JPWO2008059789A1 - 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法 - Google Patents

銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法 Download PDF

Info

Publication number
JPWO2008059789A1
JPWO2008059789A1 JP2008544126A JP2008544126A JPWO2008059789A1 JP WO2008059789 A1 JPWO2008059789 A1 JP WO2008059789A1 JP 2008544126 A JP2008544126 A JP 2008544126A JP 2008544126 A JP2008544126 A JP 2008544126A JP WO2008059789 A1 JPWO2008059789 A1 JP WO2008059789A1
Authority
JP
Japan
Prior art keywords
fine powder
silver
copper fine
plated copper
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008544126A
Other languages
English (en)
Japanese (ja)
Inventor
隆宏 芳賀
隆宏 芳賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Publication of JPWO2008059789A1 publication Critical patent/JPWO2008059789A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Chemically Coating (AREA)
JP2008544126A 2006-11-17 2007-11-12 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法 Pending JPWO2008059789A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006311507 2006-11-17
JP2006311507 2006-11-17
PCT/JP2007/071907 WO2008059789A1 (fr) 2006-11-17 2007-11-12 Fine poudre de cuivre plaquée argent, pâte conductrice produite à partir d'une fine poudre de cuivre plaquée argent, et procédé pour produire une fine poudre de cuivre plaquée argent

Publications (1)

Publication Number Publication Date
JPWO2008059789A1 true JPWO2008059789A1 (ja) 2010-03-04

Family

ID=39401597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008544126A Pending JPWO2008059789A1 (ja) 2006-11-17 2007-11-12 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法

Country Status (3)

Country Link
JP (1) JPWO2008059789A1 (fr)
TW (1) TW200831214A (fr)
WO (1) WO2008059789A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5402350B2 (ja) * 2009-07-24 2014-01-29 藤倉化成株式会社 導電性ペーストの製造方法および導電性ペースト
JP5571435B2 (ja) * 2010-03-31 2014-08-13 Ｊｘ日鉱日石金属株式会社 銀メッキ銅微粉の製造方法
JP5695879B2 (ja) * 2010-10-25 2015-04-08 石原ケミカル株式会社 スズめっき銅粉の製造方法
JP5576318B2 (ja) * 2011-03-01 2014-08-20 三井金属鉱業株式会社 銅粒子
CN102773475B (zh) * 2012-07-31 2014-06-11 东南大学 一种导电浆料用抗氧化铜银复合粉及其制备方法
CN104797360A (zh) * 2012-10-03 2015-07-22 户田工业株式会社 银混合铜粉及其制造方法、含有该银混合铜粉的导电性膏、导电性粘合剂、导电性膜和电气回路
JP2014208908A (ja) * 2013-03-29 2014-11-06 Ｄｏｗａエレクトロニクス株式会社 銀コート銅粉、銀コート銅粉の製造方法および樹脂硬化型導電性ペースト
JP6258616B2 (ja) * 2013-07-16 2018-01-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅合金粉末およびその製造方法
CN103752842A (zh) * 2013-11-11 2014-04-30 南京工业大学 置换与化学沉积复合法制备纳米银包铜粉末
JP2015183291A (ja) * 2014-03-26 2015-10-22 三井金属鉱業株式会社 銀被覆銅粉及びこれを用いた導電性ペースト
MX2016013818A (es) 2014-04-23 2017-05-30 Alpha Metals Metodo para la fabricacion de polvo metalico.
JP6956459B2 (ja) * 2015-03-19 2021-11-02 Ｄｏｗａエレクトロニクス株式会社 銀被覆金属粉末およびその製造方法
CN105903980A (zh) * 2016-05-16 2016-08-31 深圳市微纳集成电路与系统应用研究院 铜纳米粉及其制备方法，银包铜粉末及其制备方法
CN107626917B (zh) * 2017-09-15 2022-02-22 烟台屹海新材料科技有限公司 一种镀银铜粉的制备方法
CN109773212B (zh) * 2019-03-29 2022-05-20 金陵科技学院 一种适用于大功率封装抗氧化镀银铜焊膏的制备方法
CN111872376B (zh) * 2020-07-21 2022-10-04 云南铜业科技发展股份有限公司 一种抗氧化性高的银包覆微合金化铜粉制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06240463A (ja) * 1993-02-22 1994-08-30 Mitsubishi Paper Mills Ltd 金属微粉末の無電解銀鍍金方法
JPH10212501A (ja) * 1997-01-28 1998-08-11 Dowa Mining Co Ltd 被覆粉体、銀被覆銅粉及びその製造方法、導電性ペースト並びに導電膜
JP2000248303A (ja) * 1999-03-03 2000-09-12 Dowa Mining Co Ltd 銀被覆銅粉の製法
JP2002245849A (ja) * 2001-02-13 2002-08-30 Dowa Mining Co Ltd 導電ペースト用の導電フイラーおよびその製法
JP2003147316A (ja) * 2001-11-16 2003-05-21 Hitachi Chem Co Ltd 接着用樹脂ペースト組成物及びこれを用いた半導体装置
JP2004052044A (ja) * 2002-07-19 2004-02-19 Mitsui Mining & Smelting Co Ltd 銀コート銅粉及びその製造方法
JP2005044798A (ja) * 2003-07-08 2005-02-17 Hitachi Chem Co Ltd 導電粉及びその製造方法
JP2006161081A (ja) * 2004-12-03 2006-06-22 Dowa Mining Co Ltd 銀被覆銅粉およびその製造方法並びに導電ペースト

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06240463A (ja) * 1993-02-22 1994-08-30 Mitsubishi Paper Mills Ltd 金属微粉末の無電解銀鍍金方法
JPH10212501A (ja) * 1997-01-28 1998-08-11 Dowa Mining Co Ltd 被覆粉体、銀被覆銅粉及びその製造方法、導電性ペースト並びに導電膜
JP2000248303A (ja) * 1999-03-03 2000-09-12 Dowa Mining Co Ltd 銀被覆銅粉の製法
JP2002245849A (ja) * 2001-02-13 2002-08-30 Dowa Mining Co Ltd 導電ペースト用の導電フイラーおよびその製法
JP2003147316A (ja) * 2001-11-16 2003-05-21 Hitachi Chem Co Ltd 接着用樹脂ペースト組成物及びこれを用いた半導体装置
JP2004052044A (ja) * 2002-07-19 2004-02-19 Mitsui Mining & Smelting Co Ltd 銀コート銅粉及びその製造方法
JP2005044798A (ja) * 2003-07-08 2005-02-17 Hitachi Chem Co Ltd 導電粉及びその製造方法
JP2006161081A (ja) * 2004-12-03 2006-06-22 Dowa Mining Co Ltd 銀被覆銅粉およびその製造方法並びに導電ペースト

Also Published As

Publication number Publication date
TWI349589B (fr) 2011-10-01
WO2008059789A1 (fr) 2008-05-22
TW200831214A (en) 2008-08-01

Similar Documents

Publication Publication Date Title
JP5394084B2 (ja) 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法
JPWO2008059789A1 (ja) 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法
JP5785532B2 (ja) 銀コート銅粉及びその製造方法
JP5571435B2 (ja) 銀メッキ銅微粉の製造方法
CN109423637B (zh) 一种高导电材料的制备方法
JP2016176093A (ja) 銀被覆金属粉末およびその製造方法
JP6159505B2 (ja) 扁平銅粒子
JP6567921B2 (ja) 銀被覆銅粉およびその製造方法
JP4078410B2 (ja) 銀拡散銅粉の製法
JP6549924B2 (ja) 銀コート銅粉及びその製造方法
CN112643026A (zh) 一种银包镍粉的制备方法
JP4881013B2 (ja) 導電性粉末、導電性ペーストおよび電気回路
JP5576319B2 (ja) 銅粒子
CN108213415B (zh) 耐腐蚀耐高温银铜包覆粉的生产方法
JP5785433B2 (ja) 低炭素銅粒子
US20180264548A1 (en) Silver Coated Copper Flakes and Methods of Their Manufacture
JP2014198893A (ja) 銀粉およびその製造方法並びにペースト、電子回路部品、電気製品
JP4644765B2 (ja) 銀拡散銅粉およびその製法並びにそれを用いた導電ペースト
WO2014115614A1 (fr) Poudre de cuivre
JP4012961B2 (ja) 板状銅粉の製法
JP2005068508A (ja) 無機超微粒子コート金属粉及びその製造方法
KR20200066066A (ko) 수축률 조절이 가능한 은 분말의 제조방법
JP6179423B2 (ja) 硫黄含有ニッケル粉末の製造方法
JP2004183060A (ja) ポリアニリン系樹脂コート銅粉並びにそのポリアニリン系樹脂コート銅粉の製造方法及びそのポリアニリン系樹脂コート銅粉を用いた導電性ペースト
TWI553661B (zh) Silver powder and its use of conductive paste, conductive paint, conductive film

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20100820

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120626

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121023