JPS6342859B2 - - Google Patents
Info
- Publication number
- JPS6342859B2 JPS6342859B2 JP55101130A JP10113080A JPS6342859B2 JP S6342859 B2 JPS6342859 B2 JP S6342859B2 JP 55101130 A JP55101130 A JP 55101130A JP 10113080 A JP10113080 A JP 10113080A JP S6342859 B2 JPS6342859 B2 JP S6342859B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- tab
- silver
- pellet
- silver plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/457—
-
- H10W72/075—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/951—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10113080A JPS5727050A (en) | 1980-07-25 | 1980-07-25 | Lead frame and semiconductor device using said lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10113080A JPS5727050A (en) | 1980-07-25 | 1980-07-25 | Lead frame and semiconductor device using said lead frame |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1201171A Division JPH0284744A (ja) | 1989-08-04 | 1989-08-04 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5727050A JPS5727050A (en) | 1982-02-13 |
| JPS6342859B2 true JPS6342859B2 (enExample) | 1988-08-25 |
Family
ID=14292489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10113080A Granted JPS5727050A (en) | 1980-07-25 | 1980-07-25 | Lead frame and semiconductor device using said lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5727050A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593053A (ja) * | 1982-06-29 | 1984-01-09 | Sekisui Chem Co Ltd | 積層ガラス |
| JPS596850U (ja) * | 1982-07-06 | 1984-01-17 | 日本電気株式会社 | 半導体装置用リ−ドフレ−ム |
| JPS59133049A (ja) * | 1983-01-21 | 1984-07-31 | 旭硝子株式会社 | 積層安全ガラスおよびその製造方法 |
| JPS6113950U (ja) * | 1984-06-29 | 1986-01-27 | 大日本印刷株式会社 | 金属部分被覆を施した半導体リ−ドフレ−ム |
| JPS6253832A (ja) * | 1985-05-28 | 1987-03-09 | 旭硝子株式会社 | 積層体およびその製造方法 |
| JPH0671058B2 (ja) * | 1985-06-05 | 1994-09-07 | 日立電線株式会社 | 微少点状めっき部を有するリ−ドフレ−ムの製造方法 |
| JPH02205062A (ja) * | 1989-02-02 | 1990-08-14 | Nec Kyushu Ltd | リードフレーム |
| JP2010073830A (ja) * | 2008-09-17 | 2010-04-02 | Sumitomo Metal Mining Co Ltd | リードフレーム及びリードフレームの製造方法 |
| CN105336839A (zh) * | 2015-11-16 | 2016-02-17 | 格力电器(合肥)有限公司 | 焊盘、发光二极管及焊盘印刷模板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5278371A (en) * | 1975-12-25 | 1977-07-01 | Nec Corp | Metal ribbon for semiconductor device |
| JPS52129465U (enExample) * | 1976-03-26 | 1977-10-01 | ||
| JPS553641A (en) * | 1978-06-23 | 1980-01-11 | Hitachi Ltd | Lead frame |
| JPS554908A (en) * | 1978-06-26 | 1980-01-14 | Hitachi Ltd | Lead frame |
-
1980
- 1980-07-25 JP JP10113080A patent/JPS5727050A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5727050A (en) | 1982-02-13 |
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