JPS6426648U - - Google Patents
Info
- Publication number
- JPS6426648U JPS6426648U JP1988089540U JP8954088U JPS6426648U JP S6426648 U JPS6426648 U JP S6426648U JP 1988089540 U JP1988089540 U JP 1988089540U JP 8954088 U JP8954088 U JP 8954088U JP S6426648 U JPS6426648 U JP S6426648U
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- elastic support
- support member
- workpiece
- support members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 3
- 230000007423 decrease Effects 0.000 claims 1
- 239000013013 elastic material Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Description
第1図は本考案に係る真空装置に加工物を装着
した状態を示す部分切欠正面図、第2図は第1図
の―線に沿う断面図、第3図は第2図ので
囲まれた部分の拡大図、第4図は第2図ので囲
まれた部分の拡大図、第5図は本考案に係る真空
装置を電鋳装置内で使用している状態を示す断面
図である。 1…ベース、2…弾性支持部材、3…遊端面、
4…支持面、5…加工物、6…スペーシング(真
空空間部)、7…シール手段、8…リツプ部、9
…支持パツト、10…パツド体、11…織物、1
2…真空ダクト、13…排出装置、14…液体、
15…容器、16…カバー、17…ヒンジ部、1
8…軸受、20…中空チユーブ、21…ノズル、
22…インジエクタ体、23…ベンチユリーダク
ト、24…吹出し開口。
した状態を示す部分切欠正面図、第2図は第1図
の―線に沿う断面図、第3図は第2図ので
囲まれた部分の拡大図、第4図は第2図ので囲
まれた部分の拡大図、第5図は本考案に係る真空
装置を電鋳装置内で使用している状態を示す断面
図である。 1…ベース、2…弾性支持部材、3…遊端面、
4…支持面、5…加工物、6…スペーシング(真
空空間部)、7…シール手段、8…リツプ部、9
…支持パツト、10…パツド体、11…織物、1
2…真空ダクト、13…排出装置、14…液体、
15…容器、16…カバー、17…ヒンジ部、1
8…軸受、20…中空チユーブ、21…ノズル、
22…インジエクタ体、23…ベンチユリーダク
ト、24…吹出し開口。
Claims (1)
- 【実用新案登録請求の範囲】 1 個々に離間した一組の支持部材2を支持する
ためのベース1と、加工物5用の支持面4を形成
する前記支持部材2の遊端面3と、前記支持部材
間に内容物排出可能な真空空間部の一部を形成す
るスペーシング6と、一組の前記支持部材2を包
囲し且つ保持されるべき前記加工物に対し密封し
て真空を維持するシール手段とを具えた加工物保
持用の真空装置において、 前記組は、弾性変形可能な材料からなる複数の
弾性支持部材を有し、 前記シール手段は移動自在の部分8を具え、前
記加工物を位置決めした後に前記真空空間部の内
容物を排出した場合、前記弾性支持部材の横寸法
を増加させ、これと同時に前記真空空間部の容積
を減少させるような前記弾性支持部材の軸線方向
変形と同時期に前記シール手段の前記部分8を移
動させることを特徴とする加工物保持用の真空装
置。 2 請求項1記載の真空装置において、前記弾性
支持部材2は、実質的に平行でかつ平坦なパツド
体10を具えた支持パツド9に属すると共に、前
記パツド体10から一側に突出したことを特徴と
する真空装置。 3 請求項2記載の真空装置において、前記パツ
ド体10と前記弾性支持部材2は、少なくとも大
部分で弾性材料から形成された一体ユニツトを構
成することを特徴とする真空装置。 4 請求項1記載の真空装置において、前記弾性
支持部材2をエラストマー材で形成したことを特
徴とする真空装置。 5 請求項1記載の真空装置において、前記シー
ル手段7は、軸線方向に変形可能な弾性シールリ
ツプ部8をもつ環状本体を具えたことを特徴とす
る真空装置。 6 請求項1記載の真空装置において、液体14
内に沈められた加工物を保持するために、加工液
に作用するエジエクタポンプを具えた排出装置1
3を前記真空空間部に接続したことを特徴とする
真空装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8701603 | 1987-07-08 | ||
NL8701603A NL8701603A (nl) | 1987-07-08 | 1987-07-08 | Vacuuminrichting voor het vastzuigen van werkstukken. |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6426648U true JPS6426648U (ja) | 1989-02-15 |
JPH07446Y2 JPH07446Y2 (ja) | 1995-01-11 |
Family
ID=19850275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988089540U Expired - Lifetime JPH07446Y2 (ja) | 1987-07-08 | 1988-07-07 | 加工物保持用の真空装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4856766A (ja) |
EP (1) | EP0298564B1 (ja) |
JP (1) | JPH07446Y2 (ja) |
KR (1) | KR940003291Y1 (ja) |
DE (1) | DE3874981T2 (ja) |
NL (1) | NL8701603A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639818U (ja) * | 1992-11-09 | 1994-05-27 | 東燃化学株式会社 | 木材の搬出用シューター |
WO2007072855A1 (ja) * | 2005-12-21 | 2007-06-28 | Toyota Jidosha Kabushiki Kaisha | 半導体薄膜製造装置 |
WO2011084531A3 (en) * | 2009-12-15 | 2011-11-24 | Solexel, Inc. | Mobile vacuum carriers for thin wafer processing |
JP2017220483A (ja) * | 2016-06-03 | 2017-12-14 | 日本特殊陶業株式会社 | 真空チャック及び真空チャックの製造方法 |
JP2018533763A (ja) * | 2015-10-29 | 2018-11-15 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置用基板テーブル、および基板の装填方法 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8922225D0 (en) * | 1989-10-03 | 1989-11-15 | Superion Ltd | Apparatus and methods relating to ion implantation |
EP0456426B1 (en) * | 1990-05-07 | 2004-09-15 | Canon Kabushiki Kaisha | Vacuum type wafer holder |
US5143450A (en) * | 1991-02-01 | 1992-09-01 | Aetrium, Inc. | Apparatus for handling devices under varying temperatures |
JPH0521584A (ja) * | 1991-07-16 | 1993-01-29 | Nikon Corp | 保持装置 |
US5671910A (en) * | 1992-05-06 | 1997-09-30 | James C. Carne | Vacuum plates |
JPH06268051A (ja) * | 1993-03-10 | 1994-09-22 | Mitsubishi Electric Corp | ウエハ剥し装置 |
US5660699A (en) * | 1995-02-20 | 1997-08-26 | Kao Corporation | Electroplating apparatus |
US5724121A (en) * | 1995-05-12 | 1998-03-03 | Hughes Danbury Optical Systems, Inc. | Mounting member method and apparatus with variable length supports |
JPH1022184A (ja) * | 1996-06-28 | 1998-01-23 | Sony Corp | 基板張り合わせ装置 |
JP3376258B2 (ja) | 1996-11-28 | 2003-02-10 | キヤノン株式会社 | 陽極化成装置及びそれに関連する装置及び方法 |
ATE218240T1 (de) * | 1997-03-12 | 2002-06-15 | Tapematic Spa | Vorrichtung zum unterstützen von optischen datenspeicherscheiben |
US5993302A (en) * | 1997-12-31 | 1999-11-30 | Applied Materials, Inc. | Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
US6080050A (en) | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
US5989444A (en) * | 1998-02-13 | 1999-11-23 | Zywno; Marek | Fluid bearings and vacuum chucks and methods for producing same |
DE29814100U1 (de) * | 1998-08-06 | 1999-12-16 | Schmalz J Gmbh | Blocksauger |
EP1109207A1 (de) * | 1999-12-14 | 2001-06-20 | Esec SA | Ansaugvorrichtung zum Niederhalten eines Substrates |
CH695405A5 (de) | 1999-12-14 | 2006-04-28 | Esec Trading Sa | Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats. |
EP1170781A1 (de) * | 2000-07-03 | 2002-01-09 | Esec Trading S.A. | Greifwerkzeug |
EP1170783A1 (en) * | 2000-07-03 | 2002-01-09 | Esec Trading S.A. | Pick-up-tool |
CH695075A5 (de) | 2000-07-03 | 2005-11-30 | Esec Trading Sa | Greifwerkzeug. |
US6771482B2 (en) * | 2001-07-30 | 2004-08-03 | Unaxis Usa Inc. | Perimeter seal for backside cooling of substrates |
ITMI20012014A1 (it) * | 2001-09-27 | 2003-03-27 | Lpe Spa | Utensile per maneggiare fette e stazione per crescita epitassiale |
EP1475670B1 (en) * | 2003-05-09 | 2008-10-29 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1475667A1 (en) * | 2003-05-09 | 2004-11-10 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
DE202004012259U1 (de) * | 2004-08-05 | 2005-04-07 | Weha Ludwig Werwein Gmbh | Saugvorrichtung für Plattenbearbeitung |
JP5312923B2 (ja) | 2008-01-31 | 2013-10-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100936643B1 (ko) * | 2009-06-22 | 2010-01-14 | 지기용 | 페달식 회전탈수장치 |
US9966293B2 (en) * | 2014-09-19 | 2018-05-08 | Infineon Technologies Ag | Wafer arrangement and method for processing a wafer |
CN107004574B (zh) | 2014-12-12 | 2020-06-30 | 佳能株式会社 | 基板保持装置、光刻设备以及物品制造方法 |
US9917000B2 (en) * | 2015-10-01 | 2018-03-13 | Infineon Technologies Ag | Wafer carrier, method for manufacturing the same and method for carrying a wafer |
US10699934B2 (en) | 2015-10-01 | 2020-06-30 | Infineon Technologies Ag | Substrate carrier, a processing arrangement and a method |
KR101926726B1 (ko) * | 2018-06-28 | 2018-12-07 | 주식회사 기가레인 | 부산물 증착 문제가 개선된 립실 및 이를 포함하는 반도체 공정 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS472261U (ja) * | 1971-01-27 | 1972-08-25 | ||
JPS50155472U (ja) * | 1974-06-12 | 1975-12-23 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2133518A (en) * | 1937-08-20 | 1938-10-18 | William C Huebner | Vacuum holder |
US2983638A (en) * | 1958-02-05 | 1961-05-09 | Du Pont | Laminating blanket |
US2936139A (en) * | 1959-04-08 | 1960-05-10 | Oscar L Lindstrom | Resilient non-skid supporting shoes with suction cup |
SE444526B (sv) * | 1978-01-23 | 1986-04-21 | Western Electric Co | Sett att i lege och plan placera en substratbricka |
SU829536A1 (ru) * | 1979-07-30 | 1981-05-15 | Предприятие П/Я А-1813 | Пневматический захват |
US4530635A (en) * | 1983-06-15 | 1985-07-23 | The Perkin-Elmer Corporation | Wafer transferring chuck assembly |
-
1987
- 1987-07-08 NL NL8701603A patent/NL8701603A/nl not_active Application Discontinuation
-
1988
- 1988-03-14 US US07/167,812 patent/US4856766A/en not_active Expired - Fee Related
- 1988-07-05 KR KR2019880010922U patent/KR940003291Y1/ko not_active IP Right Cessation
- 1988-07-06 EP EP88201409A patent/EP0298564B1/en not_active Expired - Lifetime
- 1988-07-06 DE DE8888201409T patent/DE3874981T2/de not_active Expired - Fee Related
- 1988-07-07 JP JP1988089540U patent/JPH07446Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS472261U (ja) * | 1971-01-27 | 1972-08-25 | ||
JPS50155472U (ja) * | 1974-06-12 | 1975-12-23 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639818U (ja) * | 1992-11-09 | 1994-05-27 | 東燃化学株式会社 | 木材の搬出用シューター |
WO2007072855A1 (ja) * | 2005-12-21 | 2007-06-28 | Toyota Jidosha Kabushiki Kaisha | 半導体薄膜製造装置 |
JP2007173467A (ja) * | 2005-12-21 | 2007-07-05 | Toyota Motor Corp | 半導体薄膜製造装置 |
WO2011084531A3 (en) * | 2009-12-15 | 2011-11-24 | Solexel, Inc. | Mobile vacuum carriers for thin wafer processing |
JP2018533763A (ja) * | 2015-10-29 | 2018-11-15 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置用基板テーブル、および基板の装填方法 |
JP2020118983A (ja) * | 2015-10-29 | 2020-08-06 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置用基板テーブル、および基板の装填方法 |
JP2022010193A (ja) * | 2015-10-29 | 2022-01-14 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置用基板テーブル、および基板の装填方法 |
JP2017220483A (ja) * | 2016-06-03 | 2017-12-14 | 日本特殊陶業株式会社 | 真空チャック及び真空チャックの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
NL8701603A (nl) | 1989-02-01 |
US4856766A (en) | 1989-08-15 |
EP0298564B1 (en) | 1992-09-30 |
JPH07446Y2 (ja) | 1995-01-11 |
KR940003291Y1 (ko) | 1994-05-19 |
KR890003634U (ko) | 1989-04-13 |
DE3874981D1 (de) | 1992-11-05 |
DE3874981T2 (de) | 1993-04-15 |
EP0298564A1 (en) | 1989-01-11 |
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