JPS62166553A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS62166553A
JPS62166553A JP61008379A JP837986A JPS62166553A JP S62166553 A JPS62166553 A JP S62166553A JP 61008379 A JP61008379 A JP 61008379A JP 837986 A JP837986 A JP 837986A JP S62166553 A JPS62166553 A JP S62166553A
Authority
JP
Japan
Prior art keywords
resin
oxide film
metal member
semiconductor device
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61008379A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0476504B2 (enExample
Inventor
Sunao Kato
直 加藤
Osamu Nakagawa
治 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61008379A priority Critical patent/JPS62166553A/ja
Publication of JPS62166553A publication Critical patent/JPS62166553A/ja
Publication of JPH0476504B2 publication Critical patent/JPH0476504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/458—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61008379A 1986-01-18 1986-01-18 樹脂封止型半導体装置 Granted JPS62166553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61008379A JPS62166553A (ja) 1986-01-18 1986-01-18 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61008379A JPS62166553A (ja) 1986-01-18 1986-01-18 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS62166553A true JPS62166553A (ja) 1987-07-23
JPH0476504B2 JPH0476504B2 (enExample) 1992-12-03

Family

ID=11691587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61008379A Granted JPS62166553A (ja) 1986-01-18 1986-01-18 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS62166553A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0587966U (ja) * 1992-04-28 1993-11-26 シャープ株式会社 リードフレーム
WO1998042022A1 (en) * 1997-03-18 1998-09-24 Seiko Epson Corporation Semiconductor device and method of manufacturing same
JP2014013931A (ja) * 2013-09-12 2014-01-23 Denso Corp 半導体パッケージ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60201651A (ja) * 1984-03-26 1985-10-12 Hitachi Cable Ltd 半導体用リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60201651A (ja) * 1984-03-26 1985-10-12 Hitachi Cable Ltd 半導体用リ−ドフレ−ム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0587966U (ja) * 1992-04-28 1993-11-26 シャープ株式会社 リードフレーム
WO1998042022A1 (en) * 1997-03-18 1998-09-24 Seiko Epson Corporation Semiconductor device and method of manufacturing same
US6166446A (en) * 1997-03-18 2000-12-26 Seiko Epson Corporation Semiconductor device and fabrication process thereof
JP2014013931A (ja) * 2013-09-12 2014-01-23 Denso Corp 半導体パッケージ

Also Published As

Publication number Publication date
JPH0476504B2 (enExample) 1992-12-03

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