JPWO2009093498A1 - Ｌｅｄパッケージおよびその製造方法 - Google Patents

Ｌｅｄパッケージおよびその製造方法 Download PDF

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Publication number
JPWO2009093498A1
JPWO2009093498A1 JP2009550493A JP2009550493A JPWO2009093498A1 JP WO2009093498 A1 JPWO2009093498 A1 JP WO2009093498A1 JP 2009550493 A JP2009550493 A JP 2009550493A JP 2009550493 A JP2009550493 A JP 2009550493A JP WO2009093498 A1 JPWO2009093498 A1 JP WO2009093498A1
Authority
JP
Japan
Prior art keywords
reflector
led package
substrate
led
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009550493A
Other languages
English (en)
Japanese (ja)
Inventor
伊藤　直樹
直樹 伊藤
正巳 相原
正巳 相原
和貴 伊勢
和貴 伊勢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of JPWO2009093498A1 publication Critical patent/JPWO2009093498A1/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2009550493A 2008-01-22 2009-01-13 Ｌｅｄパッケージおよびその製造方法 Withdrawn JPWO2009093498A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008011027 2008-01-22
JP2008011027 2008-01-22
PCT/JP2009/050297 WO2009093498A1 (ja) 2008-01-22 2009-01-13 Ｌｅｄパッケージおよびその製造方法

Publications (1)

Publication Number Publication Date
JPWO2009093498A1 true JPWO2009093498A1 (ja) 2011-05-26

Family

ID=40901006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009550493A Withdrawn JPWO2009093498A1 (ja) 2008-01-22 2009-01-13 Ｌｅｄパッケージおよびその製造方法

Country Status (3)

Country Link
JP (1) JPWO2009093498A1 (zh)
TW (1) TW200943590A (zh)
WO (1) WO2009093498A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101615497B1 (ko) * 2009-11-27 2016-04-27 삼성전자주식회사 발광소자 패키지 및 그 제조방법
TWI403007B (zh) * 2010-02-09 2013-07-21 Everlight Electronics Co Ltd 發光二極體封裝結構及其製作方法
DE102010032041A1 (de) 2010-07-23 2012-01-26 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zur Herstellung von strahlungsemittierenden Bauelemnenten
JP2013183078A (ja) * 2012-03-02 2013-09-12 Asahi Rubber Inc レンズ付きｌｅｄ装置及び多方向照明装置
JP5976406B2 (ja) * 2012-06-11 2016-08-23 シチズンホールディングス株式会社 半導体発光装置
WO2014104913A1 (en) 2012-12-27 2014-07-03 Optogan New Technologies Of Light Llc Module with light-emitting diodes
WO2018066418A1 (ja) * 2016-10-04 2018-04-12 株式会社エンプラス 光束制御部材、発光装置および照明装置
JP2018061024A (ja) * 2016-10-04 2018-04-12 株式会社エンプラス 光束制御部材、発光装置および照明装置
JP2018207005A (ja) * 2017-06-07 2018-12-27 シチズン電子株式会社 発光装置及びその製造方法並びに面状ライトユニット
JP7164315B2 (ja) * 2018-04-03 2022-11-01 シチズン電子株式会社 発光装置
GB2574577B (en) * 2018-04-27 2022-07-13 Thorn Lighting Ltd Optical element for distributing light

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0918058A (ja) * 1995-06-29 1997-01-17 Sharp Corp 発光半導体装置
JPH11237850A (ja) * 1998-02-23 1999-08-31 Nokeg & G Opt Electronics Kk Ｌｅｄ表示装置
JP3349109B2 (ja) * 1999-03-04 2002-11-20 株式会社シチズン電子 表面実装型発光ダイオード及びその製造方法
JP2000299500A (ja) * 1999-04-15 2000-10-24 Mayumi Ishida 発光ダイオード
JP4082544B2 (ja) * 1999-12-24 2008-04-30 ローム株式会社 裏面実装チップ型発光装置
JP4789350B2 (ja) * 2001-06-11 2011-10-12 シチズン電子株式会社 発光ダイオードの製造方法
JP4230198B2 (ja) * 2002-11-12 2009-02-25 シチズン電子株式会社 面状光源及び液晶表示装置
JP4400786B2 (ja) * 2004-06-11 2010-01-20 シチズン電子株式会社 発光ダイオード

Also Published As

Publication number Publication date
WO2009093498A1 (ja) 2009-07-30
TW200943590A (en) 2009-10-16

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