JPS6239821B2 - - Google Patents

Info

Publication number
JPS6239821B2
JPS6239821B2 JP56077396A JP7739681A JPS6239821B2 JP S6239821 B2 JPS6239821 B2 JP S6239821B2 JP 56077396 A JP56077396 A JP 56077396A JP 7739681 A JP7739681 A JP 7739681A JP S6239821 B2 JPS6239821 B2 JP S6239821B2
Authority
JP
Japan
Prior art keywords
wafer
wafers
opening
holder
stacking tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56077396A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57192020A (en
Inventor
Masaaki Sadamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7739681A priority Critical patent/JPS57192020A/ja
Publication of JPS57192020A publication Critical patent/JPS57192020A/ja
Publication of JPS6239821B2 publication Critical patent/JPS6239821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP7739681A 1981-05-20 1981-05-20 Stacking tool for thin plate body Granted JPS57192020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7739681A JPS57192020A (en) 1981-05-20 1981-05-20 Stacking tool for thin plate body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7739681A JPS57192020A (en) 1981-05-20 1981-05-20 Stacking tool for thin plate body

Publications (2)

Publication Number Publication Date
JPS57192020A JPS57192020A (en) 1982-11-26
JPS6239821B2 true JPS6239821B2 (de) 1987-08-25

Family

ID=13632727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7739681A Granted JPS57192020A (en) 1981-05-20 1981-05-20 Stacking tool for thin plate body

Country Status (1)

Country Link
JP (1) JPS57192020A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261406U (de) * 1988-10-31 1990-05-08

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106136A (ja) * 1983-11-14 1985-06-11 Mitsubishi Electric Corp 薄板状体の洗浄装置
JP2006286446A (ja) * 2005-04-01 2006-10-19 Matsushita Electric Ind Co Ltd フレキシブルケーブルおよびフレキシブルケーブルの製造方法およびフレキシブルケーブルの形成方法ならびにフレキシブルケーブルに取り付けられる部品の固定方法
ITUD20070202A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Contenitore per lo stoccaggio di piastre per circuiti elettronici e relativo procedimento

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129974A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Palte form object transfer device
JPS5640656B2 (de) * 1973-12-11 1981-09-22

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832266Y2 (ja) * 1979-09-05 1983-07-18 三菱電機株式会社 薄板体の立替具

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640656B2 (de) * 1973-12-11 1981-09-22
JPS53129974A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Palte form object transfer device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261406U (de) * 1988-10-31 1990-05-08

Also Published As

Publication number Publication date
JPS57192020A (en) 1982-11-26

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