TW200642537A - Laminate for wiring board - Google Patents

Laminate for wiring board

Info

Publication number
TW200642537A
TW200642537A TW095105817A TW95105817A TW200642537A TW 200642537 A TW200642537 A TW 200642537A TW 095105817 A TW095105817 A TW 095105817A TW 95105817 A TW95105817 A TW 95105817A TW 200642537 A TW200642537 A TW 200642537A
Authority
TW
Taiwan
Prior art keywords
polyimide resin
laminate
wiring boards
aromatic
low moisture
Prior art date
Application number
TW095105817A
Other languages
English (en)
Other versions
TWI380744B (zh
Inventor
Noriko Chikaraishi
Hong-Yuan Wang
Naoko Osawa
Hironobu Kawasato
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200642537A publication Critical patent/TW200642537A/zh
Application granted granted Critical
Publication of TWI380744B publication Critical patent/TWI380744B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
TW095105817A 2005-02-23 2006-02-21 Laminate for wiring board TW200642537A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005046492 2005-02-23

Publications (2)

Publication Number Publication Date
TW200642537A true TW200642537A (en) 2006-12-01
TWI380744B TWI380744B (zh) 2012-12-21

Family

ID=36927298

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105817A TW200642537A (en) 2005-02-23 2006-02-21 Laminate for wiring board

Country Status (4)

Country Link
JP (1) JP4757864B2 (zh)
KR (1) KR101170201B1 (zh)
TW (1) TW200642537A (zh)
WO (1) WO2006090658A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422645B (zh) * 2007-03-30 2014-01-11 Nippon Steel & Sumikin Chem Co 聚醯亞胺膜
JP4834593B2 (ja) * 2007-03-30 2011-12-14 日本発條株式会社 ディスク装置用サスペンション
CN102290054B (zh) * 2007-04-18 2014-12-24 大日本印刷株式会社 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器
JP5297740B2 (ja) * 2007-09-28 2013-09-25 新日鉄住金化学株式会社 熱伝導性フレキシブル基板用積層体
CN102450110B (zh) * 2009-05-26 2016-01-13 荒川化学工业株式会社 柔性电路板及其制造方法
JP5869458B2 (ja) * 2012-09-27 2016-02-24 新日鉄住金化学株式会社 ポリアミド酸組成物、ポリイミド組成物、積層体、回路基板、その使用方法、積層体の製造方法及び回路基板の製造方法
CN110241389A (zh) * 2018-03-08 2019-09-17 日铁化学材料株式会社 蒸镀掩模、蒸镀掩模形成用聚酰胺酸、蒸镀掩模形成用层叠体及蒸镀掩模的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250031A (ja) 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料
JPH01260015A (ja) * 1988-04-11 1989-10-17 Teijin Ltd 高弾性率繊維の製造法
JPH06234916A (ja) * 1993-02-09 1994-08-23 Central Glass Co Ltd 低応力ポリイミド組成物および前駆体組成物溶液
TWI300744B (zh) * 2001-04-19 2008-09-11 Nippon Steel Chemical Co
JP2003049008A (ja) * 2001-05-31 2003-02-21 Du Pont Toray Co Ltd ポリイミドフィルム
JP2004182757A (ja) * 2002-11-29 2004-07-02 Kanegafuchi Chem Ind Co Ltd ポリイミド樹脂及び該ポリイミド樹脂の製造方法
JP2004303358A (ja) * 2003-03-31 2004-10-28 Nippon Steel Chem Co Ltd Ｈｄｄサスペンション用積層体及びｈｄｄサスペンション
JP2005244135A (ja) * 2004-02-27 2005-09-08 Toyobo Co Ltd フレキシブルプリント配線基板

Also Published As

Publication number Publication date
KR101170201B1 (ko) 2012-07-31
JP4757864B2 (ja) 2011-08-24
WO2006090658A1 (ja) 2006-08-31
KR20070106779A (ko) 2007-11-05
JPWO2006090658A1 (ja) 2008-07-24
TWI380744B (zh) 2012-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees