JPS6364899B2 - - Google Patents

Info

Publication number
JPS6364899B2
JPS6364899B2 JP57010534A JP1053482A JPS6364899B2 JP S6364899 B2 JPS6364899 B2 JP S6364899B2 JP 57010534 A JP57010534 A JP 57010534A JP 1053482 A JP1053482 A JP 1053482A JP S6364899 B2 JPS6364899 B2 JP S6364899B2
Authority
JP
Japan
Prior art keywords
electrode pattern
electronic component
substrate
lsi chip
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57010534A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58127338A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57010534A priority Critical patent/JPS58127338A/ja
Publication of JPS58127338A publication Critical patent/JPS58127338A/ja
Publication of JPS6364899B2 publication Critical patent/JPS6364899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP57010534A 1982-01-25 1982-01-25 電子部品の構造 Granted JPS58127338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57010534A JPS58127338A (ja) 1982-01-25 1982-01-25 電子部品の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57010534A JPS58127338A (ja) 1982-01-25 1982-01-25 電子部品の構造

Publications (2)

Publication Number Publication Date
JPS58127338A JPS58127338A (ja) 1983-07-29
JPS6364899B2 true JPS6364899B2 (enrdf_load_stackoverflow) 1988-12-14

Family

ID=11752924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57010534A Granted JPS58127338A (ja) 1982-01-25 1982-01-25 電子部品の構造

Country Status (1)

Country Link
JP (1) JPS58127338A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60147140A (ja) * 1984-01-11 1985-08-03 Hitachi Ltd 半導体素子チツプの実装方法
JP4212255B2 (ja) * 2001-03-30 2009-01-21 株式会社東芝 半導体パッケージ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420315B2 (enrdf_load_stackoverflow) * 1974-07-15 1979-07-21
JPS53112061A (en) * 1977-03-11 1978-09-30 Sharp Corp Wiring substrate of semiconductor chip
JPS5474369A (en) * 1977-11-26 1979-06-14 Fujitsu Ltd Semiconductor device
JPS56110292A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Semiconductor device
JPS56148840A (en) * 1980-04-22 1981-11-18 Citizen Watch Co Ltd Mounting structure for ic
JPS5827935U (ja) * 1981-08-18 1983-02-23 株式会社村田製作所 混成集積回路装置

Also Published As

Publication number Publication date
JPS58127338A (ja) 1983-07-29

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