JPS6313840B2 - - Google Patents
Info
- Publication number
- JPS6313840B2 JPS6313840B2 JP61052763A JP5276386A JPS6313840B2 JP S6313840 B2 JPS6313840 B2 JP S6313840B2 JP 61052763 A JP61052763 A JP 61052763A JP 5276386 A JP5276386 A JP 5276386A JP S6313840 B2 JPS6313840 B2 JP S6313840B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- sheet
- integrated circuit
- cover
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 239000011800 void material Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 16
- 230000008901 benefit Effects 0.000 description 8
- 239000002775 capsule Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000004049 embossing Methods 0.000 description 4
- 229920001756 Polyvinyl chloride acetate Polymers 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01063—Europium [Eu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01094—Plutonium [Pu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
- Audible And Visible Signals (AREA)
- Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
- Handling Of Sheets (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7540361 | 1975-12-31 | ||
FR7540361A FR2337381A1 (fr) | 1975-12-31 | 1975-12-31 | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS625894A JPS625894A (ja) | 1987-01-12 |
JPS6313840B2 true JPS6313840B2 (fr) | 1988-03-28 |
Family
ID=9164418
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15766976A Granted JPS5283132A (en) | 1975-12-31 | 1976-12-28 | Portable card for electric signal processor and method of fabricating same |
JP61052763A Granted JPS625894A (ja) | 1975-12-31 | 1986-03-12 | カ−ド及びカ−ドの製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15766976A Granted JPS5283132A (en) | 1975-12-31 | 1976-12-28 | Portable card for electric signal processor and method of fabricating same |
Country Status (11)
Country | Link |
---|---|
JP (2) | JPS5283132A (fr) |
BR (1) | BR7608831A (fr) |
CA (1) | CA1083714A (fr) |
CH (1) | CH619310A5 (fr) |
DE (1) | DE2659573C2 (fr) |
ES (1) | ES454567A1 (fr) |
FR (1) | FR2337381A1 (fr) |
GB (1) | GB1567784A (fr) |
IT (1) | IT1124741B (fr) |
NL (1) | NL190131C (fr) |
SE (1) | SE415304B (fr) |
Families Citing this family (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2379949A1 (fr) * | 1977-02-07 | 1978-09-01 | Cii Honeywell Bull | Dispositif de controle d'un contact insere entre un circuit emetteur et un circuit recepteur pour la transmission de signaux electriques |
FR2415378A1 (fr) * | 1978-01-24 | 1979-08-17 | Moreno Roland | Procede et dispositif pour connecter electriquement un objet amovible notamment une carte electronique portative |
FR2439478A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Boitier plat pour dispositifs a circuits integres |
JPS5562591A (en) * | 1978-10-30 | 1980-05-12 | Fujitsu Ltd | Memory card |
DE2919649A1 (de) * | 1979-05-16 | 1980-11-20 | Bbc Brown Boveri & Cie | Sicherheitspapier |
DE2920012B1 (de) * | 1979-05-17 | 1980-11-20 | Gao Ges Automation Org | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
DE2926867C2 (de) * | 1979-07-03 | 1986-01-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Schaltungseinheit |
FR2477303B1 (fr) * | 1980-02-28 | 1986-09-26 | Dassault Electronique | Dispositif de lecture de cartes electroniques |
FR2480008A1 (fr) * | 1980-04-04 | 1981-10-09 | Flonic Sa | Perfectionnements aux cartes a memoire |
DE3019206A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Verfahren zur kontaktierung von galvanischen kontakten einer ausweiskarte mit eingebettetem ic-baustein |
DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
FR2486685B1 (fr) * | 1980-07-09 | 1985-10-31 | Labo Electronique Physique | Carte de paiement electronique et procede de realisation |
DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DE3033881A1 (de) * | 1980-09-09 | 1982-04-15 | Siemens AG, 1000 Berlin und 8000 München | Gehaeuseloses schaltungsmodul und verfahren zu seiner herstellung |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
JPS57123555U (fr) * | 1981-01-26 | 1982-08-02 | ||
JPS57123556U (fr) * | 1981-01-26 | 1982-08-02 | ||
NL191959B (nl) * | 1981-03-24 | 1996-07-01 | Gao Ges Automation Org | Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen. |
DE3111516A1 (de) * | 1981-03-24 | 1982-12-23 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | "ausweiskarte mit ic-baustein" |
DE3153769C2 (de) * | 1981-04-14 | 1995-10-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
JPS57209578A (en) * | 1981-06-19 | 1982-12-22 | Fujitsu Ltd | Card |
DE3130324A1 (de) * | 1981-07-31 | 1983-02-17 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
FR2511544A1 (fr) * | 1981-08-14 | 1983-02-18 | Dassault Electronique | Module electronique pour carte de transactions automatiques et carte equipee d'un tel module |
JPS5888892A (ja) * | 1981-11-20 | 1983-05-27 | Hitachi Ltd | バブルメモリカセツト |
JPS5892597A (ja) * | 1981-11-28 | 1983-06-01 | 大日本印刷株式会社 | Icカ−ドの製造方法 |
DE3151408C1 (de) * | 1981-12-24 | 1983-06-01 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit einem IC-Baustein |
JPS58110474U (ja) * | 1982-01-22 | 1983-07-27 | 凸版印刷株式会社 | カ−ド |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
FR2523335A1 (fr) * | 1982-03-10 | 1983-09-16 | Flonic Sa | Procede pour surelever les plages de contact electrique d'une carte a memoire |
JPS58187858U (ja) * | 1982-06-08 | 1983-12-13 | セイコーインスツルメンツ株式会社 | Icカ−ド |
JPS58221478A (ja) * | 1982-06-16 | 1983-12-23 | Kyodo Printing Co Ltd | Icカ−ド |
JPS5944067U (ja) * | 1982-09-16 | 1984-03-23 | 大日本印刷株式会社 | Icカ−ド |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
JPS5958949U (ja) * | 1982-10-08 | 1984-04-17 | 凸版印刷株式会社 | Ic等を内蔵するカ−ド |
DE3313414A1 (de) * | 1983-04-13 | 1984-10-18 | Hubert 8958 Füssen Schweiger | Verwendung eines programmierbaren, in einen ausweis integrierten festwertspeicherbausteines zur speicherung von informationen fuer mikroprozessor gesteuertes lesegeraet |
FR2555780B1 (fr) * | 1983-11-29 | 1986-04-11 | Flonic Sa | Procede de fabrication de cartes a memoire et cartes obtenues suivant ce procede |
EP0128822B1 (fr) * | 1983-06-09 | 1987-09-09 | Flonic S.A. | Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé |
FR2548409B1 (fr) * | 1983-06-29 | 1985-11-15 | Sligos | Procede pour la fabrication de cartes a memoire, installation et cartes a memoire obtenues |
FR2548857B1 (fr) * | 1983-07-04 | 1987-11-27 | Cortaillod Cables Sa | Procede de fabrication en continu d'une carte imprimee |
JPS6084686A (ja) * | 1983-10-17 | 1985-05-14 | Toshiba Corp | 情報記録媒体の記録方式 |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
FR2554275B1 (fr) * | 1983-10-26 | 1986-09-05 | Radiotechnique Compelec | Dispositif de connexion pour un semi-conducteur de puissance |
JPS59108580A (ja) * | 1983-11-17 | 1984-06-23 | 株式会社ソフイア | 遊技装置の遊技情報管理媒体 |
JPS59108581A (ja) * | 1983-11-17 | 1984-06-23 | 株式会社ソフイア | カ−ド式パチンコ機 |
FR2557715B1 (fr) * | 1983-12-30 | 1987-07-17 | Bull Sa | Procede et systeme pour traiter de facon confidentielle des informations stockees sur une piste d'enregistrement a lecture optique d'un support portatif |
JPS60126864U (ja) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | Icカ−ド |
JPS60126863U (ja) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | Icカ−ド |
FR2575566B1 (fr) * | 1984-12-28 | 1990-06-22 | Bull Sa | Procede pour personnaliser des supports portatifs tels que des cartes |
FR2581480A1 (fr) * | 1985-04-10 | 1986-11-07 | Ebauches Electroniques Sa | Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite |
JPS61248184A (ja) * | 1985-04-26 | 1986-11-05 | Kyodo Printing Co Ltd | Icモジユ−ル |
JPS61188871U (fr) * | 1985-05-16 | 1986-11-25 | ||
FR2584235B1 (fr) * | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
FR2584236B1 (fr) * | 1985-06-26 | 1988-04-29 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
FR2584862B1 (fr) * | 1985-07-12 | 1988-05-20 | Eurotechnique Sa | Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede |
US4841134A (en) * | 1985-07-27 | 1989-06-20 | Dai Nippon Insatsu Kabushika Kaisha | IC card |
FR2590051B1 (fr) * | 1985-11-08 | 1991-05-17 | Eurotechnique Sa | Carte comportant un composant et micromodule a contacts de flanc |
FR2590052B1 (fr) * | 1985-11-08 | 1991-03-01 | Eurotechnique Sa | Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee |
US4755661A (en) * | 1986-01-10 | 1988-07-05 | Ruebsam Herrn H | Connection of electronic components in a card |
FR2599165A1 (fr) * | 1986-05-21 | 1987-11-27 | Michot Gerard | Objet associe a un element electronique et procede d'obtention |
JPS63185688A (ja) * | 1987-01-29 | 1988-08-01 | 大日本印刷株式会社 | Icカ−ドの製造方法 |
DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
US4931623A (en) * | 1987-11-14 | 1990-06-05 | Kabushiki Kaisha Toshiba | Portable storage medium |
JPH01152098A (ja) * | 1988-09-08 | 1989-06-14 | Dainippon Printing Co Ltd | Icカード用カード基材 |
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
JP2543235B2 (ja) * | 1990-06-29 | 1996-10-16 | 松下電器産業株式会社 | Icカ―ドアダプタ |
DE9100665U1 (fr) * | 1991-01-21 | 1992-07-16 | Telbus Gesellschaft Fuer Elektronische Kommunikations-Systeme Mbh, 8057 Eching, De | |
DE9113601U1 (fr) * | 1991-10-31 | 1993-03-04 | Schneider, Edgar, 8057 Guenzenhausen, De | |
DE4209184C1 (fr) * | 1992-03-21 | 1993-05-19 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
JPH07164787A (ja) * | 1992-03-26 | 1995-06-27 | Dainippon Printing Co Ltd | Icカードの製造方法 |
US5497140A (en) * | 1992-08-12 | 1996-03-05 | Micron Technology, Inc. | Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication |
USRE42773E1 (en) | 1992-06-17 | 2011-10-04 | Round Rock Research, Llc | Method of manufacturing an enclosed transceiver |
US5776278A (en) | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
DE4319878A1 (de) * | 1992-06-17 | 1993-12-23 | Micron Technology Inc | Hochfrequenz-Identifikationseinrichtung (HFID) und Verfahren zu ihrer Herstellung |
US7158031B2 (en) | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
DE4337921C2 (de) * | 1993-11-06 | 1998-09-03 | Ods Gmbh & Co Kg | Kontaktlose Chipkarte mit Antennenspule |
DE4340847A1 (de) * | 1993-11-26 | 1995-06-01 | Optosys Gmbh Berlin | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
JPH071877A (ja) * | 1993-12-28 | 1995-01-06 | Dainippon Printing Co Ltd | カード記録方法 |
DE19539181C2 (de) * | 1995-10-20 | 1998-05-14 | Ods Gmbh & Co Kg | Chipkartenmodul sowie entsprechendes Herstellungsverfahren |
DE19618103C2 (de) * | 1996-05-06 | 1998-05-14 | Siemens Ag | Chipkartenmodul mit Beschichtung aus leitfähigem Kunststoff und Verfahren zu dessen Herstellung |
US5988510A (en) * | 1997-02-13 | 1999-11-23 | Micron Communications, Inc. | Tamper resistant smart card and method of protecting data in a smart card |
DE19708617C2 (de) * | 1997-03-03 | 1999-02-04 | Siemens Ag | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte |
US6329213B1 (en) | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
US6339385B1 (en) | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
FR2769130B1 (fr) * | 1997-09-30 | 2001-06-08 | Thomson Csf | Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede |
US6273339B1 (en) | 1999-08-30 | 2001-08-14 | Micron Technology, Inc. | Tamper resistant smart card and method of protecting data in a smart card |
US6427918B1 (en) * | 2000-11-29 | 2002-08-06 | Palm, Inc. | Apparatus for storing auxiliary add-in cards for a portable electronic system |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4004133A (en) * | 1974-12-30 | 1977-01-18 | Rca Corporation | Credit card containing electronic circuit |
FR2299724A1 (fr) * | 1975-01-29 | 1976-08-27 | Honeywell Bull Soc Ind | Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres |
FR2311406A1 (fr) * | 1975-05-13 | 1976-12-10 | Honeywell Bull Soc Ind | Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres |
JPS591463B2 (ja) * | 1976-07-01 | 1984-01-12 | 鐘淵化学工業株式会社 | 起泡性組成物 |
-
1975
- 1975-12-31 FR FR7540361A patent/FR2337381A1/fr active Granted
-
1976
- 1976-12-09 IT IT3018576A patent/IT1124741B/it active
- 1976-12-10 CH CH1558976A patent/CH619310A5/fr not_active IP Right Cessation
- 1976-12-16 CA CA268,082A patent/CA1083714A/fr not_active Expired
- 1976-12-20 GB GB5321476A patent/GB1567784A/en not_active Expired
- 1976-12-23 ES ES454567A patent/ES454567A1/es not_active Expired
- 1976-12-28 SE SE7614622A patent/SE415304B/xx not_active IP Right Cessation
- 1976-12-28 JP JP15766976A patent/JPS5283132A/ja active Granted
- 1976-12-30 BR BR7608831A patent/BR7608831A/pt unknown
- 1976-12-30 DE DE19762659573 patent/DE2659573C2/de not_active Expired
- 1976-12-31 NL NL7614637A patent/NL190131C/xx not_active IP Right Cessation
-
1986
- 1986-03-12 JP JP61052763A patent/JPS625894A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS625894A (ja) | 1987-01-12 |
JPS5283132A (en) | 1977-07-11 |
IT1124741B (it) | 1986-05-14 |
FR2337381B1 (fr) | 1979-07-06 |
NL7614637A (nl) | 1977-07-04 |
SE415304B (sv) | 1980-09-22 |
SE7614622L (sv) | 1977-07-02 |
NL190131B (nl) | 1993-06-01 |
JPS6130315B2 (fr) | 1986-07-12 |
DE2659573A1 (de) | 1977-07-14 |
DE2659573C2 (de) | 1986-02-27 |
GB1567784A (en) | 1980-05-21 |
BR7608831A (pt) | 1977-10-25 |
CA1083714A (fr) | 1980-08-12 |
CH619310A5 (en) | 1980-09-15 |
FR2337381A1 (fr) | 1977-07-29 |
NL190131C (nl) | 1993-11-01 |
ES454567A1 (es) | 1977-12-16 |
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