JPH0442780B2 - - Google Patents
Info
- Publication number
- JPH0442780B2 JPH0442780B2 JP62028666A JP2866687A JPH0442780B2 JP H0442780 B2 JPH0442780 B2 JP H0442780B2 JP 62028666 A JP62028666 A JP 62028666A JP 2866687 A JP2866687 A JP 2866687A JP H0442780 B2 JPH0442780 B2 JP H0442780B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- case
- bonding
- circuit unit
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/50—
-
- H10W72/07551—
-
- H10W72/5363—
-
- H10W72/884—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62028666A JPS63195977A (ja) | 1987-02-10 | 1987-02-10 | 電気回路ユニットの接地機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62028666A JPS63195977A (ja) | 1987-02-10 | 1987-02-10 | 電気回路ユニットの接地機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63195977A JPS63195977A (ja) | 1988-08-15 |
| JPH0442780B2 true JPH0442780B2 (enExample) | 1992-07-14 |
Family
ID=12254835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62028666A Granted JPS63195977A (ja) | 1987-02-10 | 1987-02-10 | 電気回路ユニットの接地機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195977A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017003977A1 (de) * | 2017-04-25 | 2018-10-25 | e.solutions GmbH | Gehäusebauteil für ein elektronisches Gerät, Verfahren zum Herstellen des Gehäusebauteils und elektronisches Gerät mit dem Gehäusebauteil |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012111334A1 (de) | 2012-11-23 | 2014-05-28 | Conti Temic Microelectronic Gmbh | Potentialausgleich in einem Steuergerät für ein Kraftfahrzeug |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6062774U (ja) * | 1983-10-06 | 1985-05-02 | クラリオン株式会社 | プリント基板のア−ス装置 |
| JPS6186987U (enExample) * | 1984-11-14 | 1986-06-07 |
-
1987
- 1987-02-10 JP JP62028666A patent/JPS63195977A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017003977A1 (de) * | 2017-04-25 | 2018-10-25 | e.solutions GmbH | Gehäusebauteil für ein elektronisches Gerät, Verfahren zum Herstellen des Gehäusebauteils und elektronisches Gerät mit dem Gehäusebauteil |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63195977A (ja) | 1988-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |