JPH0224872B2 - - Google Patents

Info

Publication number
JPH0224872B2
JPH0224872B2 JP62037429A JP3742987A JPH0224872B2 JP H0224872 B2 JPH0224872 B2 JP H0224872B2 JP 62037429 A JP62037429 A JP 62037429A JP 3742987 A JP3742987 A JP 3742987A JP H0224872 B2 JPH0224872 B2 JP H0224872B2
Authority
JP
Japan
Prior art keywords
adhesive
wafer
adhesive sheet
adhesive layer
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62037429A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63205383A (ja
Inventor
Kazuyoshi Ebe
Hiroaki Narita
Katsuhisa Taguchi
Yoshitaka Akeda
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP62037429A priority Critical patent/JPS63205383A/ja
Publication of JPS63205383A publication Critical patent/JPS63205383A/ja
Publication of JPH0224872B2 publication Critical patent/JPH0224872B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62037429A 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト Granted JPS63205383A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62037429A JPS63205383A (ja) 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62037429A JPS63205383A (ja) 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS63205383A JPS63205383A (ja) 1988-08-24
JPH0224872B2 true JPH0224872B2 (enrdf_load_stackoverflow) 1990-05-30

Family

ID=12497270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62037429A Granted JPS63205383A (ja) 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS63205383A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001341121A (ja) * 2000-06-02 2001-12-11 Somar Corp 高硬度シート体の切断方法及びそれに用いる粘着シート

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097619B2 (ja) * 1997-10-02 2000-10-10 日本電気株式会社 電界放射冷陰極の製造方法
JP4820113B2 (ja) * 2005-05-20 2011-11-24 電気化学工業株式会社 粘着シート及びその製造方法
JP2007031494A (ja) * 2005-07-22 2007-02-08 Furukawa Electric Co Ltd:The ウエハ貼着用粘着シート
JP2007266557A (ja) * 2006-03-30 2007-10-11 Renesas Technology Corp 半導体装置の製造方法
JP2008028026A (ja) * 2006-07-19 2008-02-07 Nitto Denko Corp ダイシング用粘着テープ又はシート、被加工物のダイシング方法、及び被加工物の切断片のピックアップ方法
JP2010129622A (ja) * 2008-11-26 2010-06-10 Disco Abrasive Syst Ltd ウエーハの加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105463A (en) * 1978-02-06 1979-08-18 Yutaka Hajikano Semiconductor
JPS54105490A (en) * 1978-02-06 1979-08-18 Yutaka Hajikano Method of fabricating display unit
JPS5541745A (en) * 1978-09-18 1980-03-24 Nec Home Electronics Ltd Preparation of semiconductor device
JPS57132967A (en) * 1981-02-06 1982-08-17 Toray Ind Inc Abrasive sheet-like stuff
JPS59118369A (ja) * 1982-12-27 1984-07-09 Toshiba Corp ダイヤフラム製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001341121A (ja) * 2000-06-02 2001-12-11 Somar Corp 高硬度シート体の切断方法及びそれに用いる粘着シート

Also Published As

Publication number Publication date
JPS63205383A (ja) 1988-08-24

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