JPS62214631A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS62214631A
JPS62214631A JP61057438A JP5743886A JPS62214631A JP S62214631 A JPS62214631 A JP S62214631A JP 61057438 A JP61057438 A JP 61057438A JP 5743886 A JP5743886 A JP 5743886A JP S62214631 A JPS62214631 A JP S62214631A
Authority
JP
Japan
Prior art keywords
thermal expansion
integrated circuit
hybrid integrated
metal substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61057438A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0450743B2 (cg-RX-API-DMAC10.html
Inventor
Akira Kazami
風見 明
Yuusuke Igarashi
優助 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP61057438A priority Critical patent/JPS62214631A/ja
Publication of JPS62214631A publication Critical patent/JPS62214631A/ja
Publication of JPH0450743B2 publication Critical patent/JPH0450743B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/724

Landscapes

  • Wire Bonding (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP61057438A 1986-03-14 1986-03-14 混成集積回路 Granted JPS62214631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61057438A JPS62214631A (ja) 1986-03-14 1986-03-14 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61057438A JPS62214631A (ja) 1986-03-14 1986-03-14 混成集積回路

Publications (2)

Publication Number Publication Date
JPS62214631A true JPS62214631A (ja) 1987-09-21
JPH0450743B2 JPH0450743B2 (cg-RX-API-DMAC10.html) 1992-08-17

Family

ID=13055658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61057438A Granted JPS62214631A (ja) 1986-03-14 1986-03-14 混成集積回路

Country Status (1)

Country Link
JP (1) JPS62214631A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01307236A (ja) * 1988-05-26 1989-12-12 Internatl Business Mach Corp <Ibm> 電子デバイス組立体及びその製造方法
JPH02277273A (ja) * 1989-04-18 1990-11-13 Fujitsu Ltd 光検知装置
JPH09148367A (ja) * 1995-11-24 1997-06-06 Nec Corp 半導体集積回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01307236A (ja) * 1988-05-26 1989-12-12 Internatl Business Mach Corp <Ibm> 電子デバイス組立体及びその製造方法
JPH02277273A (ja) * 1989-04-18 1990-11-13 Fujitsu Ltd 光検知装置
JPH09148367A (ja) * 1995-11-24 1997-06-06 Nec Corp 半導体集積回路装置

Also Published As

Publication number Publication date
JPH0450743B2 (cg-RX-API-DMAC10.html) 1992-08-17

Similar Documents

Publication Publication Date Title
US5504372A (en) Adhesively sealed metal electronic package incorporating a multi-chip module
EP0987748A2 (en) Multilayered circuit board for semiconductor chip module, and method of manufacturing the same
JPH0245357B2 (cg-RX-API-DMAC10.html)
JPH0750726B2 (ja) 半導体チップの実装体
JPH09162230A (ja) 電子回路装置及びその製造方法
JPS62214631A (ja) 混成集積回路
JPS622587A (ja) ハイパワ−用混成集積回路
JP3549316B2 (ja) 配線基板
JPS63143A (ja) リ−ドレス部品
JP2722451B2 (ja) 半導体装置
JPH10256428A (ja) 半導体パッケージ
JPS62214632A (ja) 混成集積回路
JP3563170B2 (ja) 半導体装置の製造方法
JPH10256413A (ja) 半導体パッケージ
JPS595977Y2 (ja) 集積回路の塔載装置
JPH10256414A (ja) 半導体パッケージ
JP2652222B2 (ja) 電子部品搭載用基板
JP2705281B2 (ja) 半導体装置の実装構造
JP2000058995A (ja) セラミック回路基板及び半導体モジュール
JPS63122135A (ja) 半導体チツプの電気的接続方法
JPS63250164A (ja) ハイパワ−用混成集積回路基板とその集積回路
JPH04356935A (ja) 半導体装置のバンプ電極形成方法
JPH09266265A (ja) 半導体パッケージ
JP2946361B2 (ja) 電子部品搭載用基板
JPH10125730A (ja) 実装構造体およびその製造方法