JPS6362096B2 - - Google Patents

Info

Publication number
JPS6362096B2
JPS6362096B2 JP11919782A JP11919782A JPS6362096B2 JP S6362096 B2 JPS6362096 B2 JP S6362096B2 JP 11919782 A JP11919782 A JP 11919782A JP 11919782 A JP11919782 A JP 11919782A JP S6362096 B2 JPS6362096 B2 JP S6362096B2
Authority
JP
Japan
Prior art keywords
soldering
piece
connecting piece
curved
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11919782A
Other languages
English (en)
Other versions
JPS5870563A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5870563A publication Critical patent/JPS5870563A/ja
Publication of JPS6362096B2 publication Critical patent/JPS6362096B2/ja
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thyristors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 本発明は、両端に二重に折曲げたはんだ付けタ
ブまたははんだ付けリングがあるわん曲片から成
る、半導体部品の主接点または制御接点と導体ト
ラツクとの電気的結合のための半導体部品用接続
片に関する。
この種の接続片は、例えばテツコール・エレク
トロンクス社のカタログ「テクニカルデータ
T1064」により公知であり、サイリスタ・タブレ
ツトの陰極（陰極接続片）およびゲート（ゲート
接続片）とセラミツク基板の結合に使用される。
接続片と半導体タブレツトおよび導体トラツクの
はんだ付けは、はんだ付けされる面にある酸化物
の還元のためにフラツクスを添加して行うことが
できる。ところがフラツクスを使用する、高温
（約350℃）でのはんだ付けと、続いて必要な清掃
過程は、セラミツクス基板上の能動部分その他の
敏感な構成部分の保護処理と両立しない。大面積
のフラツクスはんだ付けのもう一つの欠点は、空
隙すなわちはんだ付けされない欠陥部を包含する
可能性があることである。これは不要に高い熱抵
抗をもたらす。
フラツクスはんだ付けの代案として、保護ガス
雰囲気下の連続式炉のはんだ付けがある。しかし
このためにはんだ付け用の型による接続片と半導
体タブレツトの正確な整定が必要である。公知の
接続片は、炉を通過する時に接続片の明確な固定
が不可能であるため、欠陥のあるはんだ付けが生
じ、これが例えば半導体素子の陰極とゲートの間
に短絡をひき起こすという欠点がある。
本発明の目的は、はんだ付け鋳型において接続
片と半導体素子との正確な調整を可能にし、半導
体素子の接点と導体トラツクとの電気的結合のた
めの半導体素子用接続片を提供することにある。
この目的は、接続片のわん曲片が横張出部と有
し、該横張出部が導体トラツクとの結合のための
はんだ付けタブ側でわん曲片を二重に曲折する場
所に配設されることによつて達成される。
本発明によつて得られる利点は、特に横張出部
を有する接続片を形成することによつて、当該の
半導体タブレツトへの接続片の正確な位置調整
が、僅かな公差で可能であることにある。それに
よつてゲートと陰極の間の短絡が効果的に阻止さ
れる。横張出部を成形することによつて、はんだ
付け鋳型への簡単な挿着と離型が、補助装置なし
で可能である。
次に図面に基づいて本発明を詳述する。
第１図に接続片を有する半導体素子を示す。セ
ラミツク板１の上に、導体トラツクの役割をする
銅箔２，３，４が、西独特許出願P3036128.5号に
よる方法で覆設されている。その場合、銅箔２は
半導体タブレツト５（半導体能動部分）、例えば
サイリスタの陰極リード線、銅箔３は陽極リード
線、銅箔４はゲート・リード線の役割をする。半
導体タブレツト５の陽極は銅箔３にはんだ付けさ
れている。半導体タブレツト５は陽極と対向する
側に外側環状陰極接点６と、内側円形ゲート接点
８（中心ゲート）を有し、陰極接点６とゲート接
点８の間に絶縁リング７が配設されている。
半導体タブレツト５の陰極接点６と銅箔２は接
続片９（陰極接続片９）を介して互いに電気的に
結合され、接続片９の一端が銅箔２に、他端が陰
極接点６にはんだ付けされている。半導体タブレ
ツト５のゲート接点８と銅箔４は接続片（ゲート
接続片１０）を介して互いに電気的に結合され、
接続片１０の一端は銅箔４に、他端はゲート接点
８にはんだ付けされている。
第２ａ図、第２ｂ図、第２ｃ図にゲート接点８
のための接続片１０を示す。第２ｂ図はゲート接
続片１０の側面図で示す。ゲート接続片１０は、
半導体タブレツト５のゲート接点８のはんだ付け
のためのはんだ付けタブ１１を有する。その場
合、はんだ付けタブ１１の寸法は、ゲート接点の
直径に相当する。はんだ付けタブ１１に細長いわ
ん曲片１２が、二重に折曲げられて接続する。わ
ん曲片１２は二重に折曲げられて、接続片１０と
銅箔４のはんだ付けのためのはんだ付けタブ１４
に移行する。わん曲片１２ははんだ付けタブ１４
側の第１と第２の曲折部の間に、２個の横張出部
１３を有する。この２個の横張出部１３ははんだ
付け用の型（はんだ付け鋳型）においてはんだ付
けする時に、ゲート接続片１０の明確な位置調整
がおこなえる。すなわちはんだ付けタブ１１はは
んだ付けのために、半導体タブレツト５のゲート
接点８の丁度上に置かれる。横張出部１３によつ
て、はんだ付タブ１１の横ずれが防止される。第
２ａ図はゲート接続片１０を上から見た図を示
す。この図から特に２個の横張出部１３の実施態
様が明らかである。第２ｃ図はゲート接続片１０
前面図を示す。細いわん曲片１２と、これに突設
された２個の横張出部１３がこの図で明らかであ
る。
第３ａ図、第３ｂ図、第３ｃ図には陰極接点９
のための接続片９が示されている。第３ｂ図は陰
極接続片９の側面図を示す。陰極接続片９は半導
体タブレツト５の環状陰極接点６とのはんだ付け
のためのはんだ付けリング１５を有する。その場
合、はんだ付けリング１５の内径は絶縁リング７
の外径におおむね相当し、はんだ付けリングの外
径は陰極接点６の外径におおむね相当する。はん
だ付けリング１５に短い、幅広いわん曲片１６
が、二重に折曲げられて続く。わん曲片１６は二
重に折曲げられて、陰極接続片９と銅箔２のはん
だ付けのためのはんだ付けタブ１８に移行する。
わん曲片１６ははんだ付けタブ１８側のわん曲片
１６の第１および第２の曲折部の間に、２個の横
張出部１７を有する。２個の横張出部１７ははん
だ付け用鋳型においてはんだ付けする時に、陰極
接続片９の明確な位置付がなされる。すなわちは
んだ付けリング１５ははんだ付けのために、半導
体タブレツト５の陰極接点６の丁度上に置かれ
る。２個の横張出部１７によつて、はんだ付けリ
ング１５の横ずれが防止される。
第３ａ図は陰極接続片９の前面図を示す。この
図で特に２個の横張出部１７の実施態様が明らか
である。
第３ｃ図は陰極接続片９の上から見た図を示
す。この図で特にはんだ付けリング１５、短く幅
広いわん曲片１６およびこれに突設された２個の
横張出部１７の実施態様が明らかである。
半導体タブレツト５の陰極接点６およびゲート
接点８と陰極接続片９およびゲート接続片１０の
はんだ付けのために、接続片９，１０と半導体タ
ブレツト５が適当に形成されたはんだ付け鋳型の
中に挿入され、銅箔２−接続片９、陰極接点６−
接続片９および銅箔４−接続片１０、ゲート接点
８−接続片１０のはんだ継手を保護雰囲下の連続
式炉の中で、１回のはんだ付け工程のあいだに同
時に作成することができる。その場合、はんだ付
け鋳型は再使用可能な通過式の型として構成し、
横張出部１３および、１７に相当する開口部を有
することが好ましい。
電気接続片９および１０は銅、ニツケル、ニツ
ケル合金または青銅から成り、片面がはんだで被
覆されている。代案として接続片がニツケルメツ
キされており、各部のはんだ付けのために、間挿
したはんだの板片が使用される。わん曲片の設計
は、予想される電流負荷、特にサージ電流負荷を
考慮して行う。わん曲片１２，１６の両端の二重
の折曲げは、半導体部品の使用中に場合によつて
生じる機械的応力を解消することを目的とする。
【図面の簡単な説明】
第１図は接続片を有する半導体素子の平面図、
第２ａ，２ｂ，２ｃ図はゲート接点用の接続片の
図、そして第３ａ，３ｂ，３ｃ図は陰極接点用の
接続片の図を示す。 ２，４……導体トラツク、９……陰極接続片、
１０……ゲート接続片、１２……わん曲片、１３
……横張出部、１４……はんだ付けタブ、１６…
…わん曲片、１７……横張出部、１８……はんだ
付けタブ。

Claims (1)

  1. 【特許請求の範囲】 １ 両端に二重に折曲げたはんだ付けタブまたは
    はんだ付けリングがあるわん曲片から成る、半導
    体部品の主接点または制御接点と導体トラツクと
    の電気的結合のための半導体部品用接続片におい
    て、接続片９，１０のわん曲片１２，１６が横張
    出部１３，１７を有し、該横張出部が導体トラツ
    ク２，４との結合のためのはんだ付けタブ１４，
    １８側でわん曲片１２，１６を二重に曲折する場
    所に配設されていることを特徴をする接続片。 ２ 接続片をゲート接続片１０として構成するた
    めに、わん曲片１６が細く、長いことを特徴とす
    る、特許請求の範囲第１項記載の接続片。 ３ 接続片を陰極接続片９として構成するため
    に、わん曲片１６が短く、幅広いことを特徴とす
    る、特許請求の範囲第１項に記載の接続片。 ４ 銅、黄銅、ニツケル合金、ニツケルまたは青
    銅から成ることを特徴とする 特許請求の範囲第
    １項、第２項または第３項に記載の接続片。 ５ はんだ付けされる側がはんだで被覆されてい
    ることを特徴とする特徴請求の範囲第１項、第２
    項、第３項または第４項に記載の接続片。 ６ はんだ付け可能な層で被覆されていることを
    特徴とする特許請求の範囲第１項、第２項、第３
    項または第４項に記載の接続片。 ７ はんだ付け可能な層が化学的に、または電解
    により覆設されたニツケル層から成ることを特徴
    とする特許請求の範囲第６項に記載の接続片。
JP57119197A 1981-07-11 1982-07-10 半導体部品のための電気接続片 Granted JPS5870563A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3127458.7 1981-07-11
DE19813127458 DE3127458A1 (de) 1981-07-11 1981-07-11 Elektrische verbindungslasche fuer halbleiterbauelemente

Publications (2)

Publication Number Publication Date
JPS5870563A JPS5870563A (ja) 1983-04-27
JPS6362096B2 true JPS6362096B2 (ja) 1988-12-01

Family

ID=6136701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57119197A Granted JPS5870563A (ja) 1981-07-11 1982-07-10 半導体部品のための電気接続片

Country Status (5)

Country Link
US (1) US4502750A (ja)
EP (1) EP0069903B1 (ja)
JP (1) JPS5870563A (ja)
AT (1) ATE23003T1 (ja)
DE (1) DE3127458A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406537A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
DE3528427A1 (de) * 1985-08-08 1987-04-02 Bbc Brown Boveri & Cie Elektrische verbindungslasche fuer halbleiterbauelemente
DE4300516C2 (de) * 1993-01-12 2001-05-17 Ixys Semiconductor Gmbh Leistungshalbleitermodul
US6485603B1 (en) * 1999-07-01 2002-11-26 Applied Materials, Inc. Method and apparatus for conserving energy within a process chamber
US6267630B1 (en) 1999-08-04 2001-07-31 Antaya Technologies Corporation Circular connector with blade terminal
TW201819790A (zh) 2016-11-16 2018-06-01 日商日本精工股份有限公司 滾動軸承用保持器及滾動軸承

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE950068C (de) * 1953-01-20 1956-10-04 Nelken Kg Dr Ewald Elektrischer Schienenverbinder
DE1514805B2 (de) * 1965-04-03 1971-08-19 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum kontaktieren von halbleiterbauelementen
US4023008A (en) * 1972-12-28 1977-05-10 Saint-Gobain Industries Terminal connection for electric heaters for vehicle windows
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4054238A (en) * 1976-03-23 1977-10-18 Western Electric Company, Inc. Method, apparatus and lead frame for assembling leads with terminals on a substrate
DE2728330A1 (de) * 1977-06-23 1979-01-11 Siemens Ag Verfahren zum verloeten von kontaktteilen und/oder halbleiterplaettchen
US4151544A (en) * 1977-12-27 1979-04-24 Motorola, Inc. Lead terminal for button diode
US4246467A (en) * 1979-07-20 1981-01-20 Ford Motor Company Electric terminal for connecting a heating grid on a thermal window

Also Published As

Publication number Publication date
DE3127458C2 (ja) 1987-06-25
EP0069903A2 (de) 1983-01-19
JPS5870563A (ja) 1983-04-27
EP0069903A3 (en) 1984-11-28
DE3127458A1 (de) 1983-02-03
US4502750A (en) 1985-03-05
EP0069903B1 (de) 1986-10-15
ATE23003T1 (de) 1986-11-15

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