JPS63195977A - 電気回路ユニットの接地機構 - Google Patents

電気回路ユニットの接地機構

Info

Publication number
JPS63195977A
JPS63195977A JP62028666A JP2866687A JPS63195977A JP S63195977 A JPS63195977 A JP S63195977A JP 62028666 A JP62028666 A JP 62028666A JP 2866687 A JP2866687 A JP 2866687A JP S63195977 A JPS63195977 A JP S63195977A
Authority
JP
Japan
Prior art keywords
case
circuit unit
bonding
integrated circuit
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62028666A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442780B2 (enExample
Inventor
村瀬　直昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62028666A priority Critical patent/JPS63195977A/ja
Publication of JPS63195977A publication Critical patent/JPS63195977A/ja
Publication of JPH0442780B2 publication Critical patent/JPH0442780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP62028666A 1987-02-10 1987-02-10 電気回路ユニットの接地機構 Granted JPS63195977A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62028666A JPS63195977A (ja) 1987-02-10 1987-02-10 電気回路ユニットの接地機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62028666A JPS63195977A (ja) 1987-02-10 1987-02-10 電気回路ユニットの接地機構

Publications (2)

Publication Number Publication Date
JPS63195977A true JPS63195977A (ja) 1988-08-15
JPH0442780B2 JPH0442780B2 (enExample) 1992-07-14

Family

ID=12254835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62028666A Granted JPS63195977A (ja) 1987-02-10 1987-02-10 電気回路ユニットの接地機構

Country Status (1)

Country Link
JP (1) JPS63195977A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016506615A (ja) * 2012-11-23 2016-03-03 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ 自動車用の制御機器における等電位化

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017003977B4 (de) * 2017-04-25 2025-05-15 e.solutions GmbH Gehäusebauteil für ein elektronisches Gerät, Verfahren zum Herstellen des Gehäusebauteils und elektronisches Gerät mit dem Gehäusebauteil

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6062774U (ja) * 1983-10-06 1985-05-02 クラリオン株式会社 プリント基板のア−ス装置
JPS6186987U (enExample) * 1984-11-14 1986-06-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6062774U (ja) * 1983-10-06 1985-05-02 クラリオン株式会社 プリント基板のア−ス装置
JPS6186987U (enExample) * 1984-11-14 1986-06-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016506615A (ja) * 2012-11-23 2016-03-03 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ 自動車用の制御機器における等電位化
US10010017B2 (en) 2012-11-23 2018-06-26 Conti Temic Microelectronic Gmbh Potential equalization in a control device for a motor vehicle

Also Published As

Publication number Publication date
JPH0442780B2 (enExample) 1992-07-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees