器及制作方法 |
KR20220014680A (ko) * | 2020-07-29 | 2022-02-07 | (주)포인트엔지니어링 | 양극산화막 기판 베이스, 이를 구비하는 양극산화막 기판부, 이를 구비하는 양극산화막 기반 인터포저 및 이를 구비하는 반도체 패키지 |
CN114496350B (zh) * | 2020-10-23 | 2024-05-03 | 荣耀终端有限公司 | 一种电极、电子器件和装置 |
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JP3154713B2 (ja) | 1990-03-16 | 2001-04-09 | 株式会社リコー | 異方性導電膜およびその製造方法 |
JPH03285213A (ja) | 1990-03-30 | 1991-12-16 | Ricoh Co Ltd | 異方性導電膜の製造方法 |
JPH1050145A (ja) * | 1996-08-07 | 1998-02-20 | Mitsubishi Materials Corp | 異方性導電膜及びその製造方法 |
JP5119678B2 (ja) | 2007-02-20 | 2013-01-16 | 富士通株式会社 | 実装構造、接続部材の製造方法、および半導体装置 |
JP5056085B2 (ja) | 2007-03-09 | 2012-10-24 | 日本電気株式会社 | 電子部品の実装構造 |
JP2008244311A (ja) | 2007-03-28 | 2008-10-09 | Furukawa Electric Co Ltd:The | 半導体パッケージ基板及び半導体装置 |
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2011
- 2011-03-24 WO PCT/JP2011/057099 patent/WO2011125506A1/ja active Application Filing
- 2011-03-24 JP JP2012509424A patent/JP5362104B2/ja active Active
- 2011-03-24 US US13/638,518 patent/US9161438B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2011125506A1 (ja) | 2011-10-13 |
US20130092424A1 (en) | 2013-04-18 |
US9161438B2 (en) | 2015-10-13 |
JP5362104B2 (ja) | 2013-12-11 |
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