JPH0416836B2 - - Google Patents
Info
- Publication number
- JPH0416836B2 JPH0416836B2 JP6635284A JP6635284A JPH0416836B2 JP H0416836 B2 JPH0416836 B2 JP H0416836B2 JP 6635284 A JP6635284 A JP 6635284A JP 6635284 A JP6635284 A JP 6635284A JP H0416836 B2 JPH0416836 B2 JP H0416836B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- card
- insulating substrate
- insulating
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011111 cardboard Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59066352A JPS60209885A (ja) | 1984-04-02 | 1984-04-02 | Icカ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59066352A JPS60209885A (ja) | 1984-04-02 | 1984-04-02 | Icカ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60209885A JPS60209885A (ja) | 1985-10-22 |
JPH0416836B2 true JPH0416836B2 (fr) | 1992-03-25 |
Family
ID=13313375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59066352A Granted JPS60209885A (ja) | 1984-04-02 | 1984-04-02 | Icカ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60209885A (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH082703B2 (ja) * | 1986-03-14 | 1996-01-17 | カシオ計算機株式会社 | Icカ−ド |
JP2609863B2 (ja) * | 1987-05-22 | 1997-05-14 | 大日本印刷株式会社 | Icカード用リードフレーム |
FR2732796B1 (fr) * | 1995-04-07 | 1997-05-09 | Solaic Sa | Procede pour fixer un element fonctionnel dans un corps de carte electronique a l'aide d'une matiere expansible |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5748175A (en) * | 1980-07-09 | 1982-03-19 | Philips Nv | Portable identifying structure |
-
1984
- 1984-04-02 JP JP59066352A patent/JPS60209885A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5748175A (en) * | 1980-07-09 | 1982-03-19 | Philips Nv | Portable identifying structure |
Also Published As
Publication number | Publication date |
---|---|
JPS60209885A (ja) | 1985-10-22 |
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