JPS6244423B2 - - Google Patents

Info

Publication number
JPS6244423B2
JPS6244423B2 JP16370982A JP16370982A JPS6244423B2 JP S6244423 B2 JPS6244423 B2 JP S6244423B2 JP 16370982 A JP16370982 A JP 16370982A JP 16370982 A JP16370982 A JP 16370982A JP S6244423 B2 JPS6244423 B2 JP S6244423B2
Authority
JP
Japan
Prior art keywords
semiconductor device
die set
bending
stripper
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16370982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5952858A (ja
Inventor
Keigo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16370982A priority Critical patent/JPS5952858A/ja
Publication of JPS5952858A publication Critical patent/JPS5952858A/ja
Publication of JPS6244423B2 publication Critical patent/JPS6244423B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/023—Feeding of components with bending or straightening of the terminal leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16370982A 1982-09-18 1982-09-18 半導体装置のリ−ド成形装置 Granted JPS5952858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16370982A JPS5952858A (ja) 1982-09-18 1982-09-18 半導体装置のリ−ド成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16370982A JPS5952858A (ja) 1982-09-18 1982-09-18 半導体装置のリ−ド成形装置

Publications (2)

Publication Number Publication Date
JPS5952858A JPS5952858A (ja) 1984-03-27
JPS6244423B2 true JPS6244423B2 (enrdf_load_html_response) 1987-09-21

Family

ID=15779139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16370982A Granted JPS5952858A (ja) 1982-09-18 1982-09-18 半導体装置のリ−ド成形装置

Country Status (1)

Country Link
JP (1) JPS5952858A (enrdf_load_html_response)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215758A (ja) * 1983-05-23 1984-12-05 Yamada Seisakusho:Kk 半導体リ−ド成形方法
JPH0349401Y2 (enrdf_load_html_response) * 1986-07-31 1991-10-22
JPS63104459A (ja) * 1986-10-22 1988-05-09 Mitsubishi Electric Corp 混成集積回路装置
JPH03219661A (ja) * 1990-01-25 1991-09-27 Y K C:Kk 半導体パッケージの外部リード折曲装置
BE1005064A4 (nl) * 1991-07-03 1993-04-06 Asm Fico Tooling Buiginrichting.
JPH06100452A (ja) * 1993-04-06 1994-04-12 Asta Medica Ag イホスファミド用の製薬学的容器
US5585281A (en) * 1995-02-03 1996-12-17 Motorola, Inc. Process and apparatus for forming and testing semiconductor package leads
KR100361010B1 (ko) * 1999-12-31 2002-11-18 주식회사 아큐텍반도체기술 리드프레임 도금장치

Also Published As

Publication number Publication date
JPS5952858A (ja) 1984-03-27

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