JPH0251948B2 - - Google Patents

Info

Publication number
JPH0251948B2
JPH0251948B2 JP62026017A JP2601787A JPH0251948B2 JP H0251948 B2 JPH0251948 B2 JP H0251948B2 JP 62026017 A JP62026017 A JP 62026017A JP 2601787 A JP2601787 A JP 2601787A JP H0251948 B2 JPH0251948 B2 JP H0251948B2
Authority
JP
Japan
Prior art keywords
adhesive
radiation
adhesive layer
wafer
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62026017A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63193981A (ja
Inventor
Kazuyoshi Ebe
Hiroaki Narita
Katsuhisa Taguchi
Yoshitaka Akeda
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP62026017A priority Critical patent/JPS63193981A/ja
Publication of JPS63193981A publication Critical patent/JPS63193981A/ja
Publication of JPH0251948B2 publication Critical patent/JPH0251948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62026017A 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト Granted JPS63193981A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62026017A JPS63193981A (ja) 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62026017A JPS63193981A (ja) 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS63193981A JPS63193981A (ja) 1988-08-11
JPH0251948B2 true JPH0251948B2 (enrdf_load_stackoverflow) 1990-11-09

Family

ID=12181927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62026017A Granted JPS63193981A (ja) 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS63193981A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2661951B2 (ja) * 1988-03-31 1997-10-08 古河電気工業株式会社 放射線硬化性粘着テープ
JP2618491B2 (ja) * 1989-08-05 1997-06-11 古河電気工業株式会社 放射線硬化性粘着テープ
JP3299601B2 (ja) * 1993-07-27 2002-07-08 リンテック株式会社 ウェハ貼着用粘着シート
JP2011077235A (ja) * 2009-09-30 2011-04-14 Nitto Denko Corp 素子保持用粘着シートおよび素子の製造方法
CN115512911B (zh) * 2022-08-23 2025-06-27 湖州耀宁固态电池研究院有限公司 一种方形电池绝缘涂层的喷涂工艺

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750261U (enrdf_load_stackoverflow) * 1980-09-05 1982-03-23

Also Published As

Publication number Publication date
JPS63193981A (ja) 1988-08-11

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