JPS63251466A - 熱伝導性液状シリコ−ンゴム組成物 - Google Patents

熱伝導性液状シリコ−ンゴム組成物

Info

Publication number
JPS63251466A
JPS63251466A JP62083990A JP8399087A JPS63251466A JP S63251466 A JPS63251466 A JP S63251466A JP 62083990 A JP62083990 A JP 62083990A JP 8399087 A JP8399087 A JP 8399087A JP S63251466 A JPS63251466 A JP S63251466A
Authority
JP
Japan
Prior art keywords
alumina
viscosity
particle size
average particle
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62083990A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525263B2 (enExample
Inventor
Hiroshi Inomata
博 猪俣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP62083990A priority Critical patent/JPS63251466A/ja
Publication of JPS63251466A publication Critical patent/JPS63251466A/ja
Priority to US07/449,330 priority patent/US5008307A/en
Publication of JPH0525263B2 publication Critical patent/JPH0525263B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Insulating Materials (AREA)
JP62083990A 1987-04-06 1987-04-06 熱伝導性液状シリコ−ンゴム組成物 Granted JPS63251466A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62083990A JPS63251466A (ja) 1987-04-06 1987-04-06 熱伝導性液状シリコ−ンゴム組成物
US07/449,330 US5008307A (en) 1987-04-06 1989-12-11 Liquid silicone rubber composition capable of yielding a thermal conductive vulcanized product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62083990A JPS63251466A (ja) 1987-04-06 1987-04-06 熱伝導性液状シリコ−ンゴム組成物

Publications (2)

Publication Number Publication Date
JPS63251466A true JPS63251466A (ja) 1988-10-18
JPH0525263B2 JPH0525263B2 (enExample) 1993-04-12

Family

ID=13817976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62083990A Granted JPS63251466A (ja) 1987-04-06 1987-04-06 熱伝導性液状シリコ−ンゴム組成物

Country Status (2)

Country Link
US (1) US5008307A (enExample)
JP (1) JPS63251466A (enExample)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469661A (en) * 1987-09-10 1989-03-15 Showa Denko Kk High-thermal conductivity rubber/plastic composition
JPH0297560A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd シリコーンゴム組成物
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
JPH04328163A (ja) * 1991-04-26 1992-11-17 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
JPH04359060A (ja) * 1991-06-03 1992-12-11 Shin Etsu Chem Co Ltd 熱伝導性に優れたシリコーン組成物
US5376308A (en) * 1990-11-21 1994-12-27 Catalysts & Chemicals Industries Co., Ltd. Coating solution for forming transparent conductive coating and process for preparing same
JPH08319425A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH11116806A (ja) * 1997-10-09 1999-04-27 Toshiba Silicone Co Ltd シリコーンゴム組成物及び定着ロール
JP2000327921A (ja) * 1999-03-12 2000-11-28 Dow Corning Toray Silicone Co Ltd 硬化性シリコーン組成物
JP2003327831A (ja) * 2002-05-14 2003-11-19 Dow Corning Toray Silicone Co Ltd 複合軟磁性体形成用硬化性シリコーン組成物および複合軟磁性体
JPWO2002092693A1 (ja) * 2001-05-14 2004-08-26 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーン組成物
JP2005015788A (ja) * 2003-06-04 2005-01-20 Showa Denko Kk 樹脂充填用コランダム及び樹脂組成物
JP2005503467A (ja) * 2001-09-17 2005-02-03 ダウ・コ−ニング・コ−ポレ−ション 半導体用途用のダイ取付接着剤、半導体デバイスを製造する方法、およびそのような方法により製造される半導体デバイス
KR100500252B1 (ko) * 2001-10-25 2005-07-11 주식회사 해룡실리콘 자기점착성 전자파 차폐용 실리콘 고무 조성물
KR100637023B1 (ko) 2004-07-30 2006-10-20 주식회사 해룡실리콘 저비중 실리콘 조성물
US7166363B2 (en) 2003-08-25 2007-01-23 Shin-Etsu Chemical Co., Ltd. Highly heat conductive silicone rubber composition, fixing roll and fixing belt
JP2009179714A (ja) * 2008-01-30 2009-08-13 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
US8093331B2 (en) 2005-03-30 2012-01-10 Dow Corning Toray Company, Ltd. Thermally conductive silicone rubber composition
US8138254B2 (en) 2005-03-30 2012-03-20 Dow Corning Toray Company, Ltd. Thermally conductive silicone rubber composition
US8309652B2 (en) 2005-04-27 2012-11-13 Dow Corning Toray Company, Ltd. Curable silicone composition and cured product therefrom
WO2014098204A1 (en) 2012-12-17 2014-06-26 Dow Corning Toray Co., Ltd. Thermally conductive silicone composition and thermally conductive member
JP2015071662A (ja) * 2013-10-02 2015-04-16 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP2017513967A (ja) * 2014-03-06 2017-06-01 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 単結晶アルミナ充填ダイアタッチペースト

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5219921A (en) * 1989-07-07 1993-06-15 Shin-Etsu Chemical Company, Ltd. Electrically insulating paint composition and cured product thereof
TW218887B (enExample) * 1991-01-24 1994-01-11 Shinetsu Chem Ind Co
US5137959A (en) * 1991-05-24 1992-08-11 W. R. Grace & Co.-Conn. Thermally conductive elastomer containing alumina platelets
EP0805618B1 (en) * 1996-04-30 2002-01-23 Denki Kagaku Kogyo Kabushiki Kaisha Heat dissipating spacer for electronic equipments
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
JP3444199B2 (ja) * 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US6713088B2 (en) * 1999-08-31 2004-03-30 General Electric Company Low viscosity filler composition of boron nitride particles of spherical geometry and process
US7976941B2 (en) 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
JP4435952B2 (ja) * 2000-08-30 2010-03-24 東レ・ダウコーニング株式会社 定着ロール用熱伝導性液状シリコーンゴム組成物およびフッ素樹脂被覆定着ロール
US6573328B2 (en) 2001-01-03 2003-06-03 Loctite Corporation Low temperature, fast curing silicone compositions
US6448329B1 (en) 2001-02-28 2002-09-10 Dow Corning Corporation Silicone composition and thermally conductive cured silicone product
US7245985B2 (en) * 2001-03-21 2007-07-17 Signature Control Systems Process and apparatus for improving and controlling the vulcanization of natural and synthetic rubber compounds
US7167773B2 (en) * 2001-03-21 2007-01-23 Signature Control Systems Process and apparatus for improving and controlling the curing of natural and synthetic moldable compounds
US20040133301A1 (en) * 2002-07-09 2004-07-08 Signature Control Systems Process and apparatus for improving and controlling the vulcanization of natural and synthetic rubber compounds
US6774643B2 (en) 2001-03-21 2004-08-10 Signature Control Systems Non-bridged single electrode impedance measurement system for determining a condition of a dielectric according to impedance related changes over a range of frequencies
US6855791B2 (en) * 2002-07-09 2005-02-15 Signature Control Systems Process and apparatus for improving and controlling the vulcanization of natural and synthetic rubber compounds
JP3807995B2 (ja) * 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives
ATE446998T1 (de) * 2005-09-29 2009-11-15 Dow Corning Toray Co Ltd Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium
JP4993611B2 (ja) 2006-01-26 2012-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 放熱材及びそれを用いた半導体装置
DE102006033236A1 (de) * 2006-07-18 2008-01-24 Wacker Chemie Ag Zusammensetzung auf der Basis von Organosiliciumverbindungen
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
US7676953B2 (en) 2006-12-29 2010-03-16 Signature Control Systems, Inc. Calibration and metering methods for wood kiln moisture measurement
CN102105537B (zh) * 2008-07-22 2013-04-10 电气化学工业株式会社 树脂组合物
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
CN101921489A (zh) * 2010-08-24 2010-12-22 烟台德邦电子材料有限公司 一种高分子导热复合材料及其制备方法
CN101985519B (zh) * 2010-11-03 2012-10-03 烟台德邦科技有限公司 一种可现场成型的高分子导热复合材料及其制备方法
CN107532000B (zh) * 2015-05-22 2021-07-13 迈图高新材料日本合同公司 导热性组合物
CN116284946B (zh) 2017-02-08 2025-11-04 埃肯有机硅美国公司 具有改进的热管理的二次电池组
CN107245320B (zh) * 2017-07-24 2021-04-09 东莞兆舜有机硅科技股份有限公司 一种加成型有机硅封装胶及其使用方法和用途

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102361A (en) * 1977-02-18 1978-09-06 Toray Silicone Co Ltd Thermosetting resin composition
JPS58219034A (ja) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd 電気絶縁性放熱ゴムシ−トの製造方法

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GB799613A (en) * 1955-04-01 1958-08-13 Alexander Henry Russell Improvements in novel monolithic cast objects and method of preparing the same
NL129346C (enExample) * 1966-06-23
US4196012A (en) * 1967-03-13 1980-04-01 English Clays Lovering Pochin & Co. Paper coating compositions
US3532649A (en) * 1968-09-13 1970-10-06 Dow Corning Heat activated curing system for organosilicon compounds
JPS6043869B2 (ja) * 1977-12-28 1985-09-30 東芝シリコ−ン株式会社 常温硬化性ポリオルガノシロキサン組成物
JPS5522891A (en) * 1979-05-01 1980-02-18 Dow Corning Kk Method of mounting electronic and electric parts such as thermistor or like
JPS562349A (en) * 1979-06-21 1981-01-12 Toshiba Silicone Co Ltd Molded rubber article for heat dissipation
JPS57191902A (en) * 1981-05-21 1982-11-25 Hitachi Cable Thermal conductive insulating sheet
JPS58219259A (ja) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd 熱伝導性シリコ−ンゴム組成物
US4656819A (en) * 1985-09-09 1987-04-14 Willard Pearson Chain sickle
US4604424A (en) * 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102361A (en) * 1977-02-18 1978-09-06 Toray Silicone Co Ltd Thermosetting resin composition
JPS58219034A (ja) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd 電気絶縁性放熱ゴムシ−トの製造方法

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469661A (en) * 1987-09-10 1989-03-15 Showa Denko Kk High-thermal conductivity rubber/plastic composition
JPH0297560A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd シリコーンゴム組成物
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
US5376308A (en) * 1990-11-21 1994-12-27 Catalysts & Chemicals Industries Co., Ltd. Coating solution for forming transparent conductive coating and process for preparing same
US5492762A (en) * 1990-11-21 1996-02-20 Catalysts & Chemicals Industries Co., Ltd. Conductive substrate and display device provided with transparent conductive substrate
JPH04328163A (ja) * 1991-04-26 1992-11-17 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
JPH04359060A (ja) * 1991-06-03 1992-12-11 Shin Etsu Chem Co Ltd 熱伝導性に優れたシリコーン組成物
JPH08319425A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
EP0750008A3 (en) * 1995-05-25 1997-07-02 Dow Corning Toray Silicone Thermally conductive composition of silicone elastomer
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
EP0745643A3 (en) * 1995-05-29 1997-07-02 Dow Corning Toray Silicone Thermally conductive silicone rubber composition
JPH11116806A (ja) * 1997-10-09 1999-04-27 Toshiba Silicone Co Ltd シリコーンゴム組成物及び定着ロール
JP2000327921A (ja) * 1999-03-12 2000-11-28 Dow Corning Toray Silicone Co Ltd 硬化性シリコーン組成物
JPWO2002092693A1 (ja) * 2001-05-14 2004-08-26 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーン組成物
JP2011157559A (ja) * 2001-09-17 2011-08-18 Dow Corning Corp 半導体用途用のダイ取付接着剤、半導体デバイスを製造する方法、およびそのような方法により製造される半導体デバイス
JP2005503467A (ja) * 2001-09-17 2005-02-03 ダウ・コ−ニング・コ−ポレ−ション 半導体用途用のダイ取付接着剤、半導体デバイスを製造する方法、およびそのような方法により製造される半導体デバイス
KR100500252B1 (ko) * 2001-10-25 2005-07-11 주식회사 해룡실리콘 자기점착성 전자파 차폐용 실리콘 고무 조성물
JP2003327831A (ja) * 2002-05-14 2003-11-19 Dow Corning Toray Silicone Co Ltd 複合軟磁性体形成用硬化性シリコーン組成物および複合軟磁性体
JP2005015788A (ja) * 2003-06-04 2005-01-20 Showa Denko Kk 樹脂充填用コランダム及び樹脂組成物
US7166363B2 (en) 2003-08-25 2007-01-23 Shin-Etsu Chemical Co., Ltd. Highly heat conductive silicone rubber composition, fixing roll and fixing belt
KR100637023B1 (ko) 2004-07-30 2006-10-20 주식회사 해룡실리콘 저비중 실리콘 조성물
US8138254B2 (en) 2005-03-30 2012-03-20 Dow Corning Toray Company, Ltd. Thermally conductive silicone rubber composition
US8093331B2 (en) 2005-03-30 2012-01-10 Dow Corning Toray Company, Ltd. Thermally conductive silicone rubber composition
US8309652B2 (en) 2005-04-27 2012-11-13 Dow Corning Toray Company, Ltd. Curable silicone composition and cured product therefrom
JP2009179714A (ja) * 2008-01-30 2009-08-13 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
WO2014098204A1 (en) 2012-12-17 2014-06-26 Dow Corning Toray Co., Ltd. Thermally conductive silicone composition and thermally conductive member
JP2015071662A (ja) * 2013-10-02 2015-04-16 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP2017513967A (ja) * 2014-03-06 2017-06-01 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 単結晶アルミナ充填ダイアタッチペースト

Also Published As

Publication number Publication date
JPH0525263B2 (enExample) 1993-04-12
US5008307A (en) 1991-04-16

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