JPS57192020A - Stacking tool for thin plate body - Google Patents

Stacking tool for thin plate body

Info

Publication number
JPS57192020A
JPS57192020A JP7739681A JP7739681A JPS57192020A JP S57192020 A JPS57192020 A JP S57192020A JP 7739681 A JP7739681 A JP 7739681A JP 7739681 A JP7739681 A JP 7739681A JP S57192020 A JPS57192020 A JP S57192020A
Authority
JP
Japan
Prior art keywords
holder
thin plate
stacking tool
wafers
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7739681A
Other languages
English (en)
Other versions
JPS6239821B2 (ja
Inventor
Masaaki Sadamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7739681A priority Critical patent/JPS57192020A/ja
Publication of JPS57192020A publication Critical patent/JPS57192020A/ja
Publication of JPS6239821B2 publication Critical patent/JPS6239821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP7739681A 1981-05-20 1981-05-20 Stacking tool for thin plate body Granted JPS57192020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7739681A JPS57192020A (en) 1981-05-20 1981-05-20 Stacking tool for thin plate body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7739681A JPS57192020A (en) 1981-05-20 1981-05-20 Stacking tool for thin plate body

Publications (2)

Publication Number Publication Date
JPS57192020A true JPS57192020A (en) 1982-11-26
JPS6239821B2 JPS6239821B2 (ja) 1987-08-25

Family

ID=13632727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7739681A Granted JPS57192020A (en) 1981-05-20 1981-05-20 Stacking tool for thin plate body

Country Status (1)

Country Link
JP (1) JPS57192020A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106136A (ja) * 1983-11-14 1985-06-11 Mitsubishi Electric Corp 薄板状体の洗浄装置
JP2006286446A (ja) * 2005-04-01 2006-10-19 Matsushita Electric Ind Co Ltd フレキシブルケーブルおよびフレキシブルケーブルの製造方法およびフレキシブルケーブルの形成方法ならびにフレキシブルケーブルに取り付けられる部品の固定方法
WO2009053788A1 (en) * 2007-10-24 2009-04-30 Baccini Spa Container for storing plates for electronic circuits and relative method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261406U (ja) * 1988-10-31 1990-05-08

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129974A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Palte form object transfer device
JPS5640656U (ja) * 1979-09-05 1981-04-15

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640656B2 (ja) * 1973-12-11 1981-09-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129974A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Palte form object transfer device
JPS5640656U (ja) * 1979-09-05 1981-04-15

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106136A (ja) * 1983-11-14 1985-06-11 Mitsubishi Electric Corp 薄板状体の洗浄装置
JP2006286446A (ja) * 2005-04-01 2006-10-19 Matsushita Electric Ind Co Ltd フレキシブルケーブルおよびフレキシブルケーブルの製造方法およびフレキシブルケーブルの形成方法ならびにフレキシブルケーブルに取り付けられる部品の固定方法
WO2009053788A1 (en) * 2007-10-24 2009-04-30 Baccini Spa Container for storing plates for electronic circuits and relative method

Also Published As

Publication number Publication date
JPS6239821B2 (ja) 1987-08-25

Similar Documents

Publication Publication Date Title
DE3268680D1 (en) Electrostatic chuck for holding a semiconductor wafer
JPS5333067A (en) Chuck for holding flat workpiece
EP0320297A3 (en) Wafer chuck
EP0485085A3 (en) Oxide modified air electrode surface for high temperature electrochemical cells
GB2035610B (en) Wafer projection aligner
KR890700999A (ko) 플랫팩 반도체 패키지용 번-인 소켓
IT8026864A0 (it) Complesso di supporto per elementi stratificati (wafer) a semiconduttori.
DE3068442D1 (en) Thin film structure for ceramic substrates
EP0933985A3 (en) Electric-component transferring apparatus, and method and apparatus for exchanging component holders therein
SE427460B (sv) Pyrimidin(5)yl(tiono)(tiol)-fosfor(fosfon)-syraestrar och -esteramider till anvendning som insekticider, akaricider och nematocider
EP0318315A3 (en) Process for making thin film solar cell
GB8316405D0 (en) Air vacuum chuck for microscope
AU5492680A (en) Monocrystalline silicon sheets for solar cells
JPS54139199A (en) Quick releasing mechanism for socket wrench
DE3366974D1 (en) Apparatus for introducing silicon wafers in magazines into a furnace
DE3375433D1 (en) Optical lithography process for creating patterns in a silicon semiconductor substrate
DE2966008D1 (en) Device for the precise alignment of planar workpieces, e.g. semiconductor wafers
JPS57192020A (en) Stacking tool for thin plate body
IT1149534B (it) Procedimento per formare una regione di semiconduttore cristallina del gruppo iv su una pellicola isolante
GB2115923B (en) Semiconductor wafer alignment
JPS54134973A (en) Sheet holding jig for semiconductor wafer
JPS57201169A (en) Holder for extremely thin fragile deformable wafer used in grinder
JPS55143026A (en) Device for transferring thin plate
JPS54984A (en) Containing tool for semiconductor wafer
IT1111744B (it) Dispositivo di alimentazione di listelli di wafer negli stampi di colata per la formazione di wafer rivestiti