JPS6337498B2 - - Google Patents

Info

Publication number
JPS6337498B2
JPS6337498B2 JP55012496A JP1249680A JPS6337498B2 JP S6337498 B2 JPS6337498 B2 JP S6337498B2 JP 55012496 A JP55012496 A JP 55012496A JP 1249680 A JP1249680 A JP 1249680A JP S6337498 B2 JPS6337498 B2 JP S6337498B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
wire bonding
semiconductor
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55012496A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56110244A (en
Inventor
Hajime Murakami
Shinji Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP1249680A priority Critical patent/JPS56110244A/ja
Publication of JPS56110244A publication Critical patent/JPS56110244A/ja
Publication of JPS6337498B2 publication Critical patent/JPS6337498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W70/682—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07523—
    • H10W72/5449—
    • H10W90/754—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1249680A 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof Granted JPS56110244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Publications (2)

Publication Number Publication Date
JPS56110244A JPS56110244A (en) 1981-09-01
JPS6337498B2 true JPS6337498B2 (cg-RX-API-DMAC10.html) 1988-07-26

Family

ID=11806975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1249680A Granted JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Country Status (1)

Country Link
JP (1) JPS56110244A (cg-RX-API-DMAC10.html)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140858A (cg-RX-API-DMAC10.html) * 1974-05-02 1975-11-12
JPS5310426B2 (cg-RX-API-DMAC10.html) * 1974-10-04 1978-04-13
JPS5141960A (en) * 1974-10-07 1976-04-08 Shinkawa Seisakusho Kk Handotaino waiyabondeinguhoho
JPS5237768A (en) * 1975-09-19 1977-03-23 Seiko Instr & Electronics Ltd Substrate having positioning marks
JPS52127069A (en) * 1976-04-16 1977-10-25 Shinkawa Ltd Wire bonding apparatus
JPS5329068A (en) * 1976-08-31 1978-03-17 Sony Corp Automatic wire bonding unit
JPS5390863A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Wire bonding method and mark provided on subsutrate
JPS5826664B2 (ja) * 1977-09-27 1983-06-04 松下電器産業株式会社 自動ワイヤボンデイング方法
JPS5847704Y2 (ja) * 1978-04-10 1983-10-31 日本電気株式会社 半導体装置用容器
JPS5827657B2 (ja) * 1978-04-12 1983-06-10 株式会社日立製作所 テ−プキヤリア方式のボンデイング方法及びその装置
JPS5629357A (en) * 1979-08-18 1981-03-24 Mitsubishi Electric Corp Semiconductor container
JPS5737768A (en) * 1980-08-18 1982-03-02 Pioneer Electronic Corp Bookshelf type record player

Also Published As

Publication number Publication date
JPS56110244A (en) 1981-09-01

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