JPH0224871B2 - - Google Patents

Info

Publication number
JPH0224871B2
JPH0224871B2 JP62037430A JP3743087A JPH0224871B2 JP H0224871 B2 JPH0224871 B2 JP H0224871B2 JP 62037430 A JP62037430 A JP 62037430A JP 3743087 A JP3743087 A JP 3743087A JP H0224871 B2 JPH0224871 B2 JP H0224871B2
Authority
JP
Japan
Prior art keywords
adhesive
wafer
adhesive sheet
radiation
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62037430A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63205382A (ja
Inventor
Kazuyoshi Ebe
Hiroaki Narita
Katsuhisa Taguchi
Yoshitaka Akeda
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP62037430A priority Critical patent/JPS63205382A/ja
Publication of JPS63205382A publication Critical patent/JPS63205382A/ja
Publication of JPH0224871B2 publication Critical patent/JPH0224871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62037430A 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト Granted JPS63205382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62037430A JPS63205382A (ja) 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62037430A JPS63205382A (ja) 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS63205382A JPS63205382A (ja) 1988-08-24
JPH0224871B2 true JPH0224871B2 (enrdf_load_stackoverflow) 1990-05-30

Family

ID=12497297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62037430A Granted JPS63205382A (ja) 1987-02-20 1987-02-20 ウエハ貼着用粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS63205382A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188184A (ja) * 1990-11-21 1992-07-06 Tatsuku Syst Kk 情報等の隠ぺい用ラベル

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028026A (ja) * 2006-07-19 2008-02-07 Nitto Denko Corp ダイシング用粘着テープ又はシート、被加工物のダイシング方法、及び被加工物の切断片のピックアップ方法
JP6578985B2 (ja) * 2016-02-18 2019-09-25 三菱電機株式会社 基板、基板の切断方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105463A (en) * 1978-02-06 1979-08-18 Yutaka Hajikano Semiconductor
JPS54105490A (en) * 1978-02-06 1979-08-18 Yutaka Hajikano Method of fabricating display unit
JPS5541745A (en) * 1978-09-18 1980-03-24 Nec Home Electronics Ltd Preparation of semiconductor device
JPS57132967A (en) * 1981-02-06 1982-08-17 Toray Ind Inc Abrasive sheet-like stuff
JPS59118369A (ja) * 1982-12-27 1984-07-09 Toshiba Corp ダイヤフラム製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188184A (ja) * 1990-11-21 1992-07-06 Tatsuku Syst Kk 情報等の隠ぺい用ラベル

Also Published As

Publication number Publication date
JPS63205382A (ja) 1988-08-24

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