TW200943590A - Led package and manufacturing method therefor - Google Patents

Led package and manufacturing method therefor

Info

Publication number
TW200943590A
TW200943590A TW098100359A TW98100359A TW200943590A TW 200943590 A TW200943590 A TW 200943590A TW 098100359 A TW098100359 A TW 098100359A TW 98100359 A TW98100359 A TW 98100359A TW 200943590 A TW200943590 A TW 200943590A
Authority
TW
Taiwan
Prior art keywords
led package
reflector
manufacturing
light
metal reflection
Prior art date
Application number
TW098100359A
Other languages
English (en)
Inventor
Naoki Ito
Masami Aihara
Kazutaka Ise
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of TW200943590A publication Critical patent/TW200943590A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
TW098100359A 2008-01-22 2009-01-07 Led package and manufacturing method therefor TW200943590A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008011027 2008-01-22

Publications (1)

Publication Number Publication Date
TW200943590A true TW200943590A (en) 2009-10-16

Family

ID=40901006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098100359A TW200943590A (en) 2008-01-22 2009-01-07 Led package and manufacturing method therefor

Country Status (3)

Country Link
JP (1) JPWO2009093498A1 (zh)
TW (1) TW200943590A (zh)
WO (1) WO2009093498A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403007B (zh) * 2010-02-09 2013-07-21 Everlight Electronics Co Ltd 發光二極體封裝結構及其製作方法
CN107893974A (zh) * 2016-10-04 2018-04-10 恩普乐股份有限公司 光束控制部件、发光装置以及照明装置
US10520163B2 (en) 2016-10-04 2019-12-31 Enplas Corporation Light bundle control member, light emitting device, and illuminating device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101615497B1 (ko) * 2009-11-27 2016-04-27 삼성전자주식회사 발광소자 패키지 및 그 제조방법
DE102010032041A1 (de) * 2010-07-23 2012-01-26 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zur Herstellung von strahlungsemittierenden Bauelemnenten
JP2013183078A (ja) * 2012-03-02 2013-09-12 Asahi Rubber Inc レンズ付きｌｅｄ装置及び多方向照明装置
JP5976406B2 (ja) * 2012-06-11 2016-08-23 シチズンホールディングス株式会社 半導体発光装置
WO2014104913A1 (en) 2012-12-27 2014-07-03 Optogan New Technologies Of Light Llc Module with light-emitting diodes
JP2018207005A (ja) * 2017-06-07 2018-12-27 シチズン電子株式会社 発光装置及びその製造方法並びに面状ライトユニット
JP7164315B2 (ja) * 2018-04-03 2022-11-01 シチズン電子株式会社 発光装置
GB2574577B (en) * 2018-04-27 2022-07-13 Thorn Lighting Ltd Optical element for distributing light

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0918058A (ja) * 1995-06-29 1997-01-17 Sharp Corp 発光半導体装置
JPH11237850A (ja) * 1998-02-23 1999-08-31 Nokeg & G Opt Electronics Kk Ｌｅｄ表示装置
JP3349109B2 (ja) * 1999-03-04 2002-11-20 株式会社シチズン電子 表面実装型発光ダイオード及びその製造方法
JP2000299500A (ja) * 1999-04-15 2000-10-24 Mayumi Ishida 発光ダイオード
JP4082544B2 (ja) * 1999-12-24 2008-04-30 ローム株式会社 裏面実装チップ型発光装置
JP4789350B2 (ja) * 2001-06-11 2011-10-12 シチズン電子株式会社 発光ダイオードの製造方法
JP4230198B2 (ja) * 2002-11-12 2009-02-25 シチズン電子株式会社 面状光源及び液晶表示装置
JP4400786B2 (ja) * 2004-06-11 2010-01-20 シチズン電子株式会社 発光ダイオード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403007B (zh) * 2010-02-09 2013-07-21 Everlight Electronics Co Ltd 發光二極體封裝結構及其製作方法
CN107893974A (zh) * 2016-10-04 2018-04-10 恩普乐股份有限公司 光束控制部件、发光装置以及照明装置
US10520163B2 (en) 2016-10-04 2019-12-31 Enplas Corporation Light bundle control member, light emitting device, and illuminating device

Also Published As

Publication number Publication date
JPWO2009093498A1 (ja) 2011-05-26
WO2009093498A1 (ja) 2009-07-30

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