JPH0450743B2 - - Google Patents

Info

Publication number
JPH0450743B2
JPH0450743B2 JP61057438A JP5743886A JPH0450743B2 JP H0450743 B2 JPH0450743 B2 JP H0450743B2 JP 61057438 A JP61057438 A JP 61057438A JP 5743886 A JP5743886 A JP 5743886A JP H0450743 B2 JPH0450743 B2 JP H0450743B2
Authority
JP
Japan
Prior art keywords
thermal expansion
coefficient
metal substrate
aluminum
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61057438A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62214631A (ja
Inventor
Akira Kazami
Jusuke Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP61057438A priority Critical patent/JPS62214631A/ja
Publication of JPS62214631A publication Critical patent/JPS62214631A/ja
Publication of JPH0450743B2 publication Critical patent/JPH0450743B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP61057438A 1986-03-14 1986-03-14 混成集積回路 Granted JPS62214631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61057438A JPS62214631A (ja) 1986-03-14 1986-03-14 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61057438A JPS62214631A (ja) 1986-03-14 1986-03-14 混成集積回路

Publications (2)

Publication Number Publication Date
JPS62214631A JPS62214631A (ja) 1987-09-21
JPH0450743B2 true JPH0450743B2 (cg-RX-API-DMAC10.html) 1992-08-17

Family

ID=13055658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61057438A Granted JPS62214631A (ja) 1986-03-14 1986-03-14 混成集積回路

Country Status (1)

Country Link
JP (1) JPS62214631A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937707A (en) * 1988-05-26 1990-06-26 International Business Machines Corporation Flexible carrier for an electronic device
JPH02277273A (ja) * 1989-04-18 1990-11-13 Fujitsu Ltd 光検知装置
JPH09148367A (ja) * 1995-11-24 1997-06-06 Nec Corp 半導体集積回路装置

Also Published As

Publication number Publication date
JPS62214631A (ja) 1987-09-21

Similar Documents

Publication Publication Date Title
US6201292B1 (en) Resin-sealed semiconductor device, circuit member used therefor
JPH10256425A (ja) パッケージ基板およびその製造方法
JP4813794B2 (ja) 半導体素子装置及び半導体素子装置を製造する方法
JP2023519499A (ja) 温度センサアセンブリ及び温度センサアセンブリを製造する方法
JPS60260192A (ja) 混成集積回路の製造方法
JPH06291165A (ja) フリップチップ接続構造
JPH0450743B2 (cg-RX-API-DMAC10.html)
JPH0450744B2 (cg-RX-API-DMAC10.html)
JPH06151913A (ja) 電極形成法
JPH0677631A (ja) チップ部品のアルミ基板への実装方法
JPH10242331A (ja) パワーモジュール用基板及びその製造法
JPH05243287A (ja) 混成集積回路装置およびその製造方法
JP3042682B2 (ja) サーマルヘッド及びサーマルヘッドの製造方法
JPH0322707B2 (cg-RX-API-DMAC10.html)
JPS6016749B2 (ja) 集積回路用パツケ−ジ
JP3562074B2 (ja) 半導体パッケージ用樹脂フレーム及び半導体パッケージの製造方法
JPH06244244A (ja) 半導体装置実装用基板
JP2000306955A (ja) 固体装置接合用シートおよびその製造方法、用途
JP2000058995A (ja) セラミック回路基板及び半導体モジュール
JPH0636601Y2 (ja) 回路基板
JPS5821430B2 (ja) 半導体装置の製造方法
JP3611833B2 (ja) 半導体パッケージ用樹脂フレーム及び半導体パッケージの製造方法
JPH1177559A (ja) ヒータテーブル
JPH11298142A (ja) 多層セラミック基板の実装構造と実装方法
JP3281778B2 (ja) 半導体装置