JPS6229894B2 - - Google Patents
Info
- Publication number
- JPS6229894B2 JPS6229894B2 JP56142530A JP14253081A JPS6229894B2 JP S6229894 B2 JPS6229894 B2 JP S6229894B2 JP 56142530 A JP56142530 A JP 56142530A JP 14253081 A JP14253081 A JP 14253081A JP S6229894 B2 JPS6229894 B2 JP S6229894B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- sink
- semiconductor
- substrate
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14253081A JPS5844726A (ja) | 1981-09-11 | 1981-09-11 | ゲッタリング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14253081A JPS5844726A (ja) | 1981-09-11 | 1981-09-11 | ゲッタリング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5844726A JPS5844726A (ja) | 1983-03-15 |
| JPS6229894B2 true JPS6229894B2 (enExample) | 1987-06-29 |
Family
ID=15317497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14253081A Granted JPS5844726A (ja) | 1981-09-11 | 1981-09-11 | ゲッタリング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5844726A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006261192A (ja) * | 2005-03-15 | 2006-09-28 | Fujitsu Ltd | シリコンウェーハの処理方法及び該方法を実施する装置 |
| JP5365063B2 (ja) * | 2008-05-07 | 2013-12-11 | 株式会社Sumco | シリコンウェーハの製造方法 |
| JP5544734B2 (ja) * | 2009-03-23 | 2014-07-09 | 株式会社Sumco | シリコンウェーハの製造方法、エピタキシャルウェーハの製造方法、および固体撮像素子の製造方法 |
| US9281197B2 (en) | 2008-10-16 | 2016-03-08 | Sumco Corporation | Epitaxial substrate for solid-state imaging device with gettering sink, semiconductor device, back illuminated solid-state imaging device and manufacturing method thereof |
| JP2010098105A (ja) * | 2008-10-16 | 2010-04-30 | Sumco Corp | 固体撮像素子用エピタキシャル基板の製造方法、固体撮像素子用エピタキシャル基板 |
| JP2015115401A (ja) * | 2013-12-10 | 2015-06-22 | 三菱電機株式会社 | レーザアニール方法およびレーザアニール装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825816A (enExample) * | 1971-08-11 | 1973-04-04 | ||
| JPS566432A (en) * | 1979-06-27 | 1981-01-23 | Sony Corp | Treatment of semiconductor substrate |
| JPS5618480A (en) * | 1979-07-23 | 1981-02-21 | Toshiba Corp | Manufacture of display device |
| JPS5618430A (en) * | 1979-07-25 | 1981-02-21 | Fujitsu Ltd | Manufacture of semiconductor element |
| JPH0235457B2 (ja) * | 1980-01-25 | 1990-08-10 | Mitsubishi Electric Corp | Handotaisochinoseizohoho |
-
1981
- 1981-09-11 JP JP14253081A patent/JPS5844726A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5844726A (ja) | 1983-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR870011666A (ko) | 바아 코우드 패턴을 형성시킨 반도체 웨이퍼의 식별방법 및 반도체 장치의 제조방법 | |
| JPS6229894B2 (enExample) | ||
| JPH0731395B2 (ja) | 光マスクとその製造方法 | |
| JPS58170037A (ja) | 配線の切断方法及び切断装置 | |
| JPS6267834A (ja) | レ−ザ処理方法 | |
| JPS61116820A (ja) | 半導体のアニ−ル方法 | |
| JPS59117274A (ja) | 太陽電池の製造方法 | |
| JPS61226916A (ja) | 多結晶またはアモルファスの半導体材料を単結晶半導体材料に転化する方法 | |
| JPS5429573A (en) | Fine machining method of semiconductor | |
| JP2006043717A (ja) | マーキング方法、単結晶炭化ケイ素製部材の製造方法、及び単結晶炭化ケイ素製部材 | |
| JP2890617B2 (ja) | 薄膜の形成方法 | |
| JPS58105579A (ja) | 表面処理方法 | |
| JPS58124289A (ja) | 半導体レ−ザパツケ−ジ | |
| JPH01143274A (ja) | 集積型光発電素子の製造方法 | |
| JPS628011B2 (enExample) | ||
| JPH03253035A (ja) | 半導体ウェハーの裏面歪場形成装置 | |
| JPS6114727A (ja) | 半導体装置の製造方法 | |
| JPH06302531A (ja) | レーザードーピング方法 | |
| JPS6151432B2 (enExample) | ||
| Allcock et al. | CO2 laser induced microcracking of glass and the analysis of ablation products | |
| JP2022128560A (ja) | 半導体チップの製造方法 | |
| JPS638601A (ja) | 反射防止膜付光フアイバ | |
| Krimmel et al. | SELFALIGNED METALLIC CONTACTS ON GaP: N-LEDs PROCESSED BY LASER PULSE IRRADIATION-INDUCED ABLATION | |
| JPH06314807A (ja) | 光起電力装置の製造方法 | |
| JPS61108150A (ja) | 半導体装置の製造方法 |