JPH0258306B2 - - Google Patents

Info

Publication number
JPH0258306B2
JPH0258306B2 JP61161680A JP16168086A JPH0258306B2 JP H0258306 B2 JPH0258306 B2 JP H0258306B2 JP 61161680 A JP61161680 A JP 61161680A JP 16168086 A JP16168086 A JP 16168086A JP H0258306 B2 JPH0258306 B2 JP H0258306B2
Authority
JP
Japan
Prior art keywords
adhesive
radiation
wafer
adhesive sheet
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61161680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317980A (ja
Inventor
Kazuyoshi Ebe
Hiroaki Narita
Katsuhisa Taguchi
Yoshitaka Akeda
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP61161680A priority Critical patent/JPS6317980A/ja
Priority to DE19863639266 priority patent/DE3639266A1/de
Priority to US06/932,210 priority patent/US4756968A/en
Priority to PH34523A priority patent/PH23580A/en
Priority to MYPI86000164A priority patent/MY100214A/en
Priority to KR1019860010787A priority patent/KR910007086B1/ko
Priority to FR8618037A priority patent/FR2592390B1/fr
Priority to NL8603269A priority patent/NL191241C/xx
Priority to GB8630956A priority patent/GB2184741B/en
Priority to US07/111,849 priority patent/US4965127A/en
Publication of JPS6317980A publication Critical patent/JPS6317980A/ja
Priority to MYPI89000327A priority patent/MY104709A/en
Priority to GB8916857A priority patent/GB2221470B/en
Priority to GB8916855A priority patent/GB2221468B/en
Priority to GB8916856A priority patent/GB2221469B/en
Priority to US07/549,496 priority patent/US5187007A/en
Publication of JPH0258306B2 publication Critical patent/JPH0258306B2/ja
Priority to SG1145/92A priority patent/SG114592G/en
Priority to SG1144/92A priority patent/SG114492G/en
Priority to SG1143/92A priority patent/SG114392G/en
Priority to SG1146/92A priority patent/SG114692G/en
Priority to HK1054/92A priority patent/HK105492A/xx
Priority to HK1055/92A priority patent/HK105592A/xx
Priority to HK1057/92A priority patent/HK105792A/xx
Priority to HK1056/92A priority patent/HK105692A/xx
Priority to NL9302149A priority patent/NL9302149A/nl
Priority to NL9302148A priority patent/NL9302148A/nl
Priority to NL9302147A priority patent/NL9302147A/nl
Priority to NL9302150A priority patent/NL193617C/nl
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP61161680A 1985-12-27 1986-07-09 ウエハ貼着用粘着シ−ト Granted JPS6317980A (ja)

Priority Applications (27)

Application Number Priority Date Filing Date Title
JP61161680A JPS6317980A (ja) 1986-07-09 1986-07-09 ウエハ貼着用粘着シ−ト
DE19863639266 DE3639266A1 (de) 1985-12-27 1986-11-17 Haftfolie
US06/932,210 US4756968A (en) 1985-12-27 1986-11-18 Adhesive sheets
PH34523A PH23580A (en) 1985-12-27 1986-11-24 Adhesive sheet
MYPI86000164A MY100214A (en) 1985-12-27 1986-12-02 Adhesive sheet
KR1019860010787A KR910007086B1 (ko) 1985-12-27 1986-12-15 점착시이트
FR8618037A FR2592390B1 (fr) 1985-12-27 1986-12-23 Feuille adhesive utilisable notamment pour le decoupage de pastilles semiconductrices sous la forme de microplaquettes
NL8603269A NL191241C (nl) 1985-12-27 1986-12-23 Kleefvel voor halfgeleiders.
GB8630956A GB2184741B (en) 1985-12-27 1986-12-29 Adhesive sheet suitable for use in the preparation of semiconductor chips
US07/111,849 US4965127A (en) 1985-12-27 1987-10-22 Adhesive sheets
MYPI89000327A MY104709A (en) 1985-12-27 1989-05-15 Adhesive sheet.
GB8916856A GB2221469B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
GB8916855A GB2221468B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
GB8916857A GB2221470B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for semiconductor wafer processing
US07/549,496 US5187007A (en) 1985-12-27 1990-06-29 Adhesive sheets
SG1145/92A SG114592G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for semiconductor wafer processing
SG1144/92A SG114492G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in the preparation of semiconductor chips
SG1143/92A SG114392G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
SG1146/92A SG114692G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
HK1056/92A HK105692A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
HK1057/92A HK105792A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in the preparation of semiconductor chips
HK1054/92A HK105492A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for semiconductor wafer processing
HK1055/92A HK105592A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
NL9302149A NL9302149A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302148A NL9302148A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302147A NL9302147A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302150A NL193617C (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61161680A JPS6317980A (ja) 1986-07-09 1986-07-09 ウエハ貼着用粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS6317980A JPS6317980A (ja) 1988-01-25
JPH0258306B2 true JPH0258306B2 (enrdf_load_stackoverflow) 1990-12-07

Family

ID=15739800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61161680A Granted JPS6317980A (ja) 1985-12-27 1986-07-09 ウエハ貼着用粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS6317980A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0298448B1 (en) * 1987-07-08 1994-06-29 The Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JP2618491B2 (ja) * 1989-08-05 1997-06-11 古河電気工業株式会社 放射線硬化性粘着テープ
JPH03221647A (ja) * 1990-01-25 1991-09-30 Matetsukusu:Kk コンクリート構造体の形成方法及びコンクリート構造体
JPH03260246A (ja) * 1990-03-09 1991-11-20 Matetsukusu:Kk 軽量コンクリート成形体の形成方法及び軽量コンクリート成形体
JP2001168064A (ja) * 1999-12-09 2001-06-22 Disco Abrasive Syst Ltd ペレット押上部材及びペレットピックアップ装置
US7951687B2 (en) 2003-04-02 2011-05-31 Polymer Vision Limited Method of manufacturing a flexible electronic device and flexible device
CN114096571B (zh) 2019-06-24 2024-04-30 日本聚乙烯株式会社 膜状成型体用树脂以及由该树脂构成的成型品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991182A (ja) * 1982-11-17 1984-05-25 Nitto Electric Ind Co Ltd 感圧性接着テ−プ類の製造法
JPH0616524B2 (ja) * 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板

Also Published As

Publication number Publication date
JPS6317980A (ja) 1988-01-25

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