JPS63131561A - 電子パツケージ - Google Patents

電子パツケージ

Info

Publication number
JPS63131561A
JPS63131561A JP62231256A JP23125687A JPS63131561A JP S63131561 A JPS63131561 A JP S63131561A JP 62231256 A JP62231256 A JP 62231256A JP 23125687 A JP23125687 A JP 23125687A JP S63131561 A JPS63131561 A JP S63131561A
Authority
JP
Japan
Prior art keywords
semiconductor chip
electronic package
thin film
input
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62231256A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0477469B2 (enExample
Inventor
ヴインセント・ジヨセフ・ブラツク
ロナルド・ステフエン・チヤースキイ
レオナルド・セオドール・オルソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63131561A publication Critical patent/JPS63131561A/ja
Publication of JPH0477469B2 publication Critical patent/JPH0477469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W44/601—
    • H10W70/611—
    • H10W70/688—
    • H10W72/877—
    • H10W90/724—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP62231256A 1986-11-18 1987-09-17 電子パツケージ Granted JPS63131561A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93181386A 1986-11-18 1986-11-18
US931813 1986-11-18

Publications (2)

Publication Number Publication Date
JPS63131561A true JPS63131561A (ja) 1988-06-03
JPH0477469B2 JPH0477469B2 (enExample) 1992-12-08

Family

ID=25461394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231256A Granted JPS63131561A (ja) 1986-11-18 1987-09-17 電子パツケージ

Country Status (3)

Country Link
EP (1) EP0268260B1 (enExample)
JP (1) JPS63131561A (enExample)
DE (1) DE3780915T2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227746U (enExample) * 1988-08-11 1990-02-22
JPH03268351A (ja) * 1990-03-16 1991-11-29 Toshiba Corp 半導体装置
US6693362B2 (en) 2001-04-13 2004-02-17 Fujitsu Limited Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0370743A1 (en) * 1988-11-21 1990-05-30 Honeywell Inc. Decoupling filter leadframe assembly
US5099306A (en) * 1988-11-21 1992-03-24 Honeywell Inc. Stacked tab leadframe assembly
CA1315021C (en) * 1988-11-21 1993-03-23 Francis J. Belcourt Stacked leadframe assembly
EP0370738A1 (en) * 1988-11-21 1990-05-30 Honeywell Inc. Solder bumped leadframe
US5066614A (en) * 1988-11-21 1991-11-19 Honeywell Inc. Method of manufacturing a leadframe having conductive elements preformed with solder bumps
US5161729A (en) * 1988-11-21 1992-11-10 Honeywell Inc. Package to semiconductor chip active interconnect site method
EP0381849A1 (de) * 1989-02-07 1990-08-16 Asea Brown Boveri Ag Schnelle Leistungshalbleiterschaltung
DE69010546T2 (de) * 1989-04-17 1995-02-09 Matsushita Electric Ind Co Ltd Hochfrequenz-Halbleiteranordnung.
US5057907A (en) * 1990-06-11 1991-10-15 National Semiconductor Corp. Method and structure for forming vertical semiconductor interconnection
US5041903A (en) * 1990-06-11 1991-08-20 National Semiconductor Corp. Vertical semiconductor interconnection method and structure
US5210451A (en) * 1990-06-25 1993-05-11 Asea Brown Boveri Ltd. Power semiconductor circuit
ATE105458T1 (de) * 1990-08-03 1994-05-15 Siemens Nixdorf Inf Syst Einbausystem fuer elektrische funktionseinheiten insbesondere fuer die datentechnik.
SE470415B (sv) * 1992-07-06 1994-02-14 Ericsson Telefon Ab L M Kondensator med hög kapacitans i ett integrerat funktionsblock eller en integrerad krets, förfarande för framställning av kondensatorn och användning av kondensatorn som en integrerad avkopplingskondensator
JP3288840B2 (ja) * 1994-02-28 2002-06-04 三菱電機株式会社 半導体装置およびその製造方法
US5905639A (en) * 1997-09-29 1999-05-18 Raytheon Company Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
US7030481B2 (en) * 2002-12-09 2006-04-18 Internation Business Machines Corporation High density chip carrier with integrated passive devices
DE102004014439A1 (de) * 2004-03-24 2005-07-07 Siemens Ag Schaltkreis-Anordnung und Schaltkreis-Vorrichtung
US8269330B1 (en) * 2011-04-22 2012-09-18 Cyntec Co., Ltd. MOSFET pair with stack capacitor and manufacturing method thereof
US11926123B2 (en) 2019-05-17 2024-03-12 Mucell Extrusion, Llc Multi-layer polymer foam film for packaging applications and the method of making the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251879A (en) * 1975-10-24 1977-04-26 Hitachi Ltd Semiconductor integrated circuit
JPS5487173A (en) * 1977-12-23 1979-07-11 Hitachi Ltd Semiconductor device
JPS6133258A (ja) * 1984-07-25 1986-02-17 Matsushita Electric Ind Co Ltd 噴霧装置
JPS61134060A (ja) * 1984-12-04 1986-06-21 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
FR2511544A1 (fr) * 1981-08-14 1983-02-18 Dassault Electronique Module electronique pour carte de transactions automatiques et carte equipee d'un tel module
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
JPS61111561A (ja) * 1984-10-05 1986-05-29 Fujitsu Ltd 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251879A (en) * 1975-10-24 1977-04-26 Hitachi Ltd Semiconductor integrated circuit
JPS5487173A (en) * 1977-12-23 1979-07-11 Hitachi Ltd Semiconductor device
JPS6133258A (ja) * 1984-07-25 1986-02-17 Matsushita Electric Ind Co Ltd 噴霧装置
JPS61134060A (ja) * 1984-12-04 1986-06-21 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227746U (enExample) * 1988-08-11 1990-02-22
JPH03268351A (ja) * 1990-03-16 1991-11-29 Toshiba Corp 半導体装置
US6693362B2 (en) 2001-04-13 2004-02-17 Fujitsu Limited Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate

Also Published As

Publication number Publication date
DE3780915D1 (de) 1992-09-10
EP0268260A1 (en) 1988-05-25
EP0268260B1 (en) 1992-08-05
JPH0477469B2 (enExample) 1992-12-08
DE3780915T2 (de) 1993-03-11

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