JPWO2006090658A1 - 配線基板用積層体 - Google Patents
配線基板用積層体 Download PDFInfo
- Publication number
- JPWO2006090658A1 JPWO2006090658A1 JP2007504697A JP2007504697A JPWO2006090658A1 JP WO2006090658 A1 JPWO2006090658 A1 JP WO2006090658A1 JP 2007504697 A JP2007504697 A JP 2007504697A JP 2007504697 A JP2007504697 A JP 2007504697A JP WO2006090658 A1 JPWO2006090658 A1 JP WO2006090658A1
- Authority
- JP
- Japan
- Prior art keywords
- polyimide resin
- laminate
- resin layer
- polyimide
- dianhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Abstract
Description
(式中Ar1は芳香環を1個以上有する4価の有機基であり、Rは炭素数2〜6の炭化水素基である。)
・PMDA:ピロメリット酸二無水物
・BPDA:3,3',4,4'-ビフェニルテトラカルボン酸二無水物
・m-EB:2,2'-ジエチル-4,4'-ジアミノビフェニル
・m-TB:2,2'-ジメチル-4,4'-ジアミノビフェニル
・m-NPB:2,2'-ジ-n-プロピル-4,4'-ジアミノビフェニル
・DAPE:4,4 ’-ジアミノジフェニルエーテル
・TPE-R:1,3-ビス(4-アミノフェノキシ)ベンゼン
・BAPP:2,2 ’-ビス(4-アミノフェノキシフェニル)プロパン
・DMF:N,N-ジメチルホルムアミド
・DMAc:N,N-ジメチルアセトアミド
[ガラス転移温度(Tg)、貯蔵弾性率(E')]
各実施例で得たポリイミドフィルム(10mm×22.6mm)を動的熱機械分析装置(DMA)にて20℃から500℃まで5℃/分で昇温させたときの動的粘弾性を測定し、ガラス転移温度(tanδ極大値)及び23℃での貯蔵弾性率(E')を求めた。
3mm ×15mmのサイズのポリイミドフィルムを、熱機械分析(TMA)装置にて5.0gの荷重を加えながら一定の昇温速度で30℃から260℃の温度範囲で引張り試験を行った。温度に対するポリイミドフィルムの伸び量から線膨張係数を測定した。
窒素雰囲気下で10〜20mgの重さのポリイミドフィルムを、熱重量分析(TG)装置にて一定の速度で30℃から550℃まで昇温させたときの重量変化を測定し、5%重量減少温度(Td5%)を求めた。
4cm×20cmのポリイミドフィルム(各3枚)を、120℃で2時間乾燥した後、23℃/50%RHの恒温恒湿機に2 4時間以上静置し、その前後の重量変化から次式により求めた。
吸湿率(%)=[(吸湿後重量-乾燥後重量)/乾燥後重量]×100
35cm×35cmのポリイミド/銅箔積層体の銅箔上にエッチングレジスト層を設け、これを一辺が30cmの正方形の四辺に10cm間隔で直径1mmの点が12箇所配置するパターンに形成した。エッチングレジスト開孔部の銅箔露出部分をエッチングし、12箇所の銅箔残存点を有するCHE測定用ポリイミドフィルムを得た。このフィルムを120℃で2時間乾燥した後、23℃/50%RHの恒温恒湿機で24時間以上静置し、二次元測長機により湿度による銅箔点間の寸法変化を測定して、湿度線膨張係数を求めた。
5cm×5cmのフィルムサンプルを用意して、23℃、50%RHの恒温恒湿室中、マイクロ波方式分子配向計MOA-6015を用い、周波数15GHzで誘電率を測定した。
接着力は、テンションテスターを用い、幅10mmの銅張品の樹脂側を両面テープによりアルミ板に固定し、銅を180°方向に50mm/minの速度で剥離して求めた。
実施例及び比較例で使用するポリアミド酸A〜Nを合成した。
窒素気流下で、表1に示したジアミンを500mlのセパラブルフラスコの中で攪拌しながら溶剤DMAc100gに溶解させた。次いで、表1に示したテトラカルボン酸二無水物を加えた。必要により粘度調整のため、DMAcを追加した。その後、溶液を室温で4時間攪拌を続けて重合反応を行い、ポリイミド前駆体となる14種類のポリアミド酸A〜Nの黄〜茶褐色の粘稠な溶液を得た。それぞれのポリアミド酸溶液の重量平均分子量(Mw)は100,000以上であり、高重合度のポリアミド酸が生成されていることが確認された。ポリアミド酸の固形分と溶液粘度を表1に示した。ここで、固形分はポリアミド酸と溶剤の合計量に対するポリアミド酸の重量比率である。溶液粘度はE型粘度計を用い測定した。
合成例13で得たポリアミド酸Mの溶液を使用した他は、上記と同様にして積層体を得た。この積層体を比較例1の積層体Mとする。合成例14で得たポリアミド酸Nの溶液を使用した他は、上記と同様にして積層体を得た。この積層体を比較例2の積層体Nとする。
測定結果を、表2に示す。
18μm厚み銅箔を使用し、この銅箔上に合成例12で調製したポリアミド酸Lの溶液を25μmの厚みで均一に塗布したのち、130℃で加熱乾燥し溶剤を除去した。次に、その上に積層するように合成例6で調製したポリアミド酸Fの溶液を195μmの厚みで均一に塗布し、70℃〜130℃で加熱乾燥し溶剤を除去した。更に、ポリアミド酸F層上に合成例12で調製したポリアミド酸Lの溶液を37μmの厚みで均一に塗布し、140℃で加熱乾燥し溶剤を除去した。この後、室温から360℃まで約5hrかけて熱処理しイミド化させ、3層のポリイミド系樹脂層からなる合計厚み約25μmの絶縁樹脂層が銅箔上に形成された積層体M1を得た。銅箔上に塗布したポリアミド酸の乾燥後厚みは、L/F/Lの順に、約2.5μm/約19μm/約3.5μmである。
実施例12と同様にして、3層のポリイミド系樹脂層からなる層合計厚み約25μmの絶縁樹脂層が銅箔上に形成された積層体M2及びM3を得た。銅箔上に塗布したポリアミド酸種類と乾燥後厚みは、順に、積層体M2はL約2.5μm/ C約19μm/ L約3.5μmであり、積層体M3はL約2.5μm/H約19μm/ L約3.5μmである。
測定結果を、表3に示す。
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007504697A JP4757864B2 (ja) | 2005-02-23 | 2006-02-20 | フレキシブルプリント配線基板用積層体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005046492 | 2005-02-23 | ||
JP2005046492 | 2005-02-23 | ||
PCT/JP2006/302934 WO2006090658A1 (ja) | 2005-02-23 | 2006-02-20 | 配線基板用積層体 |
JP2007504697A JP4757864B2 (ja) | 2005-02-23 | 2006-02-20 | フレキシブルプリント配線基板用積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006090658A1 true JPWO2006090658A1 (ja) | 2008-07-24 |
JP4757864B2 JP4757864B2 (ja) | 2011-08-24 |
Family
ID=36927298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007504697A Expired - Fee Related JP4757864B2 (ja) | 2005-02-23 | 2006-02-20 | フレキシブルプリント配線基板用積層体 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4757864B2 (ja) |
KR (1) | KR101170201B1 (ja) |
TW (1) | TW200642537A (ja) |
WO (1) | WO2006090658A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI422645B (zh) * | 2007-03-30 | 2014-01-11 | Nippon Steel & Sumikin Chem Co | 聚醯亞胺膜 |
JP4834593B2 (ja) * | 2007-03-30 | 2011-12-14 | 日本発條株式会社 | ディスク装置用サスペンション |
CN102290054B (zh) * | 2007-04-18 | 2014-12-24 | 大日本印刷株式会社 | 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器 |
JP5297740B2 (ja) * | 2007-09-28 | 2013-09-25 | 新日鉄住金化学株式会社 | 熱伝導性フレキシブル基板用積層体 |
US20120037405A1 (en) * | 2009-05-26 | 2012-02-16 | Arakawa Chemical Industries, Ltd. | Flexible circuit board and method for manufacturing same |
JP5869458B2 (ja) * | 2012-09-27 | 2016-02-24 | 新日鉄住金化学株式会社 | ポリアミド酸組成物、ポリイミド組成物、積層体、回路基板、その使用方法、積層体の製造方法及び回路基板の製造方法 |
CN110241389A (zh) * | 2018-03-08 | 2019-09-17 | 日铁化学材料株式会社 | 蒸镀掩模、蒸镀掩模形成用聚酰胺酸、蒸镀掩模形成用层叠体及蒸镀掩模的制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60250031A (ja) | 1984-05-28 | 1985-12-10 | Hitachi Ltd | 低熱膨張性樹脂材料 |
JPH01260015A (ja) * | 1988-04-11 | 1989-10-17 | Teijin Ltd | 高弾性率繊維の製造法 |
JPH06234916A (ja) * | 1993-02-09 | 1994-08-23 | Central Glass Co Ltd | 低応力ポリイミド組成物および前駆体組成物溶液 |
TWI300744B (ja) * | 2001-04-19 | 2008-09-11 | Nippon Steel Chemical Co | |
JP2003049008A (ja) * | 2001-05-31 | 2003-02-21 | Du Pont Toray Co Ltd | ポリイミドフィルム |
JP2004182757A (ja) * | 2002-11-29 | 2004-07-02 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂及び該ポリイミド樹脂の製造方法 |
JP2004303358A (ja) * | 2003-03-31 | 2004-10-28 | Nippon Steel Chem Co Ltd | Hddサスペンション用積層体及びhddサスペンション |
JP2005244135A (ja) * | 2004-02-27 | 2005-09-08 | Toyobo Co Ltd | フレキシブルプリント配線基板 |
-
2006
- 2006-02-20 WO PCT/JP2006/302934 patent/WO2006090658A1/ja active Application Filing
- 2006-02-20 KR KR1020077021212A patent/KR101170201B1/ko active IP Right Grant
- 2006-02-20 JP JP2007504697A patent/JP4757864B2/ja not_active Expired - Fee Related
- 2006-02-21 TW TW095105817A patent/TW200642537A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4757864B2 (ja) | 2011-08-24 |
KR101170201B1 (ko) | 2012-07-31 |
TWI380744B (ja) | 2012-12-21 |
KR20070106779A (ko) | 2007-11-05 |
WO2006090658A1 (ja) | 2006-08-31 |
TW200642537A (en) | 2006-12-01 |
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