JPS6318652A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS6318652A JPS6318652A JP61163032A JP16303286A JPS6318652A JP S6318652 A JPS6318652 A JP S6318652A JP 61163032 A JP61163032 A JP 61163032A JP 16303286 A JP16303286 A JP 16303286A JP S6318652 A JPS6318652 A JP S6318652A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pellet
- lead
- semiconductor device
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/413—
-
- H10W72/5449—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61163032A JPS6318652A (ja) | 1986-07-11 | 1986-07-11 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61163032A JPS6318652A (ja) | 1986-07-11 | 1986-07-11 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6318652A true JPS6318652A (ja) | 1988-01-26 |
| JPH0582981B2 JPH0582981B2 (enExample) | 1993-11-24 |
Family
ID=15765889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61163032A Granted JPS6318652A (ja) | 1986-07-11 | 1986-07-11 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6318652A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653400A (ja) * | 1992-07-28 | 1994-02-25 | Nec Corp | リードフレーム |
| KR19980067079A (ko) * | 1997-01-31 | 1998-10-15 | 이대원 | 트랜지스터용 리드프레임 제조방법 |
| USRE38704E1 (en) | 1995-06-26 | 2005-02-15 | Matsushita Electric Industrial Co., Ltd. | Optical disk recording method employing a plurality of recording areas and apparatus therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5421262A (en) * | 1977-07-18 | 1979-02-17 | Daiakon Inc | Method of producing electronic part package and device used therefor |
| JPS6095941A (ja) * | 1983-10-31 | 1985-05-29 | Toshiba Corp | 半導体装置 |
-
1986
- 1986-07-11 JP JP61163032A patent/JPS6318652A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5421262A (en) * | 1977-07-18 | 1979-02-17 | Daiakon Inc | Method of producing electronic part package and device used therefor |
| JPS6095941A (ja) * | 1983-10-31 | 1985-05-29 | Toshiba Corp | 半導体装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653400A (ja) * | 1992-07-28 | 1994-02-25 | Nec Corp | リードフレーム |
| USRE38704E1 (en) | 1995-06-26 | 2005-02-15 | Matsushita Electric Industrial Co., Ltd. | Optical disk recording method employing a plurality of recording areas and apparatus therefor |
| USRE41469E1 (en) | 1995-06-26 | 2010-08-03 | Panasonic Corporation | Optical disk recording method employing a plurality of recording areas and apparatus therefor |
| KR19980067079A (ko) * | 1997-01-31 | 1998-10-15 | 이대원 | 트랜지스터용 리드프레임 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582981B2 (enExample) | 1993-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |