JPS6353234B2 - - Google Patents

Info

Publication number
JPS6353234B2
JPS6353234B2 JP58046781A JP4678183A JPS6353234B2 JP S6353234 B2 JPS6353234 B2 JP S6353234B2 JP 58046781 A JP58046781 A JP 58046781A JP 4678183 A JP4678183 A JP 4678183A JP S6353234 B2 JPS6353234 B2 JP S6353234B2
Authority
JP
Japan
Prior art keywords
epoxy resin
conductive adhesive
manufactured
electrically conductive
trade name
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58046781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172571A (ja
Inventor
Iwao Maekawa
Daisuke Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP58046781A priority Critical patent/JPS59172571A/ja
Publication of JPS59172571A publication Critical patent/JPS59172571A/ja
Publication of JPS6353234B2 publication Critical patent/JPS6353234B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W72/30—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
JP58046781A 1983-03-18 1983-03-18 導電性接着剤 Granted JPS59172571A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58046781A JPS59172571A (ja) 1983-03-18 1983-03-18 導電性接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58046781A JPS59172571A (ja) 1983-03-18 1983-03-18 導電性接着剤

Publications (2)

Publication Number Publication Date
JPS59172571A JPS59172571A (ja) 1984-09-29
JPS6353234B2 true JPS6353234B2 (cg-RX-API-DMAC10.html) 1988-10-21

Family

ID=12756866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58046781A Granted JPS59172571A (ja) 1983-03-18 1983-03-18 導電性接着剤

Country Status (1)

Country Link
JP (1) JPS59172571A (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366278A (ja) * 1986-09-08 1988-03-24 Sumitomo Metal Mining Co Ltd 導電性接着剤
JPS63120782A (ja) * 1986-11-10 1988-05-25 Toshiba Chem Corp 導電性接着剤
WO1990002768A1 (fr) * 1988-09-02 1990-03-22 Toray Industries, Inc. Preparation a base de silicone-resine epoxyde et adhesif conducteur obtenu a partir de cette preparation
US6376051B1 (en) 1999-03-10 2002-04-23 Matsushita Electric Industrial Co., Ltd. Mounting structure for an electronic component and method for producing the same
JP2007293075A (ja) * 2006-04-26 2007-11-08 Sumitomo Chemical Co Ltd 感放射線性樹脂組成物及びその用途
CN114208034B (zh) 2019-07-29 2025-08-01 株式会社村田制作所 水晶振子、电子部件和电子装置
CN120192714A (zh) * 2023-12-22 2025-06-24 南亚塑胶工业股份有限公司 聚烯烃贴合胶膜

Also Published As

Publication number Publication date
JPS59172571A (ja) 1984-09-29

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