JPS62205180A - 粘着シ−ト - Google Patents

粘着シ−ト

Info

Publication number
JPS62205180A
JPS62205180A JP61045786A JP4578686A JPS62205180A JP S62205180 A JPS62205180 A JP S62205180A JP 61045786 A JP61045786 A JP 61045786A JP 4578686 A JP4578686 A JP 4578686A JP S62205180 A JPS62205180 A JP S62205180A
Authority
JP
Japan
Prior art keywords
adhesive sheet
adhesive
compound
radiation
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61045786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0214384B2 (enrdf_load_stackoverflow
Inventor
Kazuyoshi Ebe
和義 江部
Hiroaki Narita
博昭 成田
Katsuhisa Taguchi
田口　克久
Yoshitaka Akeda
明田　好孝
Takanori Saito
斉藤　隆則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F S K KK
FSK Corp
Original Assignee
F S K KK
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F S K KK, FSK Corp filed Critical F S K KK
Priority to JP61045786A priority Critical patent/JPS62205180A/ja
Priority to DE19863639266 priority patent/DE3639266A1/de
Priority to US06/932,210 priority patent/US4756968A/en
Priority to PH34523A priority patent/PH23580A/en
Priority to MYPI86000164A priority patent/MY100214A/en
Priority to KR1019860010787A priority patent/KR910007086B1/ko
Priority to FR8618037A priority patent/FR2592390B1/fr
Priority to NL8603269A priority patent/NL191241C/xx
Priority to GB8630956A priority patent/GB2184741B/en
Publication of JPS62205180A publication Critical patent/JPS62205180A/ja
Priority to US07/111,849 priority patent/US4965127A/en
Priority to MYPI89000327A priority patent/MY104709A/en
Priority to GB8916855A priority patent/GB2221468B/en
Priority to GB8916857A priority patent/GB2221470B/en
Priority to GB8916856A priority patent/GB2221469B/en
Publication of JPH0214384B2 publication Critical patent/JPH0214384B2/ja
Priority to US07/549,496 priority patent/US5187007A/en
Priority to SG1145/92A priority patent/SG114592G/en
Priority to SG1143/92A priority patent/SG114392G/en
Priority to SG1146/92A priority patent/SG114692G/en
Priority to SG1144/92A priority patent/SG114492G/en
Priority to HK1055/92A priority patent/HK105592A/xx
Priority to HK1057/92A priority patent/HK105792A/xx
Priority to HK1054/92A priority patent/HK105492A/xx
Priority to HK1056/92A priority patent/HK105692A/xx
Priority to NL9302149A priority patent/NL9302149A/nl
Priority to NL9302148A priority patent/NL9302148A/nl
Priority to NL9302147A priority patent/NL9302147A/nl
Priority to NL9302150A priority patent/NL193617C/nl
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP61045786A 1985-12-27 1986-03-03 粘着シ−ト Granted JPS62205180A (ja)

Priority Applications (27)

Application Number Priority Date Filing Date Title
JP61045786A JPS62205180A (ja) 1986-03-03 1986-03-03 粘着シ−ト
DE19863639266 DE3639266A1 (de) 1985-12-27 1986-11-17 Haftfolie
US06/932,210 US4756968A (en) 1985-12-27 1986-11-18 Adhesive sheets
PH34523A PH23580A (en) 1985-12-27 1986-11-24 Adhesive sheet
MYPI86000164A MY100214A (en) 1985-12-27 1986-12-02 Adhesive sheet
KR1019860010787A KR910007086B1 (ko) 1985-12-27 1986-12-15 점착시이트
FR8618037A FR2592390B1 (fr) 1985-12-27 1986-12-23 Feuille adhesive utilisable notamment pour le decoupage de pastilles semiconductrices sous la forme de microplaquettes
NL8603269A NL191241C (nl) 1985-12-27 1986-12-23 Kleefvel voor halfgeleiders.
GB8630956A GB2184741B (en) 1985-12-27 1986-12-29 Adhesive sheet suitable for use in the preparation of semiconductor chips
US07/111,849 US4965127A (en) 1985-12-27 1987-10-22 Adhesive sheets
MYPI89000327A MY104709A (en) 1985-12-27 1989-05-15 Adhesive sheet.
GB8916856A GB2221469B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
GB8916857A GB2221470B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for semiconductor wafer processing
GB8916855A GB2221468B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
US07/549,496 US5187007A (en) 1985-12-27 1990-06-29 Adhesive sheets
SG1145/92A SG114592G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for semiconductor wafer processing
SG1143/92A SG114392G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
SG1146/92A SG114692G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
SG1144/92A SG114492G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in the preparation of semiconductor chips
HK1056/92A HK105692A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
HK1054/92A HK105492A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for semiconductor wafer processing
HK1055/92A HK105592A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
HK1057/92A HK105792A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in the preparation of semiconductor chips
NL9302149A NL9302149A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302148A NL9302148A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302147A NL9302147A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302150A NL193617C (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61045786A JPS62205180A (ja) 1986-03-03 1986-03-03 粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS62205180A true JPS62205180A (ja) 1987-09-09
JPH0214384B2 JPH0214384B2 (enrdf_load_stackoverflow) 1990-04-06

Family

ID=12728961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61045786A Granted JPS62205180A (ja) 1985-12-27 1986-03-03 粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS62205180A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107681A (ja) * 1988-10-18 1990-04-19 Tomoegawa Paper Co Ltd 光感受性粘着シート
KR100539009B1 (ko) * 1997-08-28 2006-03-20 린텍 가부시키가이샤 에너지선경화형친수성점착제조성물및그이용방법
WO2013042698A1 (ja) * 2011-09-20 2013-03-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品切断方法
JP2016000523A (ja) * 2014-05-22 2016-01-07 大日本印刷株式会社 積層体の製造方法及びそれに用いる接着シート
WO2023145926A1 (ja) * 2022-01-31 2023-08-03 大日本印刷株式会社 半導体加工用粘着テープ
WO2023243510A1 (ja) * 2022-06-15 2023-12-21 日東電工株式会社 可変色粘着シート

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107681A (ja) * 1988-10-18 1990-04-19 Tomoegawa Paper Co Ltd 光感受性粘着シート
KR100539009B1 (ko) * 1997-08-28 2006-03-20 린텍 가부시키가이샤 에너지선경화형친수성점착제조성물및그이용방법
WO2013042698A1 (ja) * 2011-09-20 2013-03-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品切断方法
JPWO2013042698A1 (ja) * 2011-09-20 2015-03-26 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品切断方法
JP2016000523A (ja) * 2014-05-22 2016-01-07 大日本印刷株式会社 積層体の製造方法及びそれに用いる接着シート
WO2023145926A1 (ja) * 2022-01-31 2023-08-03 大日本印刷株式会社 半導体加工用粘着テープ
JP2023111124A (ja) * 2022-01-31 2023-08-10 大日本印刷株式会社 半導体加工用粘着テープ
WO2023243510A1 (ja) * 2022-06-15 2023-12-21 日東電工株式会社 可変色粘着シート

Also Published As

Publication number Publication date
JPH0214384B2 (enrdf_load_stackoverflow) 1990-04-06

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