JPS6334268Y2 - - Google Patents
Info
- Publication number
- JPS6334268Y2 JPS6334268Y2 JP1981179740U JP17974081U JPS6334268Y2 JP S6334268 Y2 JPS6334268 Y2 JP S6334268Y2 JP 1981179740 U JP1981179740 U JP 1981179740U JP 17974081 U JP17974081 U JP 17974081U JP S6334268 Y2 JPS6334268 Y2 JP S6334268Y2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- electrode
- markings
- marking
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/30—
-
- H10W72/07552—
-
- H10W72/527—
-
- H10W72/926—
-
- H10W90/736—
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981179740U JPS5883149U (ja) | 1981-11-30 | 1981-11-30 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981179740U JPS5883149U (ja) | 1981-11-30 | 1981-11-30 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5883149U JPS5883149U (ja) | 1983-06-06 |
| JPS6334268Y2 true JPS6334268Y2 (enExample) | 1988-09-12 |
Family
ID=29975706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981179740U Granted JPS5883149U (ja) | 1981-11-30 | 1981-11-30 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5883149U (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010074499A (ja) * | 2008-09-18 | 2010-04-02 | Panasonic Electric Works Co Ltd | リレー装置 |
-
1981
- 1981-11-30 JP JP1981179740U patent/JPS5883149U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5883149U (ja) | 1983-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3932226A (en) | Method of electrically interconnecting semiconductor elements | |
| JPS6149819B2 (enExample) | ||
| JPS62160763A (ja) | 厚い接続電極を有する金属被覆が半導体上に設けられた半導体デバイスの製造方法 | |
| JPS6334268Y2 (enExample) | ||
| JPS6156608B2 (enExample) | ||
| US4067100A (en) | Method of making a semiconductor device | |
| JPH11121457A (ja) | 半導体装置の製造方法 | |
| US10950566B2 (en) | Semiconductor device and method for manufacturing the semiconductor device | |
| JPH03101234A (ja) | 半導体装置の製造方法 | |
| JPH0728044B2 (ja) | ガラス被覆半導体チツプの製造方法 | |
| JPS63174359A (ja) | 固体撮像装置 | |
| JPH05136198A (ja) | 半導体装置 | |
| JPS642442Y2 (enExample) | ||
| KR900000069B1 (ko) | 반도체 장치 | |
| JPS5950221B2 (ja) | 半導体装置の製造方法 | |
| JPH0526745Y2 (enExample) | ||
| JPS61100981A (ja) | 半導体装置の製造方法 | |
| JPS59171124A (ja) | ホトレジスト被膜の埋込み方法 | |
| JPS60257182A (ja) | 半導体装置の製造方法 | |
| JPS60771A (ja) | 半導体装置 | |
| JPH03159125A (ja) | 半導体装置 | |
| JPH0123940B2 (enExample) | ||
| JPS5814746B2 (ja) | ハンドウタイソウチノセイゾウホウホウ | |
| JPS6130418B2 (enExample) | ||
| JPH01318240A (ja) | 半導体装置の製造方法 |