JPS6343898B2 - - Google Patents
Info
- Publication number
- JPS6343898B2 JPS6343898B2 JP57092777A JP9277782A JPS6343898B2 JP S6343898 B2 JPS6343898 B2 JP S6343898B2 JP 57092777 A JP57092777 A JP 57092777A JP 9277782 A JP9277782 A JP 9277782A JP S6343898 B2 JPS6343898 B2 JP S6343898B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- lead frame
- gold
- silver
- gold plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9277782A JPS5825251A (ja) | 1982-05-31 | 1982-05-31 | リ−ドフレ−ム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9277782A JPS5825251A (ja) | 1982-05-31 | 1982-05-31 | リ−ドフレ−ム |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6578175A Division JPS51140839A (en) | 1975-05-30 | 1975-05-30 | Method of forming coatings of different metals |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5825251A JPS5825251A (ja) | 1983-02-15 |
JPS6343898B2 true JPS6343898B2 (enrdf_load_stackoverflow) | 1988-09-01 |
Family
ID=14063847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9277782A Granted JPS5825251A (ja) | 1982-05-31 | 1982-05-31 | リ−ドフレ−ム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5825251A (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317976B2 (enrdf_load_stackoverflow) * | 1972-05-03 | 1978-06-12 |
-
1982
- 1982-05-31 JP JP9277782A patent/JPS5825251A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5825251A (ja) | 1983-02-15 |
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