JPS6323344A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6323344A
JPS6323344A JP16857786A JP16857786A JPS6323344A JP S6323344 A JPS6323344 A JP S6323344A JP 16857786 A JP16857786 A JP 16857786A JP 16857786 A JP16857786 A JP 16857786A JP S6323344 A JPS6323344 A JP S6323344A
Authority
JP
Japan
Prior art keywords
leads
circuit board
unnecessary
electrode terminal
hoop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16857786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365021B2 (enrdf_load_stackoverflow
Inventor
Hajime Deguchi
出口 肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP16857786A priority Critical patent/JPS6323344A/ja
Publication of JPS6323344A publication Critical patent/JPS6323344A/ja
Publication of JPH0365021B2 publication Critical patent/JPH0365021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP16857786A 1986-07-16 1986-07-16 半導体装置の製造方法 Granted JPS6323344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16857786A JPS6323344A (ja) 1986-07-16 1986-07-16 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16857786A JPS6323344A (ja) 1986-07-16 1986-07-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6323344A true JPS6323344A (ja) 1988-01-30
JPH0365021B2 JPH0365021B2 (enrdf_load_stackoverflow) 1991-10-09

Family

ID=15870628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16857786A Granted JPS6323344A (ja) 1986-07-16 1986-07-16 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6323344A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023142A (enrdf_load_stackoverflow) * 1973-06-27 1975-03-12
JPS51129671A (en) * 1975-05-06 1976-11-11 Hitachi Ltd Method of fixing terminals of hybrid ic

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023142A (enrdf_load_stackoverflow) * 1973-06-27 1975-03-12
JPS51129671A (en) * 1975-05-06 1976-11-11 Hitachi Ltd Method of fixing terminals of hybrid ic

Also Published As

Publication number Publication date
JPH0365021B2 (enrdf_load_stackoverflow) 1991-10-09

Similar Documents

Publication Publication Date Title
JPH0555438A (ja) 電子部品のリード端子構造
JPH07131233A (ja) マイクロストリップアンテナ
JPS6323344A (ja) 半導体装置の製造方法
JPH08273798A (ja) Smtコネクタ用コンタクトの製造方法
JPH0738246A (ja) はんだ付け方法及び該方法に用いる成形はんだ
JPS6212101A (ja) 樹脂封止電子部品用端子フ−プ
KR0120928Y1 (ko) 하이브리드 집적회로
JPS6079750A (ja) チツプキヤリヤ
JPH08116152A (ja) 回路基板構体
JP3076950B2 (ja) 半導体装置用リードフレームの製造方法
JPH07170087A (ja) シールド構成方法
JP2531060B2 (ja) 印刷配線板の製造方法
JPH04243187A (ja) プリント基板
JPH01204381A (ja) リード端子の半田付け方法およびリードフレーム
JP2000114553A (ja) 半導体装置およびその製造方法
JPH04137654A (ja) 半導体装置
JPS6223478B2 (enrdf_load_stackoverflow)
JPH06164117A (ja) コネクタ付き配線基板の製造方法
JPH04167490A (ja) プリント配線板
JPH04137656A (ja) 気密封止型半導体装置の製造方法
JPH0380599A (ja) 電子回路モジュール
JPH0656781B2 (ja) ピンジヤツク取付方法
JPH01119046A (ja) Fp型半導体装置
JPH0227797A (ja) シールドケース
JPH05226817A (ja) プリント回路板装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees