JPS50140858A - - Google Patents
Info
- Publication number
- JPS50140858A JPS50140858A JP4869574A JP4869574A JPS50140858A JP S50140858 A JPS50140858 A JP S50140858A JP 4869574 A JP4869574 A JP 4869574A JP 4869574 A JP4869574 A JP 4869574A JP S50140858 A JPS50140858 A JP S50140858A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/682—
-
- H10W70/685—
-
- H10W72/5363—
-
- H10W90/754—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4869574A JPS50140858A (cg-RX-API-DMAC10.html) | 1974-05-02 | 1974-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4869574A JPS50140858A (cg-RX-API-DMAC10.html) | 1974-05-02 | 1974-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50140858A true JPS50140858A (cg-RX-API-DMAC10.html) | 1975-11-12 |
Family
ID=12810439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4869574A Pending JPS50140858A (cg-RX-API-DMAC10.html) | 1974-05-02 | 1974-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50140858A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54135526U (cg-RX-API-DMAC10.html) * | 1978-03-01 | 1979-09-20 | ||
| JPS56110244A (en) * | 1980-02-06 | 1981-09-01 | Hitachi Ltd | Printed circuit board for semiconductor device and wire bonding method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48104069A (cg-RX-API-DMAC10.html) * | 1972-04-17 | 1973-12-26 |
-
1974
- 1974-05-02 JP JP4869574A patent/JPS50140858A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48104069A (cg-RX-API-DMAC10.html) * | 1972-04-17 | 1973-12-26 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54135526U (cg-RX-API-DMAC10.html) * | 1978-03-01 | 1979-09-20 | ||
| JPS56110244A (en) * | 1980-02-06 | 1981-09-01 | Hitachi Ltd | Printed circuit board for semiconductor device and wire bonding method thereof |