JPS63159261U - - Google Patents

Info

Publication number
JPS63159261U
JPS63159261U JP1987050987U JP5098787U JPS63159261U JP S63159261 U JPS63159261 U JP S63159261U JP 1987050987 U JP1987050987 U JP 1987050987U JP 5098787 U JP5098787 U JP 5098787U JP S63159261 U JPS63159261 U JP S63159261U
Authority
JP
Japan
Prior art keywords
bonding pad
bank
die bonding
fluorescent display
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987050987U
Other languages
English (en)
Other versions
JPH0545009Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987050987U priority Critical patent/JPH0545009Y2/ja
Priority to US07/177,949 priority patent/US4835445A/en
Priority to KR1019880003839A priority patent/KR910009991B1/ko
Publication of JPS63159261U publication Critical patent/JPS63159261U/ja
Application granted granted Critical
Publication of JPH0545009Y2 publication Critical patent/JPH0545009Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H01J31/15—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen with ray or beam selectively directed to luminescent anode segments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例における要部断面
図、第１図ｂは同実施例におけるダイボンデング
パツド等の配設パターンを示す図、第２図はダイ
ボンド層の厚さとダイボンド層に発生する熱応力
の関係を接着面積の一辺の長さＬを媒介変数とし
て表わしたグラフ、第３図は従来のチツプイング
ラス構造の蛍光表示管の一部切欠平面図、第４図
ａは同従来の蛍光表示管における回路部の断面図
、同図ｂは同従来の蛍光表示管の回路部における
ダイボンデングパツド等の配設パターンを示す図
である。 １０…基板、１１…ダイボンデングパツド、１
２…半導体チツプとしてのＩＣチツプ、１３…ボ
ンデングパツド、１５…堤、１６…ダイボンド層
、１７…金属細線としてのワイヤ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 高真空雰囲気に保持された外囲器内の同一
    基板上に蛍光体層を被着した表示部と、この表示
    部を駆動する半導体チツプを有する回路部とを配
    設した蛍光表示管において、前記回路部は、前記
    基板上に配設されたダイボンデングパツドと、ダ
    イボンデングパツドの外方の基板上に配設された
    ボンデングパツドと、前記ダイボンデングパツド
    の外周と前記ボンデングパツドとの間に設けられ
    た絶縁性の堤と、前記堤の内方に設けられたダイ
    ボンド層を介して前記ダイボンデングパツドの上
    に固着された半導体チツプと、前記半導体チツプ
    と前記ボンデングパツドと結合する金属細線と、
    を有する構成になることを特徴とする蛍光表示管
    。 (2) 前記ボンデングパツドからの配線の少なく
    とも一部が前記絶縁層の堤によつて被覆された実
    用新案登録請求の範囲第１項記載の蛍光表示管。
JP1987050987U 1987-04-06 1987-04-06 Expired - Lifetime JPH0545009Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1987050987U JPH0545009Y2 (ja) 1987-04-06 1987-04-06
US07/177,949 US4835445A (en) 1987-04-06 1988-04-05 Fluorescent display device
KR1019880003839A KR910009991B1 (ko) 1987-04-06 1988-04-06 형광표시관 및 그의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987050987U JPH0545009Y2 (ja) 1987-04-06 1987-04-06

Publications (2)

Publication Number Publication Date
JPS63159261U true JPS63159261U (ja) 1988-10-18
JPH0545009Y2 JPH0545009Y2 (ja) 1993-11-16

Family

ID=12874148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987050987U Expired - Lifetime JPH0545009Y2 (ja) 1987-04-06 1987-04-06

Country Status (3)

Country Link
US (1) US4835445A (ja)
JP (1) JPH0545009Y2 (ja)
KR (1) KR910009991B1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087662A (ja) * 2007-09-28 2009-04-23 Futaba Corp 蛍光表示管及びその製造方法
JP2009085987A (ja) * 2007-09-27 2009-04-23 Futaba Corp 蛍光表示管

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2639211B2 (ja) * 1990-11-07 1997-08-06 日本電気株式会社 蛍光表示パネル
US5346748A (en) * 1992-01-08 1994-09-13 Nec Corporation Fluorescent display panel containing chip of integrated circuit with discrepancy markers to aid in lead bonding
US5736814A (en) * 1995-09-06 1998-04-07 Ise Electronics Corporation Vacuum flourescent display apparatus
US7391153B2 (en) * 2003-07-17 2008-06-24 Toyoda Gosei Co., Ltd. Light emitting device provided with a submount assembly for improved thermal dissipation
JP5066333B2 (ja) * 2005-11-02 2012-11-07 シチズン電子株式会社 Ｌｅｄ発光装置。
DE102012201935A1 (de) 2012-02-09 2013-08-14 Robert Bosch Gmbh Verbindungsanordnung eines elektrischen und/oder elektronischen Bauelements
CN112530878A (zh) * 2019-09-18 2021-03-19 深圳市中光工业技术研究院 用于焊接电子元器件的基底及其制备方法、半导体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5885341U (ja) * 1981-12-07 1983-06-09 日本電気株式会社 印刷基板
JPS6178127A (ja) * 1984-09-26 1986-04-21 Toshiba Corp 薄膜配線基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208886A (ja) * 1984-03-31 1985-10-21 株式会社東芝 電子部品の製造方法
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
JPH06122946A (ja) * 1992-08-25 1994-05-06 Nippon Steel Corp 耐粒界腐食性に優れたオーステナイト系ステンレス鋼
JPH06155847A (ja) * 1992-11-20 1994-06-03 Oki Electric Ind Co Ltd プリンタ装置
JPH06250984A (ja) * 1993-02-23 1994-09-09 Hitachi Ltd 分散処理システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5885341U (ja) * 1981-12-07 1983-06-09 日本電気株式会社 印刷基板
JPS6178127A (ja) * 1984-09-26 1986-04-21 Toshiba Corp 薄膜配線基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009085987A (ja) * 2007-09-27 2009-04-23 Futaba Corp 蛍光表示管
JP2009087662A (ja) * 2007-09-28 2009-04-23 Futaba Corp 蛍光表示管及びその製造方法
JP4567041B2 (ja) * 2007-09-28 2010-10-20 双葉電子工業株式会社 車載用蛍光表示管及びその製造方法
KR100993410B1 (ko) * 2007-09-28 2010-11-09 후다바 덴시 고교 가부시키가이샤 차량탑재용 형광 표시관 및 그 제조 방법

Also Published As

Publication number Publication date
KR910009991B1 (ko) 1991-12-09
KR880013211A (ko) 1988-11-30
JPH0545009Y2 (ja) 1993-11-16
US4835445A (en) 1989-05-30

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