JPH0365021B2 - - Google Patents

Info

Publication number
JPH0365021B2
JPH0365021B2 JP61168577A JP16857786A JPH0365021B2 JP H0365021 B2 JPH0365021 B2 JP H0365021B2 JP 61168577 A JP61168577 A JP 61168577A JP 16857786 A JP16857786 A JP 16857786A JP H0365021 B2 JPH0365021 B2 JP H0365021B2
Authority
JP
Japan
Prior art keywords
circuit board
hoop
insulated circuit
leads
shaped clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61168577A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6323344A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16857786A priority Critical patent/JPS6323344A/ja
Publication of JPS6323344A publication Critical patent/JPS6323344A/ja
Publication of JPH0365021B2 publication Critical patent/JPH0365021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP16857786A 1986-07-16 1986-07-16 半導体装置の製造方法 Granted JPS6323344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16857786A JPS6323344A (ja) 1986-07-16 1986-07-16 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16857786A JPS6323344A (ja) 1986-07-16 1986-07-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6323344A JPS6323344A (ja) 1988-01-30
JPH0365021B2 true JPH0365021B2 (enrdf_load_stackoverflow) 1991-10-09

Family

ID=15870628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16857786A Granted JPS6323344A (ja) 1986-07-16 1986-07-16 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6323344A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5622076B2 (enrdf_load_stackoverflow) * 1973-06-27 1981-05-22
JPS51129671A (en) * 1975-05-06 1976-11-11 Hitachi Ltd Method of fixing terminals of hybrid ic

Also Published As

Publication number Publication date
JPS6323344A (ja) 1988-01-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees