JPS6244857B2 - - Google Patents

Info

Publication number
JPS6244857B2
JPS6244857B2 JP57037031A JP3703182A JPS6244857B2 JP S6244857 B2 JPS6244857 B2 JP S6244857B2 JP 57037031 A JP57037031 A JP 57037031A JP 3703182 A JP3703182 A JP 3703182A JP S6244857 B2 JPS6244857 B2 JP S6244857B2
Authority
JP
Japan
Prior art keywords
lead
pin
correction
base
comb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57037031A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58154253A (ja
Inventor
Shoji Nagamachi
Kanji Ishige
Hideaki Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57037031A priority Critical patent/JPS58154253A/ja
Publication of JPS58154253A publication Critical patent/JPS58154253A/ja
Publication of JPS6244857B2 publication Critical patent/JPS6244857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57037031A 1982-03-09 1982-03-09 Ｉｃリ−ド矯正機構 Granted JPS58154253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57037031A JPS58154253A (ja) 1982-03-09 1982-03-09 Ｉｃリ−ド矯正機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57037031A JPS58154253A (ja) 1982-03-09 1982-03-09 Ｉｃリ−ド矯正機構

Publications (2)

Publication Number Publication Date
JPS58154253A JPS58154253A (ja) 1983-09-13
JPS6244857B2 true JPS6244857B2 (enExample) 1987-09-22

Family

ID=12486261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57037031A Granted JPS58154253A (ja) 1982-03-09 1982-03-09 Ｉｃリ−ド矯正機構

Country Status (1)

Country Link
JP (1) JPS58154253A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6298658U (enExample) * 1985-12-11 1987-06-23
JPH0222964U (enExample) * 1988-07-29 1990-02-15

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4481984A (en) * 1982-03-29 1984-11-13 American Tech Manufacturing Inc. Electronic component lead straightening device and method
JPS5936260U (ja) * 1982-08-30 1984-03-07 日本電気ホームエレクトロニクス株式会社 電子部品のリ−ド修整装置
JPH06163782A (ja) * 1992-11-17 1994-06-10 Sanyo Silicon Denshi Kk Ｉｃリードの曲り矯正装置
JP5632217B2 (ja) * 2010-07-08 2014-11-26 矢崎総業株式会社 コネクタのインサート成形方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6298658U (enExample) * 1985-12-11 1987-06-23
JPH0222964U (enExample) * 1988-07-29 1990-02-15

Also Published As

Publication number Publication date
JPS58154253A (ja) 1983-09-13

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